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BGT60ATR24C ES shield
XENSIV™ 60 GHz radar system platform
Hardware description
3.6
Layer stackup
Since the antennas are integrated on the PCB, the stackup must be chosen carefully. For low loss and enhanced
performance, the stackup shown in Figure 7 is selected. All the vias in Figure 7 are mechanically drilled except
for the blind vias between L1_Top and L2_GND, which are laser drilled.
Note:
IS400 is similar to FR4 material
Figure 7
Layer stackup and via types
3.7
Metal layers overview
Figure 8 through to Figure 12 show the different metal layers of the PCB. Layer 1 comprises SMD components,
the BGT60ATR24C chipset and matching networks. Layer 2 consists of the ground plane for RF structures
situated on Layer 1. Layer 3 consists of signal lines and power planes with the voltage domains required for
BGT60ATR24C and other components. Layer 4 is the ground plane for the antennas that are placed on layer 5.
Figure 8
Layer 1 – RF layer, component side
Application note
8
Revision 1.10
2023-02-14
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