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Summary of Contents for DIGITAL-LOGIC SmartCore Express SMA200
- Page 1 TECHNICAL USER MANUAL FOR: smartCore Express SMA200 Nordstrasse 11/F CH - 4542 Luterbach Tel.: ++41 (0)32 681 58 00 Fax: ++41 (0)32 681 58 01 Email: support@digitallogic.com Homepage: http://www.digitallogic.com...
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Page 2: Revision History
DIGITAL-LOGIC AG For internal use only: File: SMA200_TechManual_V1.0.doc Path: R:\HANDBUCH\smart\SMA200\SMA200_TechManual_V1.0.doc COPYRIGHT © © © © 2008 BY DIGITAL-LOGIC AG This publication is protected by copyright and all rights are reserved. No part of this document may be reproduced, transmitted, transcribed or stored in a retrieval system, in any form or by any means, electronic, mechanical, optical, manual, or otherwise, without the prior written permission of DIGITAL-LOGIC AG. -
Page 3: Table Of Contents
DIGITAL-LOGIC AG Table of Contents ...4 REFACE 1.1. Trademarks ... 4 1.2. Disclaimer ... 4 1.3. Environmental Protection Statement ... 4 1.4. Who should use this Product ... 4 1.5. Recycling Information... 5 1.6. Technical Support ... 5 1.7. Limited Two Year Warranty ... 5 1.8. -
Page 4: Preface
DIGITAL-LOGIC AG 1. P REFACE The information contained in this manual has been carefully checked and is believed to be accurate; it is subject to change without notice. Product advances mean that some specifications may have changed. DIGITAL-LOGIC AG assumes no responsibility for any inaccuracies, or the consequences thereof, that may appear in this manual. -
Page 5: Recycling Information
DIGITAL-LOGIC AG 1.5. Recycling Information All components within this product fulfill the requirements of the RoHS (Restriction of Hazardous Substances Directive). The product is soldered with a lead free process. 1.6. Technical Support 1. Contact your local DIGITAL-LOGIC Technical Support, in your country. 2. -
Page 6: Explanation Of Symbols
DIGITAL-LOGIC AG 1.8. Explanation of Symbols CE Conformity This symbol indicates that the product described in this manual is in compliance with all applied CE standards. Caution, Electric Shock! This symbol and title warn of hazards due to electrical shocks (> 60V) when touching products or parts of them. -
Page 7: Applicable Documents And Standards
Advanced Configuration and Power Interface Specification Revision 2.0c, August 25, 2003 Copyright © 1996-2003 Compaq Computer Corporation, Intel Corporation, Microsoft Corporation, Phoenix Technologies Ltd., Toshiba Corporation. All rights reserved. ANSI/TIA/EIA-644-A-2001: Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits, January 1, 2001. -
Page 8: For Your Safety
Technology Inc., Maxim Integrated Products, Mitsubishi Electric Semiconductor Company, Power- Smart, Inc., Toshiba Battery Co. Ltd., Unitrode Corporation, USAR Systems, Inc. All rights reserved. http://www.smbus.org/ Universal Serial Bus Specification Revision 2.0, April 27, 2000 Copyright © 2000 Compaq Computer Corporation, Hewlett-Packard Company, Intel Corporation, Lucent Technologies Inc., Microsoft Corporation, Corporation, http://www.usb.org/... -
Page 9: Rohs Compatible Product Design
DIGITAL-LOGIC AG RoHS is often referred to as the "lead-free" directive but it restricts the use of the following substances: Lead Mercury Cadmium Chromium VI PBB and PBDE The maximum allowable concentration of any of the above mentioned substances is 0.1% (except for Cadmium, which is limited to 0.01%) by weight of homogeneous material. -
Page 10: Swiss Quality
DIGITAL-LOGIC AG 1.12. Swiss Quality 100% Made in Switzerland DIGITAL-LOGIC is a member of "Swiss-Label" This product was not manufactured by employees earning piecework wages This product was manufactured in humane work conditions All employees who worked on this product are paid customary Swiss market wages and are insured ISO 9000:2001 (quality management system) 1.13. -
Page 11: Overview
DIGITAL-LOGIC AG 2. O VERVIEW 2.1. Standard Features The smartCoreExpress is an electrical and mechanical definition for a COM or Computer on Module (miniaturized PC system), based on Intel's ATOM chip unit incorporating the major elements of a PC compatible computer. Powerful though low consumption ATOM CPU Soldered DDR2 RAM 512k up to 2GByte Single 220pin connectors (Tyco) for the smartCoreExpress BUS... -
Page 12: Technical Specifications
DIGITAL-LOGIC AG 2.2. Technical Specifications CoreDuo / Celeron M Clock Level Cache Level Cache Technology VCCCore @ 1.6GHz VCCCore @ 1.1GHz VCCCore @ deep sleep CPU BUS AGTL+ Termination Mathematics Coprocessor Intel US15W Graphics Memory Controller Hub Memory Controller Supports Socket Technologies Capacity... - Page 13 DIGITAL-LOGIC AG Intel US15W PCIe BUS EIDE BUS SATA BUS USB V2.0 APIC Sound IRQ Controller Timers Power Management Reset & Power Management Controller Power Modes ACPI PCIexpress Power Supply DC Input Inrush Current Standby Power Onboard Voltages Power Consumption Physical Characteristics Dimensions Weight...
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Page 14: Examples Of Ordering Codes
DIGITAL-LOGIC AG Operating Environment Relative Humidity Vibration Shock Operating Temperature Maximum Copper Temperature Storage Temperature EMI / EMC (IEC1131-2 refer MIL 461/462) ESD Electro Static Discharge REF Radiated Electromagnetic Field EFT Electric Fast Transient (Burst) SIR Surge Immunity Requirements High-Frequency Radiation All information is subject to change without notice. -
Page 15: Imensions Iagrams
DIGITAL-LOGIC AG 3. D & D IMENSIONS 3.1. Block Diagram Intel Atom Processor (power supply) Temp. Sensor Power Management Microcontroller IAGRAMS 1 GB DDR2 System Controller Hub US15W Module Connector (220 pin) SMA200 Manual V1.0 Firmware Hub (BIOS) Option SSD 4GB... -
Page 16: Design In With The Smartmodule
DIGITAL-LOGIC AG Design IN with the smartModule Attention! When using an active/passive heatsink that is not from DLAG, be very careful! The maximum depth the screws can go into the product is 3mm or the module will be destroyed! 3.2. Dimensions of the smartCoreExpress Module 3.25 3.25 58.0... -
Page 17: Connector Placement & Pin Definition On The Carrier Board
DIGITAL-LOGIC AG 3.3. Connector Placement & Pin Definition on the Carrier Board View of the Top Side (mounting side) of the smartCoreExpress PCB: d=2.2/D=4.5 3.25 3.25 d=2.2/D=4.5 d=1.0 3.6mm A1 A2 A3 ... smartCoreExpress 44.0mm PCB pad design 58.5mm 50.2mm 57.7mm SMA200 Manual V1.0 B110... -
Page 18: Photo Of The Top Side Of The Pcb
DIGITAL-LOGIC AG SMA200 Manual V1.0 3.4. Photo of the Top Side of the PCB 65mm 58mm Pin 1... -
Page 19: Dimensions Of The Carrier Board Connector
DIGITAL-LOGIC AG 3.5. Dimensions of the Carrier Board Connector SMX-CON8: Standard Height: 5.0mm DLAG Part Nr: 807138 AMP/Tyco: 8-6318491-6 (Components placed below the smartModule should total a maximum of 2.0mm.) 3.6. Component Heights between Module and Carrier Board Parts mounted on the back side of the module (in the space between the bottom surface of the module PCB and the carrier board) should have a maximum height of 8.0mm. -
Page 20: Com-Express Connector Description
DIGITAL-LOGIC AG 4. COM-E XPRESS 4.1. Signal Terminology Descriptions Signal Description Internally implemented pull up resistor Internally implemented pull down resistor I/O 3.3V Bi-directional signal 3.3V tolerant I/O 5V Bi-directional signal 5V tolerant I 3V Input 3.3V tolerant I 5V Input 5V tolerant I/O 3.3VSB Input 3.3V tolerant, active in standby state... -
Page 21: Smartcoreexpress Connector Pinout
DIGITAL-LOGIC AG 4.2. smartCoreExpress Connector Pinout BUS on the smartCoreExpress – Connectors A / B: Pins 1-55 Signal PCIe_TX0_N PCIe PCIe_TX0_P PCIe PCIe_CLK0_N PCIe PCIe_CLK0_P PCIe PCIe_TX1_N PCIe PCIe_TX1_P PCIe PCIe_TX2_N PCIe PCIe_TX2_P PCIe PCIe_CLK2_N PCIe PCIe_CLK2_P PCIe PCIe_TX3_N PCIe PCIe_TX3_P PCIe PCIe_REQ0#... - Page 22 DIGITAL-LOGIC AG BUS on the smartCoreExpress – Connectors A / B: Pins 56-110 Signal SMB_CLK SMB_DAT SMB_ALERT# SATA_LED# IDE_D3 / SATA_Tx0P IDE_A0 / SATA_Tx0N IDE_A2 / SATA_Rx0P IDE_D8 / SATA_Rx0N IDERQ / GND IDE_A1 / SATA_Tx2P IDE_D13 / SATA_Tx2N IDE_D1 / SATA_Rx2P IDE_IRQ / SATA_Rx2N IDE_D11 / PCIE_TX4_N IDE_D5 / PCIE_TX4_N...
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Page 23: Signal Descriptions Of The Smart Core Express
DIGITAL-LOGIC AG SMA200 Manual V1.0 5. S IGNAL ESCRIPTIONS OF THE SMART XPRESS 5.1. Wire Design for Typical Impedances 5.2. Matching of the Differential Pairs... -
Page 24: Placing An Ac Coupling Capacitor On Each Pcie-Tx
DIGITAL-LOGIC AG SMA200 Manual V1.0 5.3. Placing an AC Coupling Capacitor on each PCIe-TX In the smartCoreExpress module, all PCI-TX pairs already include the series AC capacitors. -
Page 25: Smartcoreexpress Signal Groups
DIGITAL-LOGIC AG 5.4. smartCoreExpress Signal Groups 5.4.1. PCI-Express Signal Type Description PCIe_Tx [0-4] +/- PCIe PCIe_Rx [0..4] +/- PCIe PCIe_CLK[0..4] +/- PCIe PCIe_REQ#[0..4] PCIe 3.3V If the signals are not used: All these PCI-Express signals may be left open. Remarks: Pair to Pair spacing: BUS to BUS spacing: The AC coupling capacitors must be placed near the device for the Tx signals only. -
Page 26: Sdvo
DIGITAL-LOGIC AG 5.4.2. SDVO Signal Type SDVO_CTRLCLK SDVO SDVO_CTRLDAT SDVO SDVO_CLK +/- SDVO SDVO_INIT +/- SDVO SDVO_STALL +/- SDVO SDVO_TVCLKIN +/- SDVO SDVO_Red +/- SDVO SDVO_Green +/- SDVO SDVO_Blue +/- SDVO If the signals are not used: All these SDVO signals may be left open. Remarks: For the DDC signals, a voltage translator to 3.3V or 5V is needed. -
Page 27: Lvds
DIGITAL-LOGIC AG 5.4.3. LVDS Signal Type LVDS_DDCCLK LVDS 3.3V DDC signal LVDS_DDCDAT LVDS 3.3V DDC signal LVDS_DATA[0..3] +/- LVDS LVDS_CLK +/- LVDS LVDS_VDDEN LVDS 3.3V LVDS_BKLCTL LVDS 3.3V LVDS_BKLEN LVDS 3.3V LVDS_CTLA_CLK LVDS 3.3V LVDS_CTLB_DATA LVDS 3.3V If the signals are not used: All these LVDS signals may be left open. -
Page 28: Usb
DIGITAL-LOGIC AG 5.4.4. Signal Type Description USB_[0..7] +/- USB_OC[0..7]# 3.3V If the signals are not used: All these USB signals may be left open. Remarks: EMV/EMI-filters: Use a choke and clamping diode on each signal pair. On Module Termination Differential USB data signal pair USB overcurrent signal PU 10k to... -
Page 29: Parallel Ata
DIGITAL-LOGIC AG 5.4.5. Parallel ATA Signal Type Description PATA_D[15..0] CMOS PATA_A[0..2] CMOS PATA_IOR#] CMOS PATA_IOW#] CMOS PATA_DACK#] CMOS PATA_CS[3,1] CMOS PATA_REQ CMOS 3/5V PATA_IORDY CMOS PATA_IRQ CMOS PATA_PCSEL CMOS If the signals are not used: All this PATA signals may be left open. Remarks: EMV/EMI filters: Are not needed. -
Page 30: Lpc Bus
DIGITAL-LOGIC AG 5.4.6. LPC BUS Signal Type LPC_FRAME# CMOS 3.3V LPC_AD[3..0] CMOS 3.3V LPC_SERIRQ CMOS 3.3V LPC_CLKOUT[0..1] CMOS 3.3V If the signals are not used: Leave the pins open. Remarks: Use 33 Ohm series termination in each LPC-CLKx-signal. The LPC_CLKOUTx may drive only 2 loads. EMV/EMI filters: Are not needed. -
Page 31: Smbus
DIGITAL-LOGIC AG 5.4.7. SMBus Signal Type SMB_ALERT# CMOS 3.3V SMB_DATA CMOS 3.3V SMB_CLOCK CMOS 3.3V If the signals are not used: The pins can stay open. Remarks: The SMB_ALERT# may be used to initiate an SMB event over APIC or an SMI. Maximum BUS capacitance is 200pF. -
Page 32: Hda Audio Interface
DIGITAL-LOGIC AG 5.4.8. HDA Audio Interface Signal Type HDA_DOCKEN# CMOS 3.3V HAD_RST# CMOS 3.3V HAD_SYNC CMOS 3.3V HAD_BITCLK CMOS 3.3V HAD_SDATAin [1..0] CMOS 3.3V HAD_SDATAout CMOS 3.3V HAD_DOCKRST# CMOS 3.3V If the signals are not used: Remarks: The 33 Ohm series termination should be placed directly next to the codecs. Supported Codecs: EMV/EMI filters: Are not needed. -
Page 33: Sd / Sdio Interface
DIGITAL-LOGIC AG 5.4.9. SD / SDIO Interface Signal Type SD0_CD# CMOS 3.3V SD0_CLK CMOS 3.3V SD0_CMD# CMOS 3.3V SD_Data [3..0] CMOS 3.3V SD0_LED CMOS 3.3V SD0_PWR# CMOS SD0_WP CMOS If the signals are not used: Remarks: EMV/EMI filters: Are not needed. On Module Description Termination... -
Page 34: Spi Bus
DIGITAL-LOGIC AG 5.4.10. SPI BUS Signal Type Description SPI_MISO CMOS 3.3V Connect to the SPI device. SPI_MOSI CMOS 3.3V Connect to the SPI device. SPI_CLK CMOS 3.3V Connect to the SPI device. f = 17.86 and 31.25MHz SPI_CS# CMOS 3.3V Connect to the SPI device. -
Page 35: Sata Interface (Option)
DIGITAL-LOGIC AG 5.4.11. SATA Interface (Option) Signal Type SATA_Tx[0..3] SATA SATA_Rx[0..3] SATA If the signals are not used: Unused SATA interfaces may be open. Remarks: The 10nF capacitors 0402 need to be placed directly at the SATA connector. Maximum via count is 2 per signal. BUS to BUS spacing is min. -
Page 36: Glan
DIGITAL-LOGIC AG 5.4.12. GLAN Signal Type Description GLAN_TX +/- GLAN GLAN_RX +/- GLAN GLAN-CLK +/- GLAN LCI_TXD[2..0] LCI 3.3V LCI_RXD[2..0] LCI 3.3V LCI_RST 3.3V If the signals are not used: Unused GLAN /LCI interfaces may be open. Remarks: The 10nF capacitors 0402 need to be placed directly at the SATA connector. Maximum via count is 2 per signal. -
Page 37: Can / Serial
DIGITAL-LOGIC AG 5.4.13. CAN / Serial Signal Type Description CAN_TX CMOS 3.3V CAN_RX CMOS 3.3V If the signals are not used: Unused interfaces may be open. Remarks: EMV/EMI filters: Are not needed. On Module Termination Serial output. Res. Serial input. Res. - Page 38 DIGITAL-LOGIC AG 5.4.14. PM Signal Type WAKE# CMOS 3.3V WD_OUT CMOS 3.3V SUS_S3# CMOS 3.3V SUS_S4&5# CMOS 3.3V GPIO[3..0] CMOS 3.3V RST_IN# CMOS 3.3V RST_OUT# CMOS 3.3V Power-Good CMOS 3.3V PS_ON CMOS 3.3V PWRBTN# CMOS 3.3V BIOS_Disable# CMOS 3.3V A20M# CMOS 3.3V Speaker...
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Page 39: Supply
DIGITAL-LOGIC AG 5.4.15. Supply Signal Type +5Volt +5V Always VCCRTC On Module Description Termination 5V power supply input. Switched with the sus4signal 5V Always available. RTC supply 3.0-3.6Volt. Connect to a lithium battery, using a 1k series resistor. SMA200 Manual V1.0 Ext. -
Page 40: Connector Specifications
DIGITAL-LOGIC AG SMART The connector type is equal to the COMexpress connector. This is a 220pin, surface-mounted connector with 0.5mm pitch. Parameter Material Electrical Mechanical The manufacturer of the connector is: Source on smartCore Carrier Board Connector TYCO / AMP smartCoreExpress Module Connector TYCO / AMP The stack height may be defined on the carrier board as either 5 or 8mm using the two different connector... -
Page 41: Smart Core -Express Versus Com Express
DIGITAL-LOGIC AG SMART The smartCoreExpress supports small footprints and especially mobile applications. It is powered by the modern Intel Atom CPU technology. To select the correct module, this chapter compares the different PCIe-based module concepts. All concepts allow minimum (required) and maximum (optional) features. The following table summarizes the features of all PCIe COMs. -
Page 42: D Imensions & D Iagrams
DIGITAL-LOGIC AG 8. I NDEX AC Coupling Capacitor... 24 Block Diagram... 15 BUS... 13 COM-Express Connector Description ... 20 COM-Express Connector Pinout ... 21 COMexpress Connector Specifications... 40, 41 Connector Placement... 17 Coprocessor... 12, 13 Design IN ... 16 Dimensions Carrier Board Connector ...
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