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BGT60ATR24C ES shield
XENSIV™ 60 GHz radar system platform
Layout overview
4
Layout overview
4.1
Component side
Layer 1 is the component side. It comprises important elements for the RF performance of the shield.
BGT60ATR24C radar chip
•
TX matching structures
•
RX matching structures
•
Lines to the feed-throughs to the antenna side
•
The matching structures transform BGT60ATR24C's chip impedances at the package side into 50 . The
transmission lines to the feed-throughs correct for phase differences between the channels (see section 5.1) so
that all RX channels and TX channels are in phase at the antenna side.
In order to work correctly, all these RF structures on the component side need a certain distance between the
board and the other objects. Simulation has shown that this distance should be more than 1.8 mm. This is the
reason why the shield should be plugged into the MCU7 board at the side with the higher connectors.
The copper areas between the matching structures and transmission lines, as well as the vias next to them, will
help to increase the isolation between the single RX and TX channels.
The solder mask was removed in all RF relevant areas of the board, as otherwise it would degrade the RF
performance.
RX feed-through
Figure 13
Top layer overview, component side
4.2
Antenna side
The antenna side consists of the six different antennas. The structures between the TX and RX side will increase
the TX to RX isolation. The structures around the single sides prevent radiation in unwanted directions.
There is no solder mask on the antenna side, again in order to improve RF performance.
The single TX and RX antennas are placed in such a way that the board, if MIMO techniques are being used, has
multiple virtual antennas - three for horizontal scanning, and four for vertical scanning. Figure 16 explains the
principle behind this.
Application note
RX matching s tructures
BGT60ATR24C
TX matching structures
10
TX feed-through
Revision 1.10
2023-02-14
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