Quectel SC200K Series Instruction Manual
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Quectel SC200K Series Instruction Manual

Quectel SC200K Series Instruction Manual

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SC200K Series
Hardware Design
Smart Module Series
Version: 1.0
Date: 2022-02-21
Status: Released

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Summary of Contents for Quectel SC200K Series

  • Page 1 SC200K Series Hardware Design Smart Module Series Version: 1.0 Date: 2022-02-21 Status: Released...
  • Page 2 Smart Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...
  • Page 3 Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Smart Module Series About the Document Revision History Version Date Author Description Kevin SU/ 2022-01-05 Creation of the document Jerry WANG Kevin SU/ 2022-02-21 First official release Jerry WANG SC200K_Series_Hardware_Design 4 / 105...

  • Page 6: Table Of Contents

    Smart Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................8 Figure Index ............................... 10 Introduction ............................12 Product Overview ..........................13 2.1. Frequency Bands and Functions .................... 13 2.2. Key Features ........................... 14 2.3.
  • Page 7 Smart Module Series 4.12.1. Reference Design for Microphone Interfaces ............66 4.12.2. Reference Design for Earpiece Interface ............... 67 4.12.3. Reference Circuit Design for Headset Interface ............. 68 4.12.4. Reference Circuit Design for Loudspeaker Interface ..........68 4.12.5. Audio Signal Design Considerations ..............69 4.13.
  • Page 8 Smart Module Series 8.3. Packaging Specifications ......................98 8.3.1. Carrier Tape ......................98 8.3.2. Plastic Reel ......................99 8.3.3. Packaging Process ....................100 Appendix References ........................101 SC200K_Series_Hardware_Design 7 / 105...
  • Page 9 Smart Module Series Table Index Table 1: Brief Introduction of the Module ....................13 Table 2: Supported Frequency Bands and GNSS Functions ..............13 Table 3: Key Features ..........................14 Table 4: I/O Parameters Definition ......................19 Table 5: Pin Description ..........................19 Table 6: Pin Definition of Charging Interface .....................
  • Page 10 Smart Module Series Table 42: SC200K-CE Power Consumption ....................88 Table 43: Electrostatics Discharge Characteristics (Temperature: 25 ° C, Humidity: 45 %) ...... 90 Table 44: Operating and Storage Temperatures ..................91 Table 45:Recommended Thermal Profile Parameters ................98 Table 46: Carrier Tape Dimension Table (Unit: mm) .................. 99 Table 47: Plastic Reel Dimension Table (Unit: mm) ...................
  • Page 11 Smart Module Series Figure Index Figure 1: Functional Diagram ........................17 Figure 2: Pin Assignment (Top View) ......................18 Figure 3: Schematic Diagram of Connection Between Battery and Module ..........34 Figure 4: Reference Design of Power Supply .................... 35 Figure 5: Power Supply Voltage Drop Example ..................
  • Page 12 Smart Module Series Figure 43: Module Top and Side Dimensions (Unit: mm) ................92 Figure 44: Module Bottom Dimensions (Unit: mm) ..................93 Figure 45: Recommended Footprint (Top View) ..................94 Figure 46: Top & Bottom Views of Module ....................95 Figure 47: Recommended Reflow Soldering Thermal Profile ..............

  • Page 13: Introduction

    Smart Module Series Introduction This document defines SC200K series module and describes its air interfaces and hardware interfaces which relate to customers’ applications. It can help you quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module. Associated with application notes and user guides, you can use this module to design and to set up mobile applications easily.

  • Page 14: Product Overview

    Smart Module Series Product Overview SC200K series is a series of Smart LTE modules based on Android operating system, and provides industrial grade performance. It supports multiple audio and video codecs, built-in high performance GE8322 graphics processing unit and multiple audio and video input/output interfaces as well as abundant GPIO interfaces.

  • Page 15: Key Features

    Smart Module Series GSM/EDGE EGSM900/DCS1800 GPS: 1575.42 ± 1.023 MHz GPS: 1575.42 ± 1.023 MHz GNSS GLONASS: 1597.5–1605.8 MHz GLONASS: 1597.5–1605.8 MHz BDS: 1561.098 ± 2.046 MHz BDS: 1561.098 ± 2.046 MHz 2402–2482 MHz 2402–2482 MHz Wi-Fi 802.11a/b/g/n/ac 5180–5825 MHz 5180–5825 MHz Bluetooth 5.0 2402–2480 MHz...
  • Page 16 Smart Module Series ⚫ Supports uplink QPSK, 16QAM and 64QAM modulation ⚫ Supports downlink QPSK, 16QAM, 64QAM and 256QAM modulation ⚫ LTE-FDD: Max. 150 Mbps (DL)/ 50 Mbps (UL) ⚫ LTE-TDD: Max. 130 Mbps (DL)/ 30 Mbps (UL) ⚫ Supports 3GPP R9 DC-HSDPA/DC-HSUPA/HSPA+/HSDPA/ HSUPA/WCDMA ⚫...
  • Page 17 Smart Module Series ⚫ AMR-NB, AMR-WB, EVS-NB, EVS-WB, EVS-SWB, MP3, AAC, AAC+, AMR, Audio Codec ⚫ Two (U)SIM interfaces ⚫ (U)SIM Interfaces Supports (U)SIM card: 1.8 V, 2.95 V ⚫ Supports Dual SIM Dual Standby (supported by software by default) ⚫...

  • Page 18: Functional Diagram

    Smart Module Series ⚫ RoHS All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. ⚫ Power management ⚫ Baseband ⚫ LPDDR4X + eMMC flash ⚫...

  • Page 19: Pin Assignment

    Smart Module Series 2.4. Pin Assignment The following figure illustrates the pin assignment of the module. VBAT_BB GPIO_55 VBAT_BB GPIO_123 GPIO_28 MIC1_P GPIO_52 MIC1_M GPIO_54 MIC2_P GPIO_35 GPIO_132 EAR_P GPIO_133 GPIO_130 EAR_M GPIO_131 SPK_P GPIO_156 SPK_M GPIO_122 GPIO_155 USB1_DM GPIO_154 USB1_DP VOL_DOWN VOL_UP...

  • Page 20: Pin Description

    Smart Module Series 2.5. Pin Description The following table shows the DC characteristics and pin descriptions of the module. Table 4: I/O Parameters Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Power Input/Output...
  • Page 21 Smart Module Series to peripheral devices. Keeps ON. 1.8 V output A bypass capacitor I/O power supply for Vnom = 1.80 V should be added when VDDCAMIO peripherals, such as max = 200 mA using the pin. sensor, camera For more details, see document [1].
  • Page 22 Smart Module Series 221, 222, 223, 224, 226, 227, 228, 229, 230, 231, 233, 234, 235, 236, 237, 238, 240, 241, 243, 244, 245, 247, 248, 250, 251, 255, 256, 258, 259, 261, 266, 268, 269, 271, 272, 273, 274 Audio Interfaces Pin Name Description...
  • Page 23 Smart Module Series If unused, keep it VOL_UP Volume up open. 1.85 V power domain. If unused, keep it max = 0.48 V open. min = 1.39 V Cannot pull it down VOL_DOWN Volume down when turning on the module. 1.85 V power domain.
  • Page 24 Smart Module Series open. (U)SIM Interfaces Pin Name Description Comment Characteristics 1.8 V (U)SIM: Either 1.8 V or 2.95 V Vmax = 1.85 V (U)SIM card is (U)SIM2 card power Vmin = 1.75 V USIM2_VDD supported and can be supply 2.95 V (U)SIM: identified automatically Vmax = 3.1 V...
  • Page 25 Smart Module Series Vmax = 3.1 V by the module. Vmin = 2.90 V max = 0.3 × USIM1_VDD min = 0.7 × USIM1_VDD USIM1_DATA (U)SIM1 card data max = 0.1 × USIM1_VDD min = 0.9 × USIM1_VDD max = 0.1 ×...
  • Page 26 Smart Module Series min = 1.46 V max = 0.48 V UART0_RXD UART0 receive min = 1.39 V max = 0.48 V UART0_CTS DCE clear to send min = 1.39 V max = 0.20 V UART0_RTS DCE request to send min = 1.46 V max = 0.20 V UART2_TXD...
  • Page 27 Smart Module Series Pin Name Description Comment Characteristics max = 0.48 V TP_INT TP interrupt 1.85 V power domain. min = 1.39 V max = 0.20 V 1.85 V power domain. TP_RST TP reset min = 1.46 V Active low. 1.85 V power domain.
  • Page 28 Smart Module Series MIPI clock 0 of CSI0 CSI0_CLK0_N camera (-) MIPI clock 0 of CSI0 CSI0_CLK0_P camera (+) MIPI lane 0 data of CSI0_LN0_N CSI0 camera (-) MIPI lane 0 data of CSI0_LN0_P CSI0 camera (+) MIPI lane 1 data of CSI0_LN1_N CSI0 camera (-) MIPI lane 1 data of...
  • Page 29 Smart Module Series MCAM_MCLK Clock of camera MCAM_RST Reset of camera Power down of MCAM_PWDN camera max = 0.20 V 1.85 V power domain. min = 1.46 V SCAM_MCLK Clock of camera SCAM_RST Reset of camera Power down of SCAM_PWDN camera 1.85 V power domain.
  • Page 30 Smart Module Series By connecting this pin to the ground, the CHG_SEL Charging select internal charger IC is turned off. Input range: 0–1.2 V. BAT_ID Battery type detect If unused, keep it open. Up to 4.5 V input VBAT_SNS Battery voltage detect voltage.
  • Page 31 Smart Module Series turn-on. A TVS component should be reserved between the module and interface for ESD protection. GNSS LNA enable max = 0.20 V Only used to enbale GNSS_LNA_EN control min = 1.46 V external GNSS LNA. GPIO interfaces Pin Name Description Comment...
  • Page 32 Smart Module Series General-purpose GPIO_132 input/output General-purpose GPIO_133 input/output General-purpose GPIO_35 input/output General-purpose GPIO_54 input/output General-purpose GPIO_52 input/output General-purpose GPIO_28 input/output General-purpose GPIO_123 input/output General-purpose GPIO_55 input/output General-purpose GPIO_90 input/output General-purpose GPIO_91 input/output General-purpose GPIO_92 input/output General-purpose GPIO_93 input/output General-purpose GPIO_94 input/output General-purpose...

  • Page 33: Evb

    For more details about GPIO configuration, see document [2]. 2.6. EVB To help you develop applications with the module conveniently, Quectel supplies an evaluation board (EVB), a USB data cable, an earphone, antennas and other peripherals to control or to test the module.

  • Page 34: Operating Characteristics

    Smart Module Series Operating Characteristics 3.1. Power Supply 3.1.1. Power Supply Interface The module provides four VBAT pins for connecting with an external power supply. The two VBAT_BB pins are used for the baseband part of the module. The two VBAT_RF pins are used for the RF part of the module.
  • Page 35 Smart Module Series Supports 10 kΩ NTC thermistor by default. Connects to the NTC thermistor when used. BAT_THERM Battery temperature detect If it is not used, it must be connected to the ground with an external 10 kΩ resistor. If fuel gauge is not used, connect CS_M Battery current detect (-) these pins to the ground.

  • Page 36: Reference Design For Power Supply

    Smart Module Series The module supports current sensing fuel gauge by default, and conducts current sampling through a 20 mΩ sampling resistor R2. 3.1.3. Reference Design for Power Supply The power design is very important for the performance of the module. The power supply of the module should be able to provide sufficient current of 3 A at least.
  • Page 37 Smart Module Series Module input current 3.8 V Voltage Figure 5: Power Supply Voltage Drop Example To prevent the voltage from dropping below 3.25 V, it is recommended to connect a 100 µF tantalum capacitor with low ESR (ESR = 0.7 Ω) as well as 100 nF, 33 pF, and 10 pF filter capacitors in parallel near VBAT_BB and VBAT_RF pins of the module.

  • Page 38: Turn On

    Smart Module Series 3.2. Turn On 3.2.1. Turn On Module with PWRKEY Table 7: Pin Definition of PWRKEY Pin Name Pin No. Description Comment Turn on/off the Active low. PWRKEY module Pulled up to VBAT internally. The module can be turned on by driving PWRKEY low for at least 2.5 s after VBAT is powered on. PWRKEY is pulled up to VBAT internally.

  • Page 39: Turn On Module Automatically Through Cbl_Pwr_N

    Smart Module Series The turn-on timing is illustrated in the following figure. VBAT (Typ. 3.8 V) Note 1 PWRKEY > 2.5 s 607.4 ms VDD1V85 400 μs VDD28 Software Controlled > 1 s VDDCAMIO VDDCAMA 55 s Others ACTIVE Figure 9: Turn-on Timing NOTE Make sure that VBAT is stable before pulling down the PWRKEY pin.

  • Page 40: Turn Off

    Smart Module Series The module can power on automatically through CBL_PWR_N pin. Reference circuit is shown as below. CBL_PWR_N SC200K Series Figure 10: Reference Circuit of Automatic Turn-on NOTE If the module turns on automatically through CBL_PWR_N pin, it cannot be turned off manually. In such case, it can be turned off only by cutting off the power supply of system.

  • Page 41: Vrtc

    Smart Module Series 3.4. VRTC The RTC of the module can be powered by an internal power supply VBAT_BK. When VBAT is disconnected and you need to save RTC, VBAT_BK pin cannot be kept open. The pin can be powered by connecting with an external batter.
  • Page 42 Smart Module Series VDD28 Keeps ON VDDCAMD VDDCAMA VDDSD VDDSDIO USIM1_VDD 1.8/2.95 USIM2_VDD 1.8/2.95 SC200K_Series_Hardware_Design 41 / 105...

  • Page 43: Application Interfaces

    Smart Module Series Application Interfaces 4.1. USB Interfaces The module provides two USB interfaces. USB1 interface: ⚫ Compliant with USB 2.0 specification, with transmission rate up to 480 Mbps ⚫ Supports USB OTG, Type-C ⚫ Supports host and device modes ⚫...
  • Page 44 Smart Module Series expansion is supported. USB_CC1 USB1 Type-C detect 1 USB_CC2 USB1 Type-C detect 2 High level by default. USB_ID USB1 ID detect If unused, keep it open. NOTE If USB1 and USB2 connect to external slave device, an external power supply should be added. VBAT AW3605DNR 1.0 μH...
  • Page 45 Smart Module Series VBAT 1.0 μH AW3605DNR VO UT VOUT μF μF VBAT GPIO_XX VBUS USB_VBUS USB1_DM USB_DM USB_DP USB1_DP USB_ID USB_ID 100 nF ESD ESD ESD Module Figure 14: Reference Design of USB1 Micro Interface VBAT 1.0 μH AW3605DNR VOUT VOUT μF...

  • Page 46: Uart Interfaces

    Smart Module Series To ensure USB performance, please follow the following principles while designing USB interface. ⚫ Route the USB signal traces as differential pairs with total grounding. The impedance of USB differential traces is 90 Ω. ⚫ ESD protection devices should be reserved at USB interfaces. Typically, the parasitic capacitance of ESD protection devices should be less than 2 pF for USB 2.0.
  • Page 47 Smart Module Series Table 12: Pin Definition of UART Interfaces Pin Name Pin No. Description Comment 1.85 V power domain. If unused, keep it open. DBG_TXD Debug UART transmit Dot not pull DBG_TXD down when turning on the module. DBG_RXD Debug UART receive UART0_TXD UART0 transmit...

  • Page 48: U)Sim Interfaces

    Smart Module Series 1.85 V 3.3 V VCCA VCCB TXD_3.3V UART0_TXD TXD_1.85V DIN1 DOUT1 RTS_3.3V UART0_RTS RTS_1.85V DIN2 DOUT2 DIN3 DOUT3 DIN4 DOUT4 DIN5 DOUT5 R1OUTB UART0_RXD RXD_1.85V RXD_3.3V ROUT1 RIN1 ROUT2 CTS_1.85V RIN2 UART0_CTS CTS_3.3V ROUT3 RIN3 FORCEON /INVALID 3.3 V /FORCEOFF Module...
  • Page 49 Smart Module Series default. Either 1.8 V or 2.95 V (U)SIM card is supported and can be USIM1_VDD (U)SIM1 card power supply identified automatically by the module. USIM1_DATA (U)SIM1 card data USIM1_CLK (U)SIM1 card clock USIM1_RST (U)SIM1 card reset Active low. (U)SIM1 card hot-plug If unused, keep it open.
  • Page 50 Smart Module Series (U)SIM Connector 1 μF USIM _ VDD 22 R USIM _ RST USIM _ CLK USIM _ DET 22 R USIM _ DATA 22 R Module 33 pF 33 pF 33 pF Figure 19: Reference Circuit of (U)SIM Interfaces with 6-Pin (U)SIM Card Connector To ensure the reliability and availability of the (U)SIM card in applications, follow the criteria below in the (U)SIM circuit design: ⚫...

  • Page 51: Sd Card Interface

    Smart Module Series 4.4. SD Card Interface The SD card interface of the module supports SD 3.0 specifications. The pin definition of the interface is shown below. Table 14: Pin Definition of SD Card Interface Pin Name Pin No. Description Comment It is suggested to add an LDO with output current of 1 A if an...
  • Page 52 Smart Module Series VDDSD is the power supply for SD card. The maximum drive current is 400 mA. Because of the large drive current, it is recommended that the trace width is 0.5 mm or above. To ensure the stability of drive power, add 4.7 μF and 33 pF capacitors in parallel near the SD card connector.

  • Page 53: Gpio Interfaces

    Smart Module Series 4.5. GPIO Interfaces The module has abundant GPIO interfaces with a power domain of 1.85 V. The pin definition is listed below. Table 16: Pin Definition of GPIOs Pin Name Pin No. DC Characteristic Description GPIO_122 GPIO_156 GPIO_154 GPIO_155 GPIO_38...
  • Page 54 Smart Module Series GPIO_52 GPIO_28 GPIO_123 GPIO_55 GPIO_90 GPIO_91 GPIO_92 GPIO_93 GPIO_94 GPIO_95 GPIO_96 GPIO_7 GPIO_8 GPIO_17 GPIO_18 GPIO_30 GPIO_16 GPIO_15 GPIO_25 GPIO_26 NOTE For details of GPIO configuration, see document [2]. For external inputs with hardware mechanical jitter, such as keypad, etc., select GPIOs that can be multiplexed into EXTINT functions.

  • Page 55: I2C Interfaces

    Smart Module Series 4.6. I2C Interfaces The module provides four I2C interfaces. All I2C interfaces are open drain outputs with configurable pull-up resistors inside the module. No external pull-up resistor is needed. The reference power domain for the interfaces is 1.85 V. Table 17: Pin Definition of I2C Interfaces Pin Name Pin No.

  • Page 56: Lcm Interface

    Smart Module Series 4.8. LCM Interface The module provides an LCM interface, which is MIPI_DSI standard compliant. The interface supports 4 data lanes for high-speed differential data transmission. The data rate is up to 1.5 Gbps/lane. The interface supports FHD+ (2160 × 1080) @ 60 fps. The pin definition of the LCM interface is shown below. Table 19: Pin Definition of LCM Interface Pin Name Pin No.
  • Page 57 Smart Module Series The following figures show the reference design for LCM interface. VDD28 VDDCAMIO LEDA LCM _ LED+ LCM _LED- LEDK LCD_TE LPTE RESET LCD_RST LCD_ID GPIO_XX NC (SDA-TP) NC (SCL-TP) NC (RST-TP) 4.7 μF 1 μF 100 nF 100 nF NC (EINT-TP) VIO18...

  • Page 58: Touch Panel Interface

    Smart Module Series VBAT LCM_LED+ Backlight LCM_LED- Driver 2.2 μF Module Figure 22: Reference Cicuit for LCM External Backlight Driver 4.9. Touch Panel Interface The module provides one I2C interface for connection with Touch Panel (TP), and provides the corresponding power supply and interrupt pins. The pin definition of touch panel interface is illustrated below.

  • Page 59: Camera Interfaces

    Smart Module Series A reference design for touch panel interface is shown below. VDDCAMIO VDDCAMMOT SDA 1.8 V TP_I2C_SDA TP_I2C_SCL SCL 1.8 V RESET 1.8 V TP_RST INT 1.8 V TP_INT VDD 2.8 V 4.7 μF 100 nF Module Figure 23: Reference Circuit Design for Touch Panel Interface 4.10.
  • Page 60 Smart Module Series camera (+) MIPI lane 3 data of CSI0 CSI0_LN3_N camera (-) MIPI lane 3 data of CSI0 CSI0_LN3_P camera (+) MIPI lane 2 data of CSI0 CSI0_LN2_N camera (-) MIPI lane 2 data of CSI0 CSI0_LN2_P camera (+) MIPI clock 1 of CSI0 camera CSI0_CLK1_N MIPI clock 1 of CSI0 camera...
  • Page 61 Smart Module Series 1.85 V power domain. CAM_I2C_SCL I2C clock of camera Integrates 1.8/20 kΩ configurable pull-up CAM_I2C_SDA I2C data of camera resistors. DCAM_MCLK Clock of camera DCAM_RST Reset of camera 1.85 V power domain. DCAM_PWDN Power down of camera 1.85 V power domain.
  • Page 62 Smart Module Series The following is a reference circuit design for dual-camera applications. VDD28 VDDCAMA VDDCAMD AF_VDD VDDCAMIO AVDD DVDD MCAM_RST MCAM_PWDN DOVDD MCAM_MCLK CAM_I2C_SDA CAM_I2C_SCL CSI1_CLK_P CSI1_CLK_N CSI1_LN0_P CSI1_LN0_N CSI1_ LN1 _P CSI1_LN1_N CSI1_ LN2 _P CSI1_LN2_N CSI1_ LN3 _P CSI1_LN3_N VDD28 VDDCAMA...
  • Page 63 Smart Module Series The following is a reference circuit design for three-camera applications. AF_VDD VDD28 AVDD VDDCAMA DVDD External VBAT DOVDD VDDCAMIO MCAM_RST MCAM_PWDN MCAM_MCLK CAM_I2C_SDA CAM_I2C_SCL CSI1_LN3_P CSI1_LN3_N CSI1_LN2_P CSI1_LN2_N CSI1_LN1_P CSI1_LN1_N CSI1_LN0_P CSI1_LN0_N 4.7 μF CSI1_CLK_P 1.0 μF CSI1_CLK_N 4.7 μF SCAM_RST...

  • Page 64: Mipi Design Considerations

    Smart Module Series 4.10.1. MIPI Design Considerations ⚫ Special attention should be paid to the pin definition of LCM and camera interfaces. Different video devices will have varied definitions for their corresponding connectors. Ensure that the devices and the connectors are correctly connected. ⚫...
  • Page 65 Smart Module Series CSI0_CLK0_P 19.92 CSI0_LN0_N 19.38 0.22 CSI0_LN0_P 19.60 CSI0_LN1_N 19.60 0.22 CSI0_LN1_P 19.38 CSI0_LN2_N 24.78 0.49 CSI0_LN2_P 25.27 CSI0_LN3_N 24.77 0.49 CSI0_LN3_P 25.26 CSI0_CLK1_N 14.83 0.54 CSI0_CLK1_P 14.29 CSI1_CLK_N 25.84 CSI1_CLK_P 26.14 CSI1_LN0_N 18.06 0.37 CSI1_LN0_P 17.69 CSI1_LN1_N 19.44 0.47 CSI1_LN1_P...

  • Page 66: Sensor Interface

    Smart Module Series 4.11. Sensor Interface The module supports communication with sensors via I2C interface, and supports various sensors such as accelerometer sensor, gyroscope sensor, compass, light sensor, temperature sensor, pressure sensor etc. Table 23: Pin Definition of Sensor Interface Pin Name Pin No.

  • Page 67: Reference Design For Microphone Interfaces

    Smart Module Series HPH_L Headphone left channel output HS_DET Headset hot-plug detect High level by default. Bias voltage output for MIC_BIAS microphone MIC3_P Auxiliary microphone input (+) MIC3_M Auxiliary microphone input (-) ⚫ The module offers three input channels, including two differential channels and one single-ended channel.

  • Page 68: Reference Design For Earpiece Interface

    Smart Module Series MIC3_P MIC_P MIC_N MIC3_M ECM MIC Module Figure 27: Reference Circuit Design for Auxiliary Microphone 4.12.2. Reference Design for Earpiece Interface 33 pF EAR_P 100 pF EAR_M 33 pF Module Figure 28: Reference Design for Earpiece Interface SC200K_Series_Hardware_Design 67 / 105...

  • Page 69: Reference Circuit Design For Headset Interface

    Smart Module Series 4.12.3. Reference Circuit Design for Headset Interface MIC2_P HPH_L HS_DET HPH_R HPH_GND D1 D2 D3 D4 33 pF 33 pF 33 pF Module Figure 29: Reference Circuit Design for Headset Interface 4.12.4. Reference Circuit Design for Loudspeaker Interface SPK_P EARP SPK_M...

  • Page 70: Audio Signal Design Considerations

    Smart Module Series 4.12.5. Audio Signal Design Considerations For handheld handset and hands-free microphone, it is recommended to use the electret microphone with dual built-in capacitors (e.g. 10 pF and 33 pF) for filtering out RF interference, thus reducing coupling TDD noise.
  • Page 71 Smart Module Series USB_BOOT Module Figure 31: Reference Circuit Design for Download Interface NOTE The firmware upgrade of the module must be realized by driving USB_BOOT down. SC200K_Series_Hardware_Design 70 / 105...

  • Page 72: Rf Characteristics

    Smart Module Series RF Characteristics 5.1. GNSS The module integrates advanced high-speed engine which supports multiple positioning and navigation systems including GPS, GLONASS, BDS. With an embedded LNA, the positioning accuracy of the module has been significantly improved. 5.1.1. Antenna Interface & Frequency Bands Table 26: Pin Definition of GNSS Antenna Interface Pin Name Pin No.

  • Page 73: Reference Design

    Smart Module Series Tracking -163 Cold start TTFF Warm start Hot start ≤ 2.5 Accuracy CEP-50 NOTE Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously). Reacquisition sensitivity: the minimum GNSS signal power required for the module to maintain lock within 3 minutes after loss of lock.

  • Page 74: Reference Circuit Design For Gnss Active Antenna

    Smart Module Series 5.1.3.2. Reference Circuit Design for GNSS Active Antenna The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Despite its low power consumption, the active antenna still requires stable and clean power supplies.

  • Page 75: Cellular Network

    Smart Module Series 5.2. Cellular Network 5.2.1. Antenna Interfaces & Frequency Bands Table 29: Pin Definition of Cellular Antenna Interfaces Pin Name Pin No. Description Comment ANT_MAIN Main antenna interface 50 Ω impedance. ANT_DRX Diversity antenna interface Table 30: SC200K-CE Operating Frequency 3GPP bands Transmit (MHz) Receive (MHz)

  • Page 76: Tx Power

    Smart Module Series 5.2.2. Tx Power Table 31: SC200K-CE RF Output Power Frequency Bands Max. RF Output Power Min. RF Output Power EGSM900 33 dBm ± 2 dB 5 dBm ± 5 dB DCS1800 30 dBm ± 2 dB 0 dBm ± 5 dB WCDMA B1 23 dBm ±...

  • Page 77: Reference Design

    Smart Module Series DCS1800 -108 -102.4 WCDMA B1 -110 -110 -111 -106.7 WCDMA B8 -110 -110 -111 -103.7 LTE-FDD B1 (10 MHz) -101 -96.3 LTE-FDD B3 (10 MHz) -98.8 -99.2 -102 -93.3 LTE-FDD B5 (10 MHz) -99.5 -101.5 -94.3 LTE-FDD B8 (10 MHz) -99.8 -100 -102...

  • Page 78: Wi-Fi/Bluetooth

    Smart Module Series Main Module Antenna 0 Ω ANT_MAIN Diversity Antenna 0 Ω ANT_DRX Figure 34: Reference Circuit Design for Cellular Antennas NOTE To improve the receiving sensitivity, the distance between main antenna and diversity antenna should be appropriate. 5.3. Wi-Fi/Bluetooth 5.3.1.

  • Page 79: Wi-Fi

    Smart Module Series Table 34: Wi-Fi/Bluetooth Frequency Type Frequency Bands Unit Wi-Fi (2.4 GHz) 2402–2482 Wi-Fi (5 GHz) 5180–5825 Bluetooth 5.0 2402–2480 5.3.2. Wi-Fi The module supports 2.4 GHz/5 GHz dual-band WLAN wireless communication based on Wi-Fi 802.11a/b/g/n/ac standard protocols. The maximum data rate is up to 150 Mbps in 2.4 GHz bands, and 433 Mbps in 5 GHz bands.
  • Page 80 Smart Module Series 802.11n HT20 MCS7 13 dBm ± 2.5 dB 802.11a 6 Mbps 14 dBm ± 2.5 dB 802.11a 54 Mbps 13 dBm ± 2.5 dB 802.11n HT20 MCS0 13 dBm ± 2.5 dB 802.11n HT20 MCS7 13 dBm ± 2.5 dB 802.11n HT40 MCS0 15 dBm ±...

  • Page 81: Bluetooth

    Smart Module Series 802.11n HT20 MCS7 -69 dBm 802.11n HT40 MCS0 -86 dBm 802.11n HT40 MCS7 -66 dBm 802.11ac VHT20 MCS0 -90 dBm 802.11ac VHT20 MCS8 -68 dBm 802.11ac VHT40 MCS0 -90 dBm 802.11ac VHT40 MCS9 -66 dBm 802.11ac VHT80 MCS0 -85 dBm 802.11ac VHT80...

  • Page 82: Bluetooth Performance

    Smart Module Series ⚫ Bluetooth Radio Frequency TSS and TP Specification 1.2/2.0/2.0 + EDR/2.1/2.1+ EDR/3.0/3.0 + HS, August 6, 2009 ⚫ Bluetooth Low Energy RF PHY Test Specification, RF-PHY.TS/4.0.0, December 15, 2009 ⚫ Bluetooth 5.0 RF-PHY Cover Standard: RF-PHY.TS.5.0.0, December 06, 2016 5.3.3.1.

  • Page 83: Rf Routing Guidelines

    Smart Module Series 5.4. RF Routing Guidelines For user’s PCB, the characteristic impedance of all RF traces should be controlled to 50 Ω. The impedance of the RF traces is usually determined by the trace width (W), the materials’ dielectric constant, the height from the reference ground to the signal layer (H), and the spacing between RF traces and grounds (S).
  • Page 84 Smart Module Series Figure 38: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 39: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫...

  • Page 85: Antenna Design Requirements

    Smart Module Series For more details about RF layout, see document [4]. 5.5. Antenna Design Requirements Requirements for antenna design are as follow: Table 39: Antenna Requirements Type Requirements Frequency range: 1559–1609 MHz Polarization Type: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: >...

  • Page 86: Rf Connector Recommendation

    Smart Module Series 5.6. RF Connector Recommendation If RF connector is used for antenna connection, it is recommended to use U.FL-R-SMT connector provided by Hirose. Figure 40: Dimensions of U.FL-R-SMT Connector (Unit: mm) U.FL-LP serial connectors listed in the following figure can be used to match the U.FL-R-SMT. Figure 41: Mechanicals of U.FL-LP Connectors SC200K_Series_Hardware_Design 85 / 105...
  • Page 87 Smart Module Series The following figure describes the space factor of mated connector. Figure 42: Space Factor of Mated Connector (Unit: mm) Please visit http://www.hirose.com for more information. SC200K_Series_Hardware_Design 86 / 105...

  • Page 88: Electrical Charastics And Reliability

    Smart Module Series Electrical Charastics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 40: Absolute Maximum Ratings Parameter Min. Max.

  • Page 89: Power Consumption

    Smart Module Series Charging power USB_VBUS input. Power supply for VBAT_BK 3.25 6.3. Power Consumption Table 42: SC200K-CE Power Consumption Description Conditions Typ. Unit μA OFF state Power off Sleep state (USB disconnected) @ DRX = 2 Sleep state (USB disconnected) GSM/GPRS supply current @ DRX = 5 Sleep state (USB disconnected)
  • Page 90 Smart Module Series @ DRX = 7 Sleep state (USB disconnected) @ DRX = 9 EGSM900 @ PCL 5 EGSM900 @ PCL 12 EGSM900 @ PCL 19 GSM voice call DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 B1 @ max power WCDMA voice call B8 @ max power...

  • Page 91: Esd Protection

    Smart Module Series DCS1800 (4UL/1DL) @ PCL 2 B1 (HSDPA) @ max power B8 (HSDPA) @ max power WCDMA data transmission B1 (HSUPA) @ max power B8 (HSUPA) @ max power LTE-FDD B1 @ max power LTE-FDD B3 @ max power LTE-FDD B5 @ max power LTE-FDD B8 @ max power LTE data transmission...

  • Page 92: Operating And Storage Temperatures

    Smart Module Series Antenna Interfaces ± 5 ± 10 Other Interfaces ± 0.5 ± 1 6.5. Operating and Storage Temperatures Table 44: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit ° C Operating temperature range Storage temperature range ° C Within operating temperature range, the module meets 3GPP specifications.

  • Page 93: Mechanical Information

    Smart Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 43: Module Top and Side Dimensions (Unit: mm) SC200K_Series_Hardware_Design 92 / 105...
  • Page 94 Smart Module Series Figure 44: Module Bottom Dimensions (Unit: mm) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. SC200K_Series_Hardware_Design 93 / 105...

  • Page 95: Recommended Footprint

    Smart Module Series 7.2. Recommended Footprint Figure 45: Recommended Footprint (Top View) NOTE 1. Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. 2. The size of the four GND pads in the center of the module is larger than 2 × 2 mm, and therefore each GND pad needs separate apertures in the stencil design.

  • Page 96: Top And Bottom Views

    7.3. Top and Bottom Views Figure 46: Top & Bottom Views of Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, refer to the module received from Quectel. SC200K_Series_Hardware_Design 95 / 105...

  • Page 97: Storage, Manufacturing And Packaging

    Smart Module Series Storage, Manufacturing and Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. Recommended Storage Condition: The temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 98: Manufacturing And Soldering

    Smart Module Series NOTE To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven.

  • Page 99: Packaging Specifications

    Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [5].

  • Page 100: Plastic Reel

    Smart Module Series Figure 48: Carrier Tape Dimension Drawing Table 46: Carrier Tape Dimension Table (Unit: mm) 41.2 41.2 34.2 1.75 8.3.2. Plastic Reel Figure 49: Plastic Reel Dimension Drawing Table 47: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 72.5 SC200K_Series_Hardware_Design 99 / 105...

  • Page 101: Packaging Process

    Smart Module Series 8.3.3. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 200 modules.

  • Page 102: Appendix References

    Smart Module Series Appendix References Table 48: Related Documents Document Name [1] Quectel_SC200K_Series_Reference_Design [2] Quectel_SC200K_Series_GPIO_Configuration [3] Quectel_Smart_EVB_G5_User_Guide [4] Quectel_RF_Layout_Application_Note [5] Quectel_Module_Secondary_SMT_Application_Note Table 49: Terms and Abbreviations Abbreviations Description 3GPP 3rd Generation Partnership Project Analog-to-Digital Converter AMR-NB Adaptive Multi Rate-Narrow Band Speech Codec AMR-WB Adaptive Multi-Rate Wideband Speech Codec Access Point...
  • Page 103 Smart Module Series Dual Carrier DC-HSDPA Dual-carrier High Speed Downlink Packet Access DC-HSUPA Dual Carrier High Speed Uplink Packet Access Discontinuous Reception Display Serial Interface EDGE Enhanced Data Rate for GSM Evolution Enhanced Data Rate EGSM Enhanced GSM eMMC Embedded Multimedia Card eSCO Extended Synchronous Connection Oriented Electrostatic Discharge...
  • Page 104 Smart Module Series HSUPA High Speed Uplink Packet Access Input/Output Inter-Integrated Circuit kbps kilobits per second Leadless Chip Carrier Liquid Crystal Display LCD Module Low Dropout Regulator Low Energy Land Grid Array Low Noise Amplifier Long-Term Evolution Mbps Megabits per second Modulation and Coding Scheme Microphone MIMO...
  • Page 105 Smart Module Series Pulse Width Modulation Phase Shift Keying Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying Radio Frequency Real Time Clock Request To Send Receive Data (Pin) SD Card Secure Digital Card Short Message Service Station Time-Division Duplex Touch Panel Transmit Data (Pin) Transient Voltage Suppressor UART...
  • Page 106 Smart Module Series Minimum High-level Output Voltage Maximum Low-level Output Voltage VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access WLAN Wireless Local Area Network SC200K_Series_Hardware_Design 105 / 105...

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