Download
Share
Print this page
Quectel AG568N Series Hardware Design
  1. Manuals
  2. Brands
  3. Quectel Manuals
  4. Network Hardware
  5. AG568N Series
  6. Hardware design
Quectel AG568N Series Hardware Design

Quectel AG568N Series Hardware Design

Hide thumbs

Advertisement

Quick Links

Download this manual
AG568N Series QuecOpen
Hardware Design
Automotive Module Series
Version: 1.0.6
Date: 2023-01-19
Status: Preliminary

Advertisement

loading
Need help?

Need help?

Do you have a question about the AG568N Series and is the answer not in the manual?

Questions and answers

Related Manuals for Quectel AG568N Series

Summary of Contents for Quectel AG568N Series

  • Page 1 AG568N Series QuecOpen Hardware Design Automotive Module Series Version: 1.0.6 Date: 2023-01-19 Status: Preliminary...

  • Page 2: Legal Notices

    Automotive Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,...

  • Page 3: Third-Party Rights

    Privacy Policy To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Automotive Module Series About the Document Revision History Version Date Author Description Cathy CHEN/ 2021-08-31 Creation of the document Jason FAN Cathy CHEN/ 1.0.0 2021-08-31 Preliminary Jason FAN Updated the pin 60, pin 163 and pin 166 from RESERVED to ADC3, ADC4, ADC5. Updated the pin 132, pin 136 and pin 428 from RESERVED to GPIO 22, GPIO23, GPIO24.
  • Page 6 Automotive Module Series up to 52 MHz to 50 MHz of SPI interface at master mode (Table 4). 4. Updated the information of USB serial driver (Table 5. Modified the information of transmitting power (Table 4). 6. Updated the DL/UL transmitting rate of LTE-FDD and LTE-TDD on AG568N-CN and AG568N-EU (Table 4).
  • Page 7 Automotive Module Series Updated the data rates (Table 4). Updated the LTE features (Table 4). Updated the description of tests points for VDD_EXT, RESET_N, USB_VBUS, USB_DP/DM, DBG_RXD/TXD, USB_BOOT (Table 6 & Table 10 & Table 11 & Table 13 & Table 28). Updated the information of turning on with PWRKEY (Chapter 3.5.1).

  • Page 8: Table Of Contents

    Automotive Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 7 Table Index ..............................10 Figure Index ............................... 12 Introduction ............................14 1.1. Special Marks .......................... 17 Product Overview ..........................18 2.1. Frequency Bands and Functions .................... 19 2.2.
  • Page 9 Automotive Module Series 4.10. SDIO Interface ......................... 64 4.10.1. Reference Design for eMMC Application ............... 66 4.11. ADC Interfaces ........................67 4.12. SGMII Interface ........................68 4.13. RGMII Interface ........................69 4.14. RTC ............................72 4.15. SPI Interfaces .......................... 72 4.16.
  • Page 10 Automotive Module Series Storage, Manufacturing & Packaging .................... 127 8.1. Storage Conditions ........................ 127 8.2. Manufacturing and Soldering ....................128 8.3. Packaging Specifications ...................... 129 8.3.1. Carrier Tape ........................130 8.3.2. Plastic Reel ........................130 8.3.3. Mounting Direction ....................... 131 8.3.4.
  • Page 11 Table Index Table 1: Special Marks ..........................17 Table 2: Brief Introduction of the Module ....................18 Table 3: Frequency Bands and Functions of AG568N Series ..............19 Table 4: Key Features ..........................20 Table 5: I/O Parameters Definition ......................26 Table 6: Pin Description ..........................
  • Page 12 Automotive Module Series Table 42: AG568N-EU Conducted RF Receiving Sensitivity (Unit: dBm) ..........86 Table 43: AG568N-NA Conducted RF Receiving Sensitivity (Unit: dBm) ..........87 Table 44: AG568N-ROW Conducted RF Receiving Sensitivity (Unit: dBm) ..........88 Table 45: Pin Definition of GNSS Antenna Interface ................. 90 Table 46: GNSS Frequency (Unit: MHz) ....................
  • Page 13 Automotive Module Series Figure Index Figure 1: Functional Diagram ........................24 Figure 2: Pin Assignment (Top View) ......................25 Figure 3: Sleep Mode Power Consumption Diagram ................41 Figure 4: Sleep-Mode Application without Suspend Function ..............42 Figure 5: Reference Design of Power Supply .................... 44 Figure 6: Power Supply Limits During Burst Transmission ................
  • Page 14 Automotive Module Series Figure 42: Top and Bottom Views of the Module ..................126 Figure 43: Recommended Reflow Soldering Thermal Profile ..............128 Figure 44: Carrier Tape Dimension Drawing .................... 130 Figure 45: Plastic Reel Dimension Drawing .................... 130 Figure 46: Mounting Direction ........................131 Figure 47: Packaging Process .........................

  • Page 15: Introduction

    ⚫ Enhance product competitiveness and price-performance ratio ® This document defines the AG568N series in QuecOpen solution and describes its air interface and hardware interfaces which are connected with your applications. It can help you quickly understand interface specifications, electrical and mechanical details, as well as other related information of the module.
  • Page 16 Automotive Module Series LTE BAND 5 9.41 6.12 LTE BAND 12 8.70 5.64 LTE BAND 66 5.00 5.00 NR BAND 2 8.00 8.00 NR BAND 5 9.42 6.13 NR BAND 12 8.71 5.64 NR BAND 66 5.00 5.00 NR BAND 77 3.00 NR BAND 78 3.00...
  • Page 17 RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual. Product Marketing Name: Quectel AG568N-NA IC Statement IRSS-GEN "This device complies with Industry Canada’s licence-exempt RSSs.

  • Page 18: Special Marks

    Automotive Module Series 1.1. Special Marks Table 1: Special Marks Mark Definition Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported;...

  • Page 19: Product Overview

    Automotive Module Series Product Overview AG568N series module is an SMD type module which is engineered to meet the demanding requirements in automotive applications and other harsh operating conditions. More specifically, the module will be commonly found in telematics boxes (T-Box), telematics control units (TCU), advanced driver-assistance systems (ADAS), on-board units (OBU), roadside units (RSU), and other automotive/traffic systems.

  • Page 20: Frequency Bands And Functions

    LTE B29 and B32 support Rx only. LTE B21 only supports 2 × 2 MIMO. AG568N series only supports dual-frequency GNSS (L1 + L5) by default, but the module is designed to be compatible with single-frequency GNSS (L1). For more details, please contact Quectel Technical Support.

  • Page 21: Key Features

    Automotive Module Series 2.2. Key Features Table 4: Key Features Features Details VBAT_BB/VBAT_RF: ⚫ Power Supply Supply voltage: 3.3–4.3 V ⚫ Typical supply voltage: 3.8 V ⚫ Text and PDU mode ⚫ Point-to-point MO and MT ⚫ SMS cell broadcast ⚫...
  • Page 22 Can be used to connect with an external WLAN IC and used for Wi-Fi communication by default ⚫ Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 AT Commands ⚫ Quectel enhanced AT commands Rx-diversity 5G NR/LTE/WCDMA ⚫ One main antenna interface (ANT_MAIN) ⚫...
  • Page 23 Automotive Module Series ⚫ 5G NR FDD bands: Class 3 (23 dBm ± 2 dB) ⚫ LTE bands: Class 3 (23 dBm ± 2 dB) ⚫ WCDMA bands: Class 3 (23 dBm ± 2 dB) ⚫ EGSM900: Class 4 (33 dBm ± 2 dB) ⚫...
  • Page 24 Automotive Module Series ⚫ Supports QPSK, 16QAM and 64QAM and 256QAM modulation in UL/DL direction ⚫ FDD: Max 1.5 Gbps (DL)/150 Mbps (UL) AG568N-ROW: ⚫ Support up to DL CA Cat 16 LTE-FDD ⚫ Support 1.4/3/5/10/15/20 MHz RF bandwidth ⚫ Support 4 ×4 MIMO for MHB bands in DL direction ⚫...

  • Page 25: Functional Diagram

    Automotive Module Series ⚫ USB 2.0 interface Firmware Upgrade ⚫ FOTA RoHS All hardware components are fully compliant with EU RoHS directive 2.3. Functional Diagram The following figure shows a block diagram of the module and illustrates the major functional parts. ⚫...

  • Page 26: Pin Assignment

    Automotive Module Series 2.4. Pin Assignment The following figure illustrates the pin assignment of the module. GPIO23 RESERVED RESERVED RESERVED GPIO22 RESERVED SPI1_MOSI SPI1_CS RESERVED RESERVED RESERVED SPI1_CLK RESERVED SPI1_MISO GPIO5 GPIO15 ADC2 SGMII_INT VBAT_RF SGMII_RST VBAT_RF GPIO16 DBG_RXD RESERVED VBAT_RF RESERVED VBAT_RF...

  • Page 27: Pin Description

    Automotive Module Series 2.5. Pin Description The following table shows the DC characteristics and pin descriptions. DC characteristics include power domain, rate current, etc. Table 5: I/O Parameters Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input...
  • Page 28 Automotive Module Series Power supply only for external pull up Provide 1.8 V for Vnom = 1.8 V VDD_EXT circuits. external circuits Iomax = 50 mA It is recommended to reserve test points. 12, 18, 26, 33, 42, 86, 92, 98, 115, 117, 118, 120, 121, 124–131, 133–135, 137, 138, 140, 141, 144–151, 153, 155, 156, 158, 159, 160, 162, 164, 165, 167, 168, 171–174, 176, 177, 180, 182, 183, 185, 186, 189, 191, 192, 194, 195, 198, 199, 201, 202, 203, 206, 208, 209, 211, 212, 215, 217, 218, 220, 221, 230, 232, 233, 234, 237, 240, 307–...
  • Page 29 Automotive Module Series RX_M receive (-) (U)SIM Interfaces Pin Name Description Comment Characteristics Either 1.8/3.0 V is (U)SIM1 card power USIM1_VDD supported by the supply module automatically. For 1.8 V (U)SIM: max = 0.27 V min = 1.4 V max = 0.27 V min = 1.4 V USIM1_ (U)SIM1 card data...
  • Page 30 Automotive Module Series max = 0.27 V min = 1.4 V For 3.0 V (U)SIM: max = 0.4 V min = 2.6 V max = 0.4 V min = 2.6 V For 1.8 V (U)SIM: max = 0.22 V min = 1.62 V USIM2_CLK (U)SIM2 card clock For 3.0 V (U)SIM:...
  • Page 31 Automotive Module Series UART2 (Bluetooth UART) Pin Name Description Comment Characteristics max = 0.45 V 1.8 V power domain. UART2_TXD UART2 transmit min = 1.35 V If unused, keep these pins open. UART2_RXD UART2 receive min = -0.3 V Connect to DTE’s max = 0.63 V CTS.
  • Page 32 Automotive Module Series audio codec IC. Reserve pull-up I2C1_SDA I2C serial data resistors and not mount by default. 1.8 V power domain. If unused, keep I2C2_SCL I2C serial clock them open. Used for external IMU sensor. Reserve pull-up resistors and I2C2_SDA I2C serial data not mount by default.
  • Page 33 Automotive Module Series max = 2.1 V max = 0.45 V PCM_DOUT PCM data output min = 1.35 V PCIe Interface Pin Name Description Comment Characteristics PCIE_ PCIe reference clock (+) REFCLK_P PCIE_ PCIe reference clock (-) REFCLK_M Compliant with PCIe PCIE_TX0_P PCIe transmit 0 (+) revision 3.0...
  • Page 34 Automotive Module Series impedance of 100 Ω. SGMII_RX_M SGMII receive (-) If unused, connect Rx pairs with GND SGMII_TX_P SGMII transmit (+) directly and keep SGMII_TX_M SGMII transmit (-) others open. min = -0.3 V max = 0.63 V SGMII_INT PHY interrupt output min = 1.17 V max = 2.1 V...
  • Page 35 Automotive Module Series RGMII_TX_3 RGMII transmit data bit 3 RGMII_CTL_ RGMII transmit control RGMII_CK_ RGMII transmit clock min = -0.3 V max = 0.63 V RGMII_INT PHY interrupt output 1.8 V power domain. min = 1.17 V If unused, keep them max = 2.1 V open.
  • Page 36 Automotive Module Series Single-ended impedance of 50 Ω. ANT_GNSS GNSS antenna interface Supports active antenna only. ANT_MAIN Main antenna interface Diversity antenna ANT_DRX interface Single-ended 4 × 4 MIMO antenna impedance of 50 Ω. ANT_MIMO3 interface 4 × 4 MIMO antenna ANT_MIMO4 interface SPI Interfaces...
  • Page 37 Automotive Module Series max = 2.1 V ADC Interfaces Pin Name Description Comment Characteristics General-purpose ADC ADC0 interface Voltage range: 0.04–1.78 V General-purpose ADC ADC1 interface General-purpose ADC ADC2 interface If unused, connect them with ground. General-purpose ADC ADC3 interface Voltage range: 0.05–1.45 V General-purpose ADC...
  • Page 38 Automotive Module Series General-purpose GPIO11 input/output General-purpose GPIO12 input/output General-purpose GPIO13 input/output General-purpose GPIO14 input/output Do not pull down this pin before powering on if the module does General-purpose not need to enter GPIO15 input/output Fast Meta mode. 1.8 V power domain. If unused, keep it open.
  • Page 39 Automotive Module Series LTE & WLAN/ max = 0.45 V COEX_TXD Bluetooth coexistence min = 1.35 V transmit Analog Audio Interfaces Pin Name Description Comment Characteristics Microphone analog input MIC1_P 1 (+) Microphone analog input MIC1_N 1 (-) Microphone analog input MIC2_P 2 (+) Microphone analog input...

  • Page 40: Evb Kit

    252, 273, 274, 279, 281, 282, 285–288, 290–294, 299–306, 403, 422, 424 2.6. EVB Kit To help you develop applications with the module, Quectel supplies an evaluation board (V2X&5G EVB) with accessories to control or test the module. For more details, see document [1]. AG568N_Series_QuecOpen_Hardware_Design...

  • Page 41: Operating Characteristics

    Automotive Module Series Operating Characteristics 3.1. Operating Modes The table below outlines operating modes of the module. Table 7: Overview of Operating Modes Mode Details The module remains registered on the network, and is ready to send Idle Full Functionality and receive data.

  • Page 42: Sleep Mode

    Automotive Module Series 3.2. Sleep Mode The module is able to reduce the power consumption to a minimum value during the sleep mode. This chapter mainly introduces the way to enter or exit from sleep mode. The diagram below illustrates the power consumption of the module during the sleep mode.

  • Page 43: Airplane Mode

    Automotive Module Series GPIO Power USB_VBUS Switch USB Interface USB Interface GPIO EINT Module Host Figure 4: Sleep-Mode Application without Suspend Function NOTE 1. Pay attention to the level match of the connection signals between the module and the external MCU.

  • Page 44: Power Supply

    Automotive Module Series NOTE The execution of AT+CFUN or related API functions will not affect GNSS function. 3.4. Power Supply 3.4.1. Power Supply Pins The module provides eleven VBAT pins dedicated to the connection with the external power supply. There are two separate voltage domains for VBAT. ⚫...

  • Page 45: Voltage Stability Requirements

    Automotive Module Series The following figure shows a reference design for DC +12 V/+24 V input power source. The designed output for the power supply is 3.8 V, and the maximum rated current is 5 A. 7.2 μ H 100 nF VCC_3V8 +12V_IN BOOT...

  • Page 46: Turn On

    Automotive Module Series To decrease the voltage drop, bypass capacitors of about 100 μF with low ESR should be used for VBAT_BB and VBAT_RF respectively, and a multi-layer ceramic chip (MLCC) capacitor array should also be reserved due to their ultra-low ESR. It is recommended to use three ceramic capacitors (100 nF, 33 pF, 10 pF) for composing the MLCC array, and place these capacitors close to VBAT pins.
  • Page 47 Automotive Module Series 500 ms PWRKEY Turn on pulse 4. 7K G P I O M C U M odul e Figure 8: Turn On the Module Using Driving Circuit Another way to control the PWRKEY is by using a button directly. When pressing the button, an electrostatic strike may generate from finger.

  • Page 48: Turn Off

    Automotive Module Series NOTE 1 VBAT 500 ms 1.45 V PWRKEY 0.3 V RESET_N NOTE 2 35 s I nactive Active 60 ms VDD _ EXT Figure 10: Power-up Timing NOTE Ensure that VBAT is stable for at least 30 ms before pulling down the PWRKEY. If USB_VBUS is connected, the module will start automatically after power-on.

  • Page 49: Turn Off With Linux Commands

    Automotive Module Series VBA T ＞ 2 s 15 s PWRKEY Module Power-down procedure Running Status VDD_EXT Figure 11: Power-down Timing 3.6.2. Turn Off with Linux Commands The module can be turned off safely with Linux commands, such as shutdown and poweroff, which are similar to turning off the module via the PWRKEY pin.
  • Page 50 Automotive Module Series Table 10: Pin Definition of RESET_N Pin Name Pin No. Description Comment Internally pulled up to 1.8 V. Active low. RESET_N Reset the module It is recommended to reserve test points. The recommended circuit is equal to the PWRKEY control circuit. An open drain/collector driver or button can be used to control the RESET_N.
  • Page 51 Automotive Module Series VBAT 250– 550 m s 1.45 V RESET_N 0.3 V 250 ms Module Running Resetting Restart Status Figure 14: Reset Timing ⚫ NOTE RESET_N should only be used when turning off the module by Linux commands and PWRKEY pin all failed.

  • Page 52: Application Interfaces

    Automotive Module Series Application Interfaces 4.1. USB Interface The module provides one integrated Universal Serial Bus (USB) interface. The USB interface complies with the USB 3.1 and USB 2.0 specifications. USB 3.1 and USB 2.0 support data communication with external AP, and cannot be used simultaneously since they share the same controller.
  • Page 53 Automotive Module Series Test points of USB 2.0 interface must be reserved, which can be used for debugging and firmware upgrading in your designs. The following figure shows a reference circuit of USB interface. Test Points Minimize these stubs USB_VBUS USB Connector Module NM_0R...

  • Page 54: Uart Interfaces

    Automotive Module Series ⚫ Do not route signal traces under crystals, oscillators, magnetic devices, PCIe and RF signal traces. It is important to route the USB differential traces in PCB inner-layer, and surround the traces with ground on that layer and ground planes above and below. ⚫...
  • Page 55 Automotive Module Series Pin definition of the UART interface is here as follows: Table 13: Pin Definition of UART Interfaces Pin Name Description Comment Connect to DTE’s CTS. UART1_CTS DTE clear to send signal from DCE 1.8 V power domain. If unused, keep these pins open.
  • Page 56 Automotive Module Series VDD_1V8 VCCA VCCB VDD_MCU 0.1 μ F 0.1 μ F CTS_MCU Translator RTS_MCU TXD_MCU RXD_MCU Figure 16: Reference Circuit with Translator Chip Another example with transistor circuit is shown as below. For the design of circuits shown in dotted lines, see that shown in solid lines, but pay attention to the direction of connection.

  • Page 57: U)Sim Interfaces

    UART2_TXD BT_RTS UART2_RTS UART2_CTS BT_CTS AG568N Series Wi-Fi/Bluetooth Module Figure 18: UART Interface Connection (UART2) NOTE 1. Transistor circuit solution is not suitable for applications with high baud rates exceeding 460 kbps. 2. If hardware flow control function is intended to be used, then CTS and RTS should also be designed with the level-shifting circuit.
  • Page 58 Automotive Module Series Either 1.8/3.0 V is supported by USIM2_VDD (U)SIM2 card power supply the module automatically. USIM2_DATA (U)SIM2 card data If unused, keep these pins USIM2_CLK (U)SIM2 card clock open. USIM2_RST (U)SIM2 card reset 1.8 V power domain. USIM2_DET (U)SIM2 card hot-plug detect If unused, keep it open.
  • Page 59 Automotive Module Series USIM_VDD 1 μ F USIM_GND (U)SIM Card Connector USIM_VDD USIM_RST Module USIM_CLK USIM_DATA 33 pF 33 pF 33 pF TVS array Figure 20: Reference Circuit of a 6-Pin (U)SIM Card Connector To enhance the reliability and availability of the (U)SIM card in applications, follow the criteria below in (U)SIM circuit design.

  • Page 60: I2C Interfaces

    Automotive Module Series 4.4. I2C Interfaces The module provides two I2C interfaces. The I2C interfaces have been pulled to 1.8 V inside. It is recommended to reserve pull-up resistors and not mount by default. Table 15: Pin Definition of I2C Interfaces Pin Name Pin No.

  • Page 61: Pcm Interface

    Automotive Module Series The following figure shows a reference design of I2S interface with an external codec IC. RESET CDC_RESET_N MICBIAS MCLK MCLK I2S_CLK BCLK WCLK I2S_WS I2S_DOUT DOUT I2S_DIN LOUTP I2C1_SCL I2C1_SDA LOUTN Module Codec 1.8 V Figure 21: I2S and I2C1 Application with External Audio Codec NOTE The module works as a master device pertaining to I2C interface.

  • Page 62: Wlan And Bluetooth Application Interfaces

    Automotive Module Series 4.7. WLAN and Bluetooth Application Interfaces The module provides one PCIe interface for WLAN function (see Chapter 4.17 for more details), and one Bluetooth UART and one PCM interface for Bluetooth function (see Chapter 4.2 and Chapter 4.6 for more details).

  • Page 63: Analog Audio Interfaces (Optional)

    Figure 22: WLAN & Bluetooth Application Interfaces Connection Block Diagram 4.8. Analog Audio Interfaces (Optional) The module is designed with a built-in audio codec to enable analog audio function. The analog audio interfaces are optional. If you need this function, please contact Quectel Technical Support. AG568N_Series_QuecOpen_Hardware_Design 62 / 135...

  • Page 64: Gpios

    Automotive Module Series Table 19: Pin Definition of Analog Audio Interfaces Pin Name Pin No. Description Comment MIC1_P Microphone analog input 1 (+) MIC1_N Microphone analog input 1 (-) MIC2_P Microphone analog input 2 (+) MIC2_N Microphone analog input 2 (-) The analog audio function is optional.

  • Page 65: Sdio Interface

    Automotive Module Series GPIO7 General-purpose input/output GPIO8 General-purpose input/output GPIO9 General-purpose input/output GPIO10 General-purpose input/output GPIO11 General-purpose input/output GPIO12 General-purpose input/output GPIO13 General-purpose input/output GPIO14 General-purpose input/output Do not pull down this pin before powering on if the module does not need GPIO15 General-purpose input/output to enter Fast Meta mode.
  • Page 66 Automotive Module Series Table 21: Pin Definition of SDIO Interface Pin Name Pin No. Description Comment EMMC_RST eMMc reset SDIO_DATA0 SDIO data bit 0 SDIO_DATA1 SDIO data bit 1 SDIO_DATA2 SDIO data bit 2 SDIO_DATA3 SDIO data bit 3 SDIO_DATA4 SDIO data bit 4 1.8 V power domain.

  • Page 67: Reference Design For Emmc Application

    Automotive Module Series 4.10.1. Reference Design for eMMC Application VDD_1V8 VDD_1.8V R1 0R SDIO_DATA0 DAT0 VCCQ R2 0R SDIO_DATA1 DAT1 1 µF 100 nF R3 0R SDIO_DATA2 DAT2 VDD_3V R4 0R SDIO_DATA3 DAT3 R5 0R SDIO_DATA4 DAT4 100 nF 2.2 µF R6 0R SDIO_DATA5 DAT5...

  • Page 68: Adc Interfaces

    Automotive Module Series 4.11. ADC Interfaces The module provides six Analog-to-Digital Converter (ADC) interfaces. In order to improve the accuracy of ADC, the trace of ADC interfaces should be surrounded by ground. Table 22: Pin Definition of ADC Interfaces Pin Name Pin No.

  • Page 69: Sgmii Interface

    Automotive Module Series NOTE 1. The input voltage of ADC should not exceed its corresponding voltage range. 2. It is prohibited to supply any voltage to ADC pin when VBAT is removed. 3. It is recommended to use resistor divider circuit for ADC application. 4.12.

  • Page 70: Rgmii Interface

    Automotive Module Series ETH_VDDIO RSTN SGMII_RST SGMII_INT Control SGMII_MDIO_DATA MDIO SGMII_MDIO_CLK 100 nF TX_P SGMII_RX_P 100 nF TX_M SGMII_RX_M SGMII Data Close to PHY 100 nF SGMII_TX_P RX_P 100 nF RX_M SGMII_TX_M Module Figure 24: Reference Circuit of SGMII Interface with PHY Application To enhance the reliability and availability of your application, follow the criteria below in the SGMII circuit design: ⚫...
  • Page 71 Automotive Module Series Table 25: Pin Definition of RGMII Interface Pin Name Pin No. Description Comment RGMII_MD_IO RGMII management data RGMII_MD_CLK RGMII management data clock RGMII_RX_0 RGMII receive data bit 0 RGMII_RX_1 RGMII receive data bit 1 RGMII_RX_2 RGMII receive data bit 2 Single-ended impedance of 50 Ω.
  • Page 72 Automotive Module Series RGMII_VDDO R13 R14 R15 R16 MDIO RGMII_MD_IO RGMII_MD_CLK INTN RGMII_INT RGMII_RST RESETN RGMII_RX_0 RXD0 RGMII_RX_1 RXD1 RGMII_RX_2 RXD2 RGMII_RX_3 RXD3 RGMII_CTL_RX RGMII_CK_RX RCLK RGMII_TX_0 TXD0 RGMII_TX_1 TXD1 RGMII_TX_2 TXD2 TXD3 RGMII_TX_3 RGMII_CTL_TX TCLK RGMII_CK_TX Module Ethernet PHY Figure 25: Reference Circuit of RGMII Interface with PHY Application To enhance the reliability and availability of your application design, follow the criteria below in the Ethernet PHY circuit design:...

  • Page 73: Rtc

    Automotive Module Series 4.14. The module has a real time clock within the PMIC, but has no dedicated RTC power supply pin. The RTC is powered by VBAT_BB. If VBAT_BB is removed, the RTC will not be maintained. Therefore, VBAT_BB must be powered continuously in actual applications if you need to maintain the RTC function. 4.15.
  • Page 74 Automotive Module Series t (ch) t (cl) SPI_CS SPI_CLK t (mos) t (moh) SPI_MOSI t (mis) t (mih) SPI_MISO Figure 26: SPI Interfaces Timing in Master Mode The related parameters of SPI timing in master mode are listed in the following table. Table 27: Parameters of SPI Interfaces Timing in Master Mode Parameter Description Min.

  • Page 75: Usb_Boot

    Automotive Module Series VDD_EXT VCCA VCCB VDD_MCU 0.1 μF 0.1 μF SPI_CS_N_MCU SPI_CS Translator SPI_CLK SPI_CLK_MCU SPI_MOSI SPI_MOSI_MCU SPI_MISO SPI_MISO_MCU Figure 27: Reference Circuit of SPI Interfaces with a Voltage-level Translator 4.16. USB_BOOT The module provides a USB_BOOT pin. Pull up USB_BOOT to VDD_EXT or external MCU controlling pin before powering on the module, thus the module will enter emergency download mode when powered on.

  • Page 76: Pcie Interface

    Automotive Module Series NOTE 1 VBAT 500 ms = 1. 45 V PWRKEY 0.3 V 100 ms VDD_EXT USB_BOOT c a n b e p u l l e d u p to 1.8 V before VDD_EXT is powered up, and the module will enter emergency download mode when it is turned on.
  • Page 77 Automotive Module Series Table 29: Pin Definition of PCIe Interface Pin Name Pin No. Description Comment PCIE_REFCLK_P PCIe reference clock (+) PCIE_REFCLK_M PCIe reference clock (-) PCIE_TX0_P PCIe transmit 0 (+) Compliant with PCIe PCIE_TX0_M PCIe transmit 0 (-) revision 3.0 specification. Requires differential PCIE_RX0_P PCIe receive 0 (+)
  • Page 78 220 nF PCIE_RX0_P PCIE_TX_P Wi-Fi Module AG568N Series Figure 30: PCIe Interface Connection The following principles of PCIe interface design should be complied with to meet PCIe specifications. ⚫ It is important to route the PCIe signal and PCIE_REFCLK traces as differential pairs with ground surrounded.

  • Page 79: Control Signals

    Automotive Module Series ⚫ The PCIE_REFCLK pair must add resistors near the slot (EP) side. The recommended resistor value is 49.9 Ω +/-1%. 4.18. Control Signals 4.18.1. WAKEUP_IN The module can be woken up by other devices. Table 30: Pin Definition of WAKEUP_IN Pin Name Pin No.

  • Page 80: Rf Specifications

    Automotive Module Series RF Specifications The module includes one main antenna interface, one Rx-diversity antenna interface , two MIMO antenna interfaces, and one GNSS antenna interface. The impedance of antenna port is 50 Ω. 5.1. Cellular Network 5.1.1. Antenna Interfaces & Frequency Bands 5.1.1.1.
  • Page 81 Automotive Module Series Table 33: Pin Definition of AG568N-EU Cellular Network Interface Pin Name Pin No. Description 2G/3G/4G LMHB TRx0 ANT_MAIN 5G NR n1/n3/n7/n8/n20/n28 TRx0 SA 5G NR n77/n78 DRx0 SA/NSA 2G/3G/4G LMHB DRx0 ANT_DRX 5G NR n1/n3/n7/n8/n20/n28 DRx0 SA 5G NR n77/n78 TRx0 SA/NSA 4G MHB Rx1 ANT_MIMO3...

  • Page 82: Operating Frequency

    Automotive Module Series 5G NR n78 Rx1 SA Table 35: Pin Definition of AG568N-ROW Cellular Network Interface Pin Name Pin No. Description 3G/4G LMHB TRx0 ANT_MAIN 5G NR n28 TRx0 SA 5G NR n77/n78/n79 DRx0 3G/4G LMHB DRx0 ANT_DRX 5G NR n28 DRx0 SA 5G NR n77/n78/n79 TRx0 SA/NSA 4G MHB Rx1 ANT_MIMO3...
  • Page 83 Automotive Module Series LTE-FDD B7 2500–2570 2620–2690 LTE-FDD B8 880–915 925–960 LTE-TDD B34 2010–2025 2010–2025 LTE-TDD B38 2570–2620 2570–2620 LTE-TDD B39 1880–1920 1880–1920 LTE-TDD B40 2300–2400 2300–2400 LTE-TDD B41 2496–2690 2496–2690 5G NR FDD n1 1920–1980 2110–2170 5G NR FDD n3 1710–1785 1805–1880 5G NR FDD n28A...
  • Page 84 Automotive Module Series LTE-FDD B8 880–915 925–960 LTE-FDD B20 832–862 791–821 LTE-FDD B28 703–748 758–803 LTE-FDD B32 1452–1496 LTE-TDD B38 2570–2620 2570–2620 LTE-TDD B40 2300–2400 2300–2400 5G NR FDD n1 1920–1980 2110–2170 5G NR FDD n3 1710–1785 1805–1880 5G NR FDD n7 2500–2570 2620–2690 5G NR FDD n8...

  • Page 85: Tx Power

    Automotive Module Series 5G NR FDD n12 699–716 729–746 5G NR FDD n66 1710–1780 2110–2200 5G NR TDD n77 3300–4200 3300–4200 5G NR TDD n78 3300–3800 3300–3800 Table 39: AG568N-ROW Operating Frequency Operating Frequency Transmit (MHz) Receive (MHz) WCDMA B1 1920–1980 2110–2170 WCDMA B3...

  • Page 86: Rx Sensitivity

    Automotive Module Series DCS1800 30 dBm ± 2 dB 0 dBm ± 5 dB EGSM900 8-PSK 27 dBm ± 3 dB 5 dBm ± 5 dB DCS1800 8-PSK 26 dBm ± 3 dB 0 dBm ± 5 dB WCDMA bands 23 dBm ±...
  • Page 87 Automotive Module Series LTE-FDD B1 (10 MHz) -101 -103 -105.3 LTE-FDD B3 (10 MHz) -100 -104.8 LTE-FDD B5 (10 MHz) -96.3 -98.3 -103.6 -94.3 LTE-FDD B7 (10 MHz) -101 -103.8 LTE-FDD B8 (10 MHz) -95.3 -97.3 -103.1 -93.3 LTE-TDD B34 (10 MHz) -101 -102 -105.9...
  • Page 88 Automotive Module Series WCDMA B8 -103 LTE-FDD B1 (10 MHz) LTE-FDD B3 (10 MHz) LTE-FDD B5 (10 MHz) -94.3 LTE-FDD B7 (10 MHz) LTE-FDD B8 (10 MHz) -93.3 LTE-FDD B20 (10 MHz) -93.3 LTE-FDD B28 (10 MHz) -94.8 LTE-FDD B32 (10 MHz) LTE-TDD B38 (10 MHz) LTE-TDD B40 (10 MHz) 5G NR FDD n1 (20 MHz)
  • Page 89 Automotive Module Series LTE-FDD B4 (10 MHz) -101 -103 -105.1 LTE-FDD B5 (10 MHz) -96.3 -98.3 -102.7 -94.3 LTE-FDD B12 (10 MHz) -95.3 -97.3 -103.6 -93.3 LTE-FDD B29 (10 MHz) LTE-FDD B66 (10 MHz) -100.5 -102.5 -104.2 -98.5 5G NR FDD n2 (20 MHz) -93.8 -95.3 -102.5...

  • Page 90: Reference Design

    Automotive Module Series 5G NR TDD n78 (100 MHz) -86.8 -88.3 -94.0 -86.8 5G NR TDD n79 (100 MHz) -86.8 -88.3 -92.4 -86.8 NOTE 5G NR FDD n1, n3, n7, n8, n12, n20, n28A and n28 support SA only. 5G NR FDD n2, n5 and n66 support SA and NSA ;5G NR TDD n41, n77, n78 and n79 support SA and NSA.

  • Page 91: Gnss

    Galileo 1176.45 ± 10.23 (E5a) 1561.098 ± 2.046 AG568N series only supports dual-frequency GNSS (L1 + L5) by default, but the module is designed to be compatible with single-frequency GNSS (L1). For more details, please contact Quectel Technical Support. AG568N_Series_QuecOpen_Hardware_Design...

  • Page 92: Gnss Performance

    3 minutes after executing cold start command. The above GNSS performance test data is measured under dual-frequency L1 + L5. For more details about GNSS performance, please consult Quectel Technical Support for GNSS performance test report. 5.2.3. Reference Design The reference circuit of GNSS antenna is shown as below.

  • Page 93: Rf Routing Guidelines

    Automotive Module Series 0.1 μF GNSS 10 R Antenna Module 47 nH 100 pF ANT_GNSS Figure 32: Reference Circuit of GNSS Antenna NOTE An external LDO can be selected to supply power according to the active antenna requirement. If the module is designed with a passive antenna, then the VDD circuit is not needed. Junction capacitance of ESD protection components on the antenna interface should not exceed 0.05 pF.
  • Page 94 Automotive Module Series characteristic impedance. The following are reference designs of microstrip or coplanar waveguide with different PCB structures. Figure 33: Microstrip Design on a 2-layer PCB Figure 34: Coplanar Waveguide Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) AG568N_Series_QuecOpen_Hardware_Design 93 / 135...

  • Page 95: Antenna Design Requirements

    Automotive Module Series Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω.

  • Page 96: Rf Connector Recommendation

    Automotive Module Series ⚫ Passive antenna gain: > 0 dBi ⚫ Active antenna noise figure: < 1.5 dB ⚫ Active antenna gain: > 0 dBi ⚫ Active antenna embedded LNA gain: < 24 dB ⚫ VSWR: ≤ 2 ⚫ Efficiency: > 30 % ⚫...

  • Page 97: Electrical Characteristics And Reliability

    Automotive Module Series Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 49: Absolute Maximum Ratings Parameter Min. Max.

  • Page 98: Power Supply Ratings

    Automotive Module Series 6.2. Power Supply Ratings Table 50: Power Supply Ratings Parameter Description Conditions Min. Typ. Max. Unit The actual input voltages must VBAT_BB and VBAT be kept between the minimum VBAT_RF and maximum values. Turn-on/ USB_VBUS USB connection detect 6.3.
  • Page 99 Automotive Module Series WCDMA @ DRX = 5.12s LTE-FDD @ DRX = 0.32 s LTE-FDD @ DRX = 0.64 s LTE-FDD @ DRX = 1.28 s LTE-FDD @ DRX = 2.56 s LTE-TDD @ DRX = 0.32 s LTE-TDD @ DRX = 0.64 s LTE-TDD @ DRX = 1.28 s LTE-TDD @ DRX = 2.56 s 5G NR FDD @ DRX = 0.32 s...
  • Page 100 Automotive Module Series 5G NR FDD @ DRX = 0.64 s 143.8 5G NR FDD @ DRX = 0.64 s (USB active) 149.6 5G NR TDD @ DRX = 0.64 s 143.2 5G NR TDD @ DRX = 0.64 s (USB active) 149.3 EGSM900 CH1 PCL = 5 @ 32.55 dBm 454.9...
  • Page 101 Automotive Module Series DCS1800 CH885 1DL/4UL @ 25.76 dBm 650.2 EGSM900 CH1 1DL/4UL @ 23.68 dBm 711.3 EGSM900 CH62 4DL/1UL @ 28.05 dBm 379.8 EGSM900 CH62 3DL/2UL @ 27.39 dBm 517.5 EGSM900 CH62 2DL/3UL @ 25.14 dBm 613.5 EGSM900 CH62 1DL/4UL @ 23.68 dBm 709.2 EGSM900 CH124 1DL/4UL @ 23.45 dBm 708.3...
  • Page 102 Automotive Module Series WCDMA B1 HSUPA CH10562 @ 23.19 dBm 710.4 WCDMA B1 HSUPA CH10700 @ 22.16 dBm 685.2 WCDMA B1 HSUPA CH10838 @ 22.12 dBm 699.1 WCDMA B8 HSUPA CH2937 @ 22.28 dBm 707.1 WCDMA B8 HSUPA CH3012 @ 22.24 dBm 681.1 WCDMA B8 HSUPA CH3088 @ 22.19 dBm 72764...
  • Page 103 Automotive Module Series LTE-TDD B39 CH38350 @ 22.76 dBm 410.1 LTE-TDD B39 CH38450 @ 22.83 dBm 414.7 LTE-TDD B39 CH38550 @ 22.80 dBm 418.2 LTE-TDD B40 CH38750 @ 22.75 dBm 483.8 LTE-TDD B40 CH39150 @ 22.74 dBm 470.7 LTE-TDD B40 CH39550 @ 22.79 dBm 478.2 LTE-TDD B41 CH39750 @ 22.56 dBm 584.2...
  • Page 104 Automotive Module Series 5A_n41A CH509202 @ 22.64 dBm 750.0 5A_n41A CH518598 @ 22.88 dBm 749.0 5A_n41A CH5280008 @ 22.43 dBm 769.0 8A_n41A CH509202 @ 22.70 dBm 787.0 8A_n41A CH518598 @ 23.13 dBm 785.0 8A_n41A CH5280008 @ 22.89 dBm 805.0 39A_n41A CH509202 @ 22.85 dBm 652.0 39A_n41A CH518598 @ 22.85 dBm 736.0...

  • Page 105: Ag568N-Eu Power Consumption

    Automotive Module Series 8A_n78A CH636666 @ 23.13 dBm 782.0 8A_n78A CH650000 @ 23.21 dBm 829.0 38A_n78A CH623334 @ 23.04 dBm 629.0 38A_n78A CH636666 @ 23.16 dBm 604.0 38A_n78A CH650000 @ 23.25 dBm 651.0 40A_n78A CH623334 @ 22.80 dBm 612.0 40A_n78A CH636666 @ 22.97 dBm 595.0 40A_n78A CH650000 @ 23.09 dBm 652.0...
  • Page 106 Automotive Module Series WCDMA @ DRX = 1.28 s WCDMA @ DRX = 2.56 s WCDMA @ DRX = 5.12 s LTE-FDD @ DRX = 0.32 s LTE-FDD @ DRX = 0.64 s LTE-FDD @ DRX = 1.28 s LTE-FDD @ DRX = 2.56 s LTE-TDD @ DRX = 0.32 s LTE-TDD @ DRX = 0.64 s LTE-TDD @ DRX = 1.28 s...
  • Page 107 Automotive Module Series LTE-TDD @ DRX = 0. 64 s LTE-TDD @ DRX = 0. 64s (USB active) 5G NR FDD @ DRX = 0.64 s 5G NR FDD @ DRX = 0.64 s (USB active) 5G NR TDD @ DRX = 0.64 s 5G NR TDD @ DRX = 0.64 s (USB active) EGSM900 CH1 PCL = 5 @ TBD dBm EGSM900 CH62 PCL = 5 @ TBD dBm...
  • Page 108 Automotive Module Series DCS1800 CH698 2DL/3UL @ TBD dBm DCS1800 CH698 1DL/4UL @ TBD dBm DCS1800 CH885 1DL/4UL @ TBD dBm EGSM900 CH1 1DL/4UL @ TBD dBm EGSM900 CH62 4DL/1UL @ TBD dBm EGSM900 CH62 3DL/2UL @ TBD dBm EGSM900 CH62 2DL/3UL @ TBD dBm EGSM900 CH62 1DL/4UL @ TBD dBm EGSM900 CH124 1DL/4UL @ TBD dBm EDGE data transfer...
  • Page 109 Automotive Module Series WCDMA B8 CH3012 @ TBD dBm WCDMA B8 CH3088 @ TBD dBm WCDMA B1 HSDPA CH10562 @ TBD dBm WCDMA B1 HSDPA CH10700 @ TBD dBm WCDMA B1 HSDPA CH10838 @ TBD dBm WCDMA B3 HSDPA CH1162 @ TBD dBm WCDMA B3 HSDPA CH1338 @ TBD dBm WCDMA B3 HSDPA CH1513 @ TBD dBm WCDMA B5 HSDPA CH4357 @ TBD dBm...
  • Page 110 Automotive Module Series WCDMA B8 HSUPA CH3088 @ TBD dBm LTE-FDD B1 CH100 @ TBD dBm LTE-FDD B1 CH300 @ TBD dBm LTE-FDD B1 CH500 @ TBD dBm LTE-FDD B3 CH1300 @ TBD dBm LTE-FDD B3 CH1575 @ TBD dBm LTE-FDD B3 CH1850 @ TBD dBm LTE-FDD B5 CH2450 @ TBD dBm LTE-FDD B5 CH2525 @ TBD dBm...
  • Page 111 Automotive Module Series LTE-TDD B40 CH38750 @ TBD dBm LTE-TDD B40 CH39150 @ TBD dBm LTE-TDD B40 CH39550 @ TBD dBm n1A CH426000 @ TBD dBm n1A CH428000 @ TBD dBm n1A CH430000 @ TBD dBm n3A CH364000 @ TBD dBm n3A CH368500 @ TBD dBm n3A CH373000 @ TBD dBm n7A CH526000 @ TBD dBm...
  • Page 112 Automotive Module Series n78A CH636666 @ TBD dBm n78A CH650000 @ TBD dBm 1A_n77A CH623334 @ TBD dBm 1A_n77A CH650000 @ TBD dBm 1A_n77A CH676666 @ TBD dBm 3A_n77A CH623334 @ TBD dBm 3A_n77A CH650000 @ TBD dBm 3A_n77A CH676666 @ TBD dBm 5A_n77A CH623334 @ TBD dBm 5A_n77A CH650000 @ TBD dBm 5A_n77A CH676666 @ TBD dBm...
  • Page 113 Automotive Module Series 1A_n78A CH650000 @ TBD dBm 3A_n78A CH623334 @ TBD dBm 3A_n78A CH636666 @ TBD dBm 3A_n78A CH650000 @ TBD dBm 5A_n78A CH623334 @ TBD dBm 5A_n78A CH636666 @ TBD dBm 5A_n78A CH650000 @ TBD dBm 7A_n78A CH623334 @ TBD dBm 7A_n78A CH636666 @ TBD dBm 7A_n78A CH650000 @ TBD dBm 8A_n78A CH623334 @ TBD dBm...

  • Page 114: Ag568N-Na Power Consumption

    Automotive Module Series 6.3.3. AG568N-NA Power Consumption Table 53: AG568N-NA Power Consumption (25 ° C, 3.8 V Power Supply) Description Conditions Typ. Unit μA OFF state Power down AT+CFUN=0 2.865 AT+CFUN=4 2.955 LTE-FDD @ DRX = 0.32 s 5.843 LTE-FDD @ DRX = 0.64 s 4.378 LTE-FDD @ DRX = 1.28 s 3.695...
  • Page 115 Automotive Module Series (GNSS OFF) LTE-FDD B2 CH900 @ 22.42 dBm LTE-FDD B2 CH1100 @ 22.44 dBm LTE-FDD B4 CH2000 @ 22.36 dBm LTE-FDD B4 CH2175 @ 22.43 dBm LTE-FDD B4 CH2350 @ 22.40 dBm LTE-FDD B5 CH2450 @ 22.47 dBm LTE-FDD B5 CH2525 @ 22.50 dBm LTE-FDD B5 CH2600 @ 22.52 dBm LTE-FDD B12 CH5060 @ TBD dBm...
  • Page 116 Automotive Module Series n66A CH432000 @ 23.30 dBm n77A CH623334@ 25.63 dBm n77A CH650000@ 25.86 dBm n77A CH676666@ 25.88 dBm n78A CH623334 @ 26.03 dBm n78A CH636666 @ 26.18 dBm n78A CH650000 @ 26.03 dBm 5A_n2A CH388000 @ 22.66 dBm 1095 5A_n2A CH392000 @ 23.03 dBm 1074...

  • Page 117: Ag568N-Row Power Consumption

    Automotive Module Series 2A_n5A CH175800 @ 22.52 dBm 1023 2A_n5A CH176300 @ 22.70 dBm 1048 2A_n5A CH176800 @ 22.62 dBm 1053 66A_n5A CH175800 @22.65 dBm 1046 66A_n5A CH176300 @ 22.64 dBm 1062 66A_n5A CH176800 @ 22.60 dBm 1067 5A_n66A CH426000 @ 22.67 dBm 1074 5A_n66A CH429000 @ 22.85 dBm 1080...
  • Page 118 Automotive Module Series LTE-FDD @ DRX = 1.28 s 4.828 LTE-FDD @ DRX = 2.56 s 4.530 5G NR FDD @ DRX = 0.32 s 5G NR FDD @ DRX = 0.64 s 5G NR FDD @ DRX = 1.28 s 5G NR FDD @ DRX = 2.56 s 5G NR TDD @ DRX = 0.32 s 11.735...
  • Page 119 Automotive Module Series transfer (GNSS OFF) WCDMA B1 HSDPA CH10700 @ 21.96 dBm WCDMA B1 HSDPA CH10838 @ 21.92 dBm WCDMA B3 HSDPA CH1162 @ 21.82 dBm WCDMA B3 HSDPA CH1338 @ 21.83 dBm WCDMA B3 HSDPA CH1513 @ 21.94 dBm WCDMA B1 HSUPA CH10562 @ 21.62 dBm WCDMA B1 HSUPA CH10700 @ 21.56 dBm WCDMA B1 HSUPA CH10838 @ 21.47 dBm...
  • Page 120 Automotive Module Series n77A CH650000 @ 25.93 dBm n77A CH676666 @ 25.65 dBm n78A CH623334 @ 26.35 dBm n78A CH636666 @ 26.42 dBm n78A CH650000 @ 26.43 dBm n79A CH697094 @ 22.56 dBm n79A CH713990 @ 22.58 dBm n79A CH729468 @ 26.74 dBm 19A_n77A CH623334 @ 22.82 dBm 19A_n77A CH650000 @ 22.92 dBm 19A_n77A CH676666 @ 22.70 dBm...

  • Page 121: Esd Protection

    Automotive Module Series 21A_n78A CH650000 @ 22.93 dBm 28A_n78A CH623334 @ 22.93 dBm 28A_n78A CH636666 @ 22.91dBm 28A_n78A CH650000 @ 23.00 dBm 1A_n79A CH697094 @ 23.40 dBm 1A_n79A CH713990 @ 23.38 dBm 1A_n79A CH729468 @ 23.48 dBm 3A_n79A CH697094 @ 23.28 dBm 3A_n79A CH713990 @ 23.27 dBm 3A_n79A CH729468 @ 23.27 dBm 19A_n79A CH697094 @ 23.50 dBm...

  • Page 122: Operating And Storage Temperatures

    Automotive Module Series Table 55: ESD Characteristics (Temperature: 25–30 ° C, Humidity: 40 ± 5 %) Tested Interfaces Contact Discharge Air Discharge Unit VBAT, GND ± 6 ± 10 Antenna Interfaces ± 5 ± 10 Other Interfaces ± 0.5 ± 1 6.5.
  • Page 123 Automotive Module Series ⚫ Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. ⚫ Maintain the integrity of the PCB copper layer and drill as many thermal vias as possible. ⚫...

  • Page 124: Mechanical Information

    Automotive Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 7.1. Mechanical Dimensions Pin 1 Figure 39: Module Top and Side Dimensions (Unit: mm) AG568N_Series_QuecOpen_Hardware_Design 123 / 135...
  • Page 125 Automotive Module Series Pin 1 Figure 40: Module Bottom Dimensions (Bottom View, Unit: mm) ⚫ NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. AG568N_Series_QuecOpen_Hardware_Design 124 / 135...

  • Page 126: Recommended Footprint

    Automotive Module Series 7.2. Recommended Footprint Pin 1 Figure 41: Recommended Footprint (Top View, Unit: mm) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. AG568N_Series_QuecOpen_Hardware_Design 125 / 135...

  • Page 127: Top And Bottom Views

    Figure 42: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. AG568N_Series_QuecOpen_Hardware_Design 126 / 135...

  • Page 128: Storage, Manufacturing & Packaging

    Automotive Module Series Storage, Manufacturing & Packaging 8.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 129: Manufacturing And Soldering

    Automotive Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure. 3.

  • Page 130: Packaging Specifications

    3. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 4. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [8].

  • Page 131: Carrier Tape

    Automotive Module Series 8.3.1. Carrier Tape Dimension details are as follow: Figure 44: Carrier Tape Dimension Drawing Table 58: Carrier Tape Dimension Table (Unit: mm) 47.5 45.6 4.55 34.2 1.75 8.3.2. Plastic Reel Figure 45: Plastic Reel Dimension Drawing AG568N_Series_QuecOpen_Hardware_Design 130 / 135...

  • Page 132: Mounting Direction

    Automotive Module Series Table 59: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 72.5 8.3.3. Mounting Direction Figure 46: Mounting Direction 8.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.
  • Page 133 Automotive Module Series Place the packaged plastic reel, 1 humidity indicator card and 1 desiccant bag into a vacuum bag, vacuumize it. Place the vacuum-packed plastic reel into the pizza box. Put 4 packaged pizza boxes into 1 carton box and seal it. 1 carton box can pack 600 modules.

  • Page 134: Appendix References

    Automotive Module Series Appendix References Table 60: Related Documents Document Name [1] Quectel_V2X&5G_EVB_User_Guide [2] Quectel_AG56xN_Series_QuecOpen_Device_Management_API_Reference_Manual [3] Quectel_AG56xN_Series_QuecOpen_AT_Commands_Manual [4] Quectel_AG56xN_Series_QuecOpen_Low_Power_Mode_Application_Note [5] Quectel_AG568N_Series_QuecOpen_Reference_Design [6] Quectel_RF_Layout_Application_Note [7] Quectel_Module_Thermal_Design_Guide [8] Quectel_Module_SMT_Application_Note Table 61: Terms and Abbreviations Abbreviation Description 3GPP 3rd Generation Partnership Project 5G NR 5G New Radio Analog-to-Digital Converter Adaptive Multi-rate...
  • Page 135 Automotive Module Series ASRC Asynchronous Sampling Rate Converter Bits Per Second Carrier Aggregation CHAP Challenge Handshake Authentication Protocol Coding Scheme Clear To Send DC-HSDPA Dual-carrier High Speed Downlink Packet Access Downlink Discontinuous Reception DSDS Dual SIM Dual Standby Data Terminal Equipment EDGE Enhanced Data Rates for GSM Evolution Enhanced Full Rate...
  • Page 136 Automotive Module Series Global Positioning System Global System for Mobile Communications High Band HPUE High Power User Equipment Half Rate HSDPA High Speed Downlink Packet Access HSPA High Speed Packet Access HSUPA High Speed Uplink Packet Access Integrated Circuit Inter-Integrated Circuit Inter-IC Sound Input/Output Inom...
  • Page 137 Automotive Module Series Middle/High Band MIMO Multiple Input Multiple Output Mobile Originated Mobile Terminated MLCC Multi-layer Ceramic Chip Capacitor NMEA NMEA (National Marine Electronics Association) 0183 Interface Standard Non-Stand Alone Printed Circuit Board PCIe Peripheral Component Interconnect Express Pulse Code Modulation Protocol Data Unit Physical Layer PMIC...
  • Page 138 Automotive Module Series Short Message Service Serial Peripheral Interface Time Division Duplexing TD-SCDMA Time Division-Synchronous Code Division Multiple Access Transmit & Receive Transmit UART Universal Asynchronous Receiver/Transmitter Uplink UMTS Universal Mobile Telecommunications System Universal Serial Bus (U)SIM Universal Subscriber Identity Module Vehicle-to-Infrastructure Vehicle to Pedestrian Vehicle-to-Vehicle...
  • Page 139 Automotive Module Series Maximum High-level Output Voltage Minimum High-level Output Voltage Maximum Low-level Output Voltage Minimum Low-level Output Voltage VSWR Voltage Standing Wave Ratio WCDMA Wideband Code Division Multiple Access Wi-Fi Wireless Fidelity WLAN Wireless Local Area Network AG568N_Series_QuecOpen_Hardware_Design 138 / 135...

This manual is also suitable for:

Ag568n-cnAg568n-euAg568n-naAg568n-row