Hardware Integration; Temperature Considerations - IONODES ATOMAS-IOT-DUAL User Manual

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3 Hardware Integration

The ATOMAS-IOT-DUAL has been designed to allow for flexible hardware integration to existing or new
product designs. The ATOMAS-IOT-DUAL proposes three (3) mounting holes for securing to your
enclosure. In addition, a slight clearance around the board's edge can also be used for extrusion-type
enclosures.
When integrating the ATOMAS-IOT-DUAL into a product design, position the module to allow for air
circulation around the board in order to maximize the chances of heat dissipation.
Warning: Be careful not to damage the module when using mounting screws.

4 Temperature Considerations

The ATOMAS-IOT-DUAL has been designed with extended temperature components (-20C to +70C);
however, reaching your temperature requirements may require that you add heatsinks to certain board-
level components which generate substantial heat (the main one being the SoC). The placement of the
SoC is clearly marked in the picture below.
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