Thermal Test Method; Components Used For Testing - Intel Thin Mini-ITX System Design Manual

Reference System Layouts
7.3

Thermal Test Method

This section describes the thermal test method used by Intel to validate All In One and
Tiny PC enclosures based on Thin Mini ITX boards. Intel can provide this testing along
with limited design guidance to suppliers. Please contact your local representative for
further information.
7.3.1

Components Used for Testing

In order to keep test results standardized and consistent, Intel will use the following
components in an LGA processor based system for thermal testing:

Environmental test chamber capable of providing still air (no high turbulence) ambient
air at 35C as measured "upstream" of the unit under test

Appropriate equipment for measuring and logging relevant test data.

Main board for Socketed CPU based systems – Intel DH61AG (Apple Glen)

Mainboard for Atom CPU based systems – DN2800MT (Marshall Town)

SO-DIMM memory – Crucial, 2 x 2GB (4 chips per side)*

O.S. – Win 7, 64 bit for socketed CPU based systems.

O.S. – Win 7, 32 bit for Atom CPU based systems.

Thermal Solution – Intel HTS1155LP (for socketed CPU based systems)

Include (spindle drive) HDD Form Factor applicable to chassis design

Include optical drive where applicable
Thin Mini-ITX Based PC System Design Guide

-400 or newer with Revision 31 or newer BIOS

CPU – Sandy Bridge operating at 65W under power stress with Tcontrol = 80C

-800 or newer with Revision 152 or newer BIOS

(CT25664BC1067-M8SFA)*
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