Related Manuals for Intel Thin Mini-ITX
Summary of Contents for Intel Thin Mini-ITX
- Page 1 Thin Mini-ITX Based PC System Design Guide All In One, Tiny PC December 2012 Revision 1.2...
- Page 2 Intel may make changes to its specifications, release dates and product descriptions at any time, without notice. The Thin Mini-ITX Based PC System Design Guide may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
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Page 3: Table Of Contents
All In One PCs ................9 1.2.2 Tiny PCs .................. 10 Terminology ..................11 Reference Documents ................12 Thin Mini-ITX Internal Electrical Interfaces ............13 Common Connector List ................13 Flat Panel Display .................. 14 2.2.1 LVDS ..................14 2.2.2 eDP (VESA Embedded Display Port™) ......... - Page 4 Temperature Measurement Locations .......... 67 Figures Figure 1-1. Thin Mini-ITX Applications ..............9 Figure 1-2. Mini-ITX (left) vs Thin Mini-ITX (right) ..........11 Figure 2-1. 40-pin LVDS Header ................ 15 Figure 2-2. 40-pin eDP MB Header ..............17 Figure 2-3. PC & Software Brightness Control: ............ 19 Figure 2-4.
- Page 5 Figure 7-9. Core Component Layout – Example H (Effective Single Blower Option) .. 64 Figure 7-10. Power Thermal Utility Example ............66 Tables Table 1-1. Common AIO Features in Thin Mini-ITX Based AIO PCs ......10 Table 1-2. Terms and Descriptions ..............11 Table 1-3. Reference Documents ............... 12 Table 2-1.
- Page 6 Thin Mini-ITX Based PC System Design Guide...
- Page 7 Section 2.2.1 LVDS Section 7.4 SATA Section 2.5 USB Section 2.6 Front Panel Section 2.7 Internal Power Input Section 3 Power Supply Initial release April 2012 § Thin Mini-ITX Based PC System Design Guide...
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Page 8: Introduction
Introduction Purpose / Scope This document outlines possible solutions to creating a system utilizing a Thin Mini-ITX motherboard, as specified in the Mini-ITX Addendum To The microATX Motherboard Interface Specification Version 1.2. It will focus on the electrical, mechanical and... -
Page 9: All In One Pcs
Leveraging the common interfaces in this design guide enables a building block approach to AIO systems. Common design features on Thin Mini-ITX based AIO PCs can include the following: Thin Mini-ITX Based PC System Design Guide... -
Page 10: Tiny Pcs
The Mini-ITX form factor enabled chassis down to the 4 – 8 liter range. Standard chassis built around Thin Mini-ITX motherboards may shrink to below 4 liters, creating a “Tiny PC” category. Tiny PCs include slimmer designs that make especially good use of the lower height inherent to Thin Mini-ITX motherboards. -
Page 11: Terminology
Introduction Figure 1-2. Mini-ITX (left) vs Thin Mini-ITX (right) Terminology Table 1-2. Terms and Descriptions Term Description All In One Fan Speed Control Keep In Zone Keep Out Zone 8-19 liter chassis (IDC definition) Tiny PC Sub-4 liter chassis Ultra SFF (uSFF) -
Page 12: Reference Documents
VESA standard mounting www.vesa.org/Standards/summary/2006_2.h Standard Panel Working Group, Rev 3.5 www.spwg.org/specifications.htm PC form factors web site www.formfactors.org/developer/specs Channel AIO (Thin Mini-ITX Form Factor) – www.intel.com/go/AIO Compatibility Matrix Wi-Fi Multi-Band Antenna Integration for 491058 Intel® Processor-based Desktops and All-in- One Systems Document numbers and locations are subject to revision and may change. -
Page 13: Thin Mini-Itx Internal Electrical Interfaces
It is expected that a group of motherboard connectors will exit the system via the Thin Mini-ITX I/O aperture per industry standards. An example set of external I/O that could be found on a Thin Mini-ITX motherboard is: DC Input ... -
Page 14: Flat Panel Display
LVDS to dual-channel LVDS at up to 24bpp. The Thin Mini-ITX board supports the internal display connectors outlined in the section. The display signal cables must ship as part of the chassis kit. -
Page 15: Figure 2-1. 40-Pin Lvds Header
ODD_Lane2_P LCD_GND ODD_Lane2_N LCD_GND ODD_Lane1_P LCD_GND ODD_Lane1_N ODD_CLK_P ODD_Lane0_P ODD_CLK_N ODD_Lane0_N BKLT_GND EVEN_Lane3_P BKLT_GND EVEN_Lane3_N BKLT_GND EVEN_Lane2_P EDID_CLK EVEN_Lane2_N BKLT_ENABLE EVEN_Lane1_P BKLT_PWM_DIM EVEN_Lane1_N EVEN_CLK_P EVEN_Lane0_P EVEN_CLK_N EVEN_Lane0_N BKLT_PWR EDID_GND BKLT_PWR LCD_VCC BKLT_PWR LCD_VCC Thin Mini-ITX Based PC System Design Guide... - Page 16 (128-byte EDID data, or at a minimum 18-byte DTD structure) and inverter/driver board datasheet to Intel as early as possible for Intel to confirm (and if necessary, disseminate across board vendors) the necessary display support.
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Page 17: Edp (Vesa Embedded Display Port™)
Please consult with Intel for further implementation guidance. -
Page 18: Table 2-3. 40-Pin Edp Header Pin-Out
Lane1_P (DDPD_[1]P) BKLT_GND High-speed_GND BKLT_GND Lane0_N (DDPD_[0]N) BKLT_ENABLE Lane0_P (DDPD_[0]P) BKLT_PWM_DIM High-speed_GND NC_Reserved AUX_CH_P (DDPD_AUXP) NC_Reserved AUX_CH_N (DDPD_AUXN) BKLT_PWR (12V/19V) High-speed_GND BKLT_PWR (12V/19V) LCD_VCC (3.3V/5V/12V) BKLT_PWR (12V/19V) LCD_VCC (3.3V/5V/12V) BKLT_PWR (12V/19V) LCD_VCC (3.3V/5V/12V) NC_Reserved Thin Mini-ITX Based PC System Design Guide... -
Page 19: Flat Panel Display Brightness
Figure 2-3. PC & Software Brightness Control: Figure 2-4. FPD Brightness Header Table 2-4. 8-pin FPD Brightness Header Pin-Out Signal Name Description BKLT_EN Backlight enable BKLT_PWM Backlight control BKLT_PWR Backlight inverter power Thin Mini-ITX Based PC System Design Guide... -
Page 20: On Screen Display (Osd)
It is recommended that an OSD status utility be available by the motherboard vendor so that a status bar may be shown whenever the brightness increase/decrease buttons are pressed. Thin Mini-ITX Based PC System Design Guide... -
Page 21: Audio
Microphone power / additional MIC input for stereo microphone support PRESENCE# Active low signal that signals BIOS that an Intel® HD Audio dongle is connected to the analog header. PRESENCE# = 0 when an Intel® HD Audio dongle is connected. -
Page 22: Internal Stereo Speakers
PORT 1R Analog Port 1 - Right channel (Microphone) PRESENCE# Active low signal that signals BIOS that an Intel® HD Audio dongle is connected to the analog header. PRESENCE# = 0 when an Intel® HD Audio dongle is connected. PORT 2R... -
Page 23: Digital Microphone
DMIC MB Header: 1x5, 2.54mm pitch, keyed at pin 5. The header and the mating DMIC cable connector shall be yellow. Figure 2-7. DMIC MB Header Table 2-8. DMIC Header Pin-Out Signal Name +3.3V DMIC_DATA DMIC_CLK Key (no pin) Thin Mini-ITX Based PC System Design Guide... -
Page 24: Sata
Figure 2-8. 2x5 USB 2.0 Header (Keyed at Pin 9) Table 2-9. 2x5 USB 2.0 Header (Keyed at Pin 9) Pin-Out Signal Signal +5V DC +5V DC Data (negative) Data (negative) Data (positive) Data (positive) Thin Mini-ITX Based PC System Design Guide... -
Page 25: Internal Dual Usb 2.0 Header
Table 2-10. 2x5 USB 2.0 Header (Keyed at Pins 9 and 10) Pin-Out Signal Signal +5V DC +5V DC Data (negative) Data (negative) Data (positive) Data (positive) Ground Ground Key (no pin) Key (no pin) Thin Mini-ITX Based PC System Design Guide... -
Page 26: Internal Single Usb 2.0 Header
Key (no pin) 2.5.4 Internal USB 3.0 Header Internal USB 3.0 header shall be 2x10, 2.54mm pitch, keyed at pin 20. Color should be Pantone 300 blue. Figure 2-11. 2x10 USB 3.0 Header Thin Mini-ITX Based PC System Design Guide... -
Page 27: Table 2-12. 2X10 Usb 3.0 Header Pin-Out
USB3 ICC Port2 SuperSpeed Tx+ 15 IntA_P2_SSTX- USB3 ICC Port2 SuperSpeed Tx- 16 GND Ground 17 IntA_P2_SSRX+ USB3 ICC Port2 SuperSpeed Rx+ 18 IntA_P2_SSRX- USB3 ICC Port2 SuperSpeed Rx- 19 Vbus Power 20 Key Not Connected Thin Mini-ITX Based PC System Design Guide... -
Page 28: Front Panel (Buttons, Leds)
2.5.4.1 Internal USB 3.0 Header Orientation Typical internal USB 3.0 cable connectors exceed the 20mm Thin Mini-ITX component height limitation. In order to facilitate a common design of lower profile right angle connectors suitable for AIO applications, the orientation of the internal USB 3.0 header must be standardized. -
Page 29: Internal Power Input
19V internal power input connector: 1x2 shrouded with latch, 9[A] minimum current rating (part number reference: Molex* 5566-2, or equivalent) Mating plug reference part number: Molex 5557-02R, or equivalent See chapter 4 for additional information on power. Figure 2-14. Internal Power Header Thin Mini-ITX Based PC System Design Guide... -
Page 30: Table 2-14. Internal Power Header Pin-Out
Thin Mini-ITX Internal Electrical Interfaces Table 2-14. Internal Power Header Pin-Out Signal Ground Vin: +19V DC Thin Mini-ITX Based PC System Design Guide... -
Page 31: Fans
The motherboard ODM is responsible for providing a mechanism to enable the end user to specify the applicable implementation. The motherboard design must default to a 3-pin/wire implementation System fan header: 1.5A continuous current draw Thin Mini-ITX Based PC System Design Guide... -
Page 32: Consumer Infrared Receiver
(if available), or other related functionality. Connector must be 1x2 railed, 2.54mm pitch and colored white. Figure 2-17. Monitor Switch Header Thin Mini-ITX Based PC System Design Guide... -
Page 33: Table 2-15. Monitor Switch Header Pin-Out
Therefore, when the monitor switch button is momentarily pressed, MON_SW# sends a signal to the BIOS which causes the BKLT_OFF# signal to toggle states (default is BKLT_OFF# inactive, for backlight on). BKLT_OFF# output consequently allows the panel’s backlight unit to be switched off/on. Thin Mini-ITX Based PC System Design Guide... -
Page 34: Power Supply
Power Supply External AC Adapter An external AC adapter is envisioned for operation of a Thin Mini-ITX based AIO system. The output of the adapter is dependent on the overall power of the system as determined from the desired feature set. The external AC adapter output will vary from approximately 100W to an Atom based system to over 200W for a 65W feature rich system design. -
Page 35: Figure 3-1. External Power Connector For Socketed Cpu Based Systems
Power Supply Figure 3-1. External Power Connector for Socketed CPU Based Systems Thin Mini-ITX Based PC System Design Guide... -
Page 36: Thermals & Acoustics
Maximize overall system venting area. Position intake and exit vent areas immediately upstream/downstream of the CPU heatsink appropriately to reduce the occurrence of recirculation of hot exhaust air back into the system. Thin Mini-ITX Based PC System Design Guide... -
Page 37: Blowers
The voltage regulator can have a temperature sensor circuit that is present to detect whether the voltage regulator is operating above its intended maximum temperature limits. The Intel microprocessor is designed to receive a signal from the voltage regulator (VR_HOT#) that will cause the CPU to start reducing its operating frequency to reduce the power output of the voltage regulator in order to reduce the thermal heat dissipation occurring in the voltage regulator. -
Page 38: Figure 4-1. Example Of Voltage Regulator Induced Throttling
DTS = -1. This is because the CPU die is not the component that is over temp. Figure 4-2. Example of a Typical CPU DTS Readout When Not Throttling Thin Mini-ITX Based PC System Design Guide... -
Page 39: Figure 4-3. Cpu Die Temperature Induced Throttling
Link the CPU fan to the CPU temperature. Design the voltage regulator for zero or minimal air flow. Maximize copper flooding in the voltage regulator region to spread out the heat load as much as possible Thin Mini-ITX Based PC System Design Guide... -
Page 40: Vent Free Area Ratio
Motherboard Component Cooling 4.3.1 Memory Cooling Stacked SO-DIMM memory is used in this design guide because this is the only memory configuration that can meet the height limitations for this form factor and Thin Mini-ITX Based PC System Design Guide... -
Page 41: Platform Controller Hub (Pch) Cooling
The location of the PCH may vary from board to board. Therefore, system airflow should be designed to take that variability into account. But it is recommended that motherboard designers follow the same core layout as the Intel reference design to mitigate this effort. -
Page 42: Acoustics
The microphone is placed 0.5 meter from the front edge of the Tiny PC chassis. A keyboard is placed 0.25 meter from the microphone. The microphone is placed 1.2 meter above the test floor. Figure 4-5. ECMA-74 Extract – Figure C.4c Thin Mini-ITX Based PC System Design Guide... -
Page 43: Figure 4-6. Ecma-74 Extract - Figure C.4D
Thermals & Acoustics Figure 4-6. ECMA-74 Extract – Figure C.4d Figure 4-7. ECMA-74 Extract – Figure C.4a Thin Mini-ITX Based PC System Design Guide... -
Page 44: Mechanical
Version 1.2. Supporting these requirements helps ensure compatibility between chassis, motherboards, and standardized Thin Mini-ITX thermal solutions such as Intel’s reference thermal solution in Chapter 6. (Note: this does not apply to Atom based boards.) Figure 5-1. CPU Location and Additional Keep In Zones... -
Page 45: Internal Motherboard Header Locations
Supporting these locations allows headers to be in predictable areas so that chassis cables may be optimized for length and routing, and to improve the integration of different combinations of motherboards and chassis with each other. Figure 5-2. Header Zones Thin Mini-ITX Based PC System Design Guide... -
Page 46: System Cables And Connectors
Mini-ITX compatible chassis. These solutions include Intel’s HTS1155LP described in Chapter 6, and compatible solutions from other vendors which are designed to the “Specification for Heat Pipe based Thermal Solutions for Thin Mini-ITX Based PCs”. The motherboard must support the fan requirements referred in Section 0 and the mechanical requirements described in Section 5.1. -
Page 47: Figure 5-3. Blower And Heat Exchanger Retention Locations For Two Blower
Figure 5-3. Blower and Heat Exchanger Retention Locations for Two Blower Configuration Option 1... -
Page 48: Figure 5-4. Blower And Heat Exchanger Retention Locations For Two Blower Configuration Option 2
Mechanical Figure 5-4. Blower and Heat Exchanger Retention Locations for Two Blower Configuration Option 2 Thin Mini-ITX Based PC System Design Guide... -
Page 49: Figure 5-5. Blower And Heat Exchanger Retention Locations For A Single Blower
Mechanical Figure 5-5. Blower and Heat Exchanger Retention Locations for a Single Blower Configuration (NOTE: two different orientations simultaneously shown) Thin Mini-ITX Based PC System Design Guide... -
Page 50: Thin Mini-Itx I/O Shield
I/O patterns. The below figure is an example of a Thin Mini-ITX I/O shield that would ship with a Thin Mini-ITX motherboard. Thin Mini-ITX Based PC System Design Guide... -
Page 51: Industrial Design, System Layout, And Usability Considerations
Mechanical Figure 5-7. Example Thin Mini-ITX I/O Shield Industrial Design, System Layout, and Usability Considerations Areas to consider in general system design for ease of integration, serviceability, and overall system mechanical performance include: Screws are generally better than snaps for retaining external chassis panels that must be removed for system access. -
Page 52: Aio Specific System Mechanicals
A data sheet of the flat panel display or a single page insert with the flat panel display settings should be included in the box so integrators can easily configure motherboard jumpers and BIOS settings. Thin Mini-ITX Based PC System Design Guide... -
Page 53: Low Profile Reference Heat Pipe Thermal Solution
ATX Specification Version 2.2. This is required to be mechanically compatible with the Thin Mini-ITX reference thermal solution. The Intel low profile Thin Mini-ITX thermal solution was designed to function within a chassis whose top and bottom surfaces are in plane with the top and bottom surfaces of the CPU thermal solution heatsink fin array (26mm tall). -
Page 54: Figure 6-1. Reference Side And Top View Dimensions For Low Profile Reference Thermal Solution
Low Profile Reference Heat Pipe Thermal Solution Figure 6-1. Reference Side and Top View Dimensions for Low Profile Reference Thermal Solution Figure 6-2. Reference Blower Mounting Flange Standoff Height as Measured from the Bottom of the Flange Thin Mini-ITX Based PC System Design Guide... -
Page 55: Reference System Layouts
Reference System Layouts Thin Mini ITX Based System Design Intel has identified several general core component (MB and thermal solution) layouts for both All In One and Tiny PC system designs that can meet the thermal requirements. The Intel reference thermal solution described in Section 6 was designed to allow a high degree of flexibility in component layout while maintaining a building block system design approach. -
Page 56: Reference Core Components Layouts
The following examples are based on a 65W CPU system and the reference thermal solution design described in Chapter 6. No layout guidance is provided for Intel Atom processor based systems because they are fundamentally easier to cool and often require only a single system blower. -
Page 57: Figure 7-2. Core Component Layout - Example B
Reference System Layouts Figure 7-2. Core Component Layout – Example B Thin Mini-ITX Based PC System Design Guide... -
Page 58: Figure 7-3. Core Component Layout - Example C
Reference System Layouts Figure 7-3. Core Component Layout – Example C Thin Mini-ITX Based PC System Design Guide... -
Page 59: Figure 7-4. Core Component Layout - Example D
Reference System Layouts Figure 7-4. Core Component Layout – Example D Thin Mini-ITX Based PC System Design Guide... -
Page 60: Figure 7-5. Core Component Layout - Example E
Reference System Layouts Figure 7-5. Core Component Layout – Example E Thin Mini-ITX Based PC System Design Guide... -
Page 61: Figure 7-6. Core Component Layout - Example F
Reference System Layouts Figure 7-6. Core Component Layout – Example F Thin Mini-ITX Based PC System Design Guide... -
Page 62: Figure 7-7. Core Component Layout - Example G (Effective Single Blower Option)
Reference System Layouts Figure 7-7. Core Component Layout – Example G (Effective Single Blower Option) Thin Mini-ITX Based PC System Design Guide... -
Page 63: Figure 7-8. Core Component Layout - Example H (Effective Single Blower Option)
Figure 7-8. Core Component Layout – Example H (Effective Single Blower Option) Use inlet air transition duct with flow splitting geometry. Most air enters the entire heatsink. Remaining air fills the chassis. (Inlet air shroud not shown.) Thin Mini-ITX Based PC System Design Guide... -
Page 64: Figure 7-9. Core Component Layout - Example H (Effective Single Blower Option)
Reference System Layouts Figure 7-9. Core Component Layout – Example H (Effective Single Blower Option) Add inlet air shroud to isolate cooling entering air from system air to minimize chassis inlet air T_rise. Thin Mini-ITX Based PC System Design Guide... -
Page 65: Thermal Test Method
Reference System Layouts Thermal Test Method This section describes the thermal test method used by Intel to validate All In One and Tiny PC enclosures based on Thin Mini ITX boards. Intel can provide this testing along with limited design guidance to suppliers. Please contact your local representative for further information. -
Page 66: Stress Software
7.3.2 Stress Software Intel uses the Power Thermal Utility software program for the applicable CPU family to thermally stress the system. Two extreme usage cases are considered: CPU stress and memory stress. CPU power dissipation is monitored to check for voltage regulator overheating induced CPU power throttling. -
Page 67: Temperature Measurement Locations
The air temperature entering both sides of the CPU blower and a DRAM chip from the top and bottom side of each bank of SO-DIMM is measured using thermocouples. Intel’s motherboards have various system component temperature sensors. The highest of the CPU DTS sensor values, the PCH die sensor, memory sensor, Hard Disk Drive sensor, and the voltage regulator board temperature sensor values are recorded during testing.