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Processor Support
Single AMD TR Pro Zen2/Zen3 Series Processors in SP3 socket
Note: 7003 series processor drop-in support requires BIOS version 2.0 or newer.
Chipset
ASPEED A2600 BMC/IPMI management controller with enhanced security System on Chip (SoC)
BIOS
AMI 256Mb SPI Flash ROM
Memory (per node)
Supports up to 2TB of ECC DDR4 3200MHz RDIMM/LRDIMM/3DS/NVDIMM memory in eight slots
Note: See the memory section in Chapter 3 for details and our website for updates to supported memory
GPU Support (per node)
Maximum GPU support: three double-width GPUs, five FL single-width GPUs (with upgrade kit), or six HL single-width GPUs
(with upgrade kit).
Drive Bays (per node)
Two 2.5" hot-swap hard drive carriers for NVMe drives
PCI Expansion Slots (per node)
One PCIe 4.0 x8 AIOM/ OCP3.0 slot
M.2 Interface: 2 PCIe 4.0 x4
M.2 Form Factor: 2280, 22110
M.2 Key: M-key
Motherboard (per node)
H12SSG-ANP6; 9.6"" (L) x 14.5"" (W) (243.8 x 368.3 mm)
Chassis
CSE-227GTS-R2K63P; 2U rackmount, 17.6 (W) x 3.5 (H) x 29.9 (D) in. (447 x 88 x 760 mm)
System Cooling
Four hot-swap 80-mm, counter-rotating PWM fans; one CPU air shroud, one CPU heatsink per one node
Power Supply
Model PWS-2K63A-1R; 80Plus Platinum level
Total Output Power: 2600W with Input 200-240Vac
Power and Input: 2600W with Input 200-240Vdc (for CQC only)
+12V
Max: 216A / Min: 0A (200-240 Vac)
+12vsb
Max: 4.5A / Min: 0A
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 60º C (-40º to 140º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)
Appendix B
System Specifications
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Appendix B: System Specifications
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