Low Profile Reference Heat Pipe Thermal Solution; General Volumetrics / Requirements; Reference Design Cpu Thermal Solution - Intel Thin Mini-ITX System Design Manual

Low Profile Reference Heat Pipe Thermal Solution

6 Low Profile Reference Heat
Pipe Thermal Solution
The thermal solution described in this chapter supports the thin chassis that are
possible with Thin Mini-ITX motherboards. The thermal solution is standardized as are
the CPU socket location and keep in zones (see Figure 5-1) so that they may be relied
on as interchangeable building block components.
6.1

General Volumetrics / Requirements

 Design chassis for 0.25 inch high motherboard backside standoff height as defined
in the ATX Specification Version 2.2. This is required to be mechanically compatible
with the Thin Mini-ITX reference thermal solution.
 The Intel low profile Thin Mini-ITX thermal solution was designed to function within
a chassis whose top and bottom surfaces are in plane with the top and bottom
surfaces of the CPU thermal solution heatsink fin array (26mm tall).
6.2

Reference Design CPU Thermal Solution

The Intel reference design in this section has a retail product name of HTS1155LP, and
a development project name of DHA-E. It is intended to be installable in more than
one orientation on the motherboard and even allow the fan blower to be installed at
either end of the heat exchanger. This thermal solution was sized to conform to the
maximum height limit constraints defined in the Mini-ITX Addendum Version 2.0 To
the microATX Motherboard Interface Specification Version 1.2. Contact your Intel
technical sales representative for further information on how to obtain detailed design
collaterals beyond what is documented below or for component sourcing information.
Thin Mini-ITX Based PC System Design Guide 53