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Quectel EM061K-GL Manual

Quectel EM061K-GL Manual

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EM061K-GL
Hardware Design
LTE-A Module Series
Version: 1.0.0
Date: 2023-02-24
Status: Preliminary

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Summary of Contents for Quectel EM061K-GL

  • Page 1 EM061K-GL Hardware Design LTE-A Module Series Version: 1.0.0 Date: 2023-02-24 Status: Preliminary...

  • Page 2: Legal Notices

    LTE-A Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...

  • Page 3: Third-Party Rights

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    LTE-A Module Series About the Document Revision History Version Date Author Description Fung ZHU/ 2023-02-24 Creation of the document Eysen WANG Fung ZHU/ 1.0.0 2023-02-24 Preliminary Eysen WANG EM061K-GL_Hardware_Design 4 / 75...

  • Page 6: Table Of Contents

    LTE-A Module Series Contents Safety Information ............................3 About the Document ..........................4 Table Index ..............................7 Figure Index ..............................9 Introduction ............................10 1.1. Reference Standards ....................... 13 1.2. Special Marks ........................... 13 Product Overview ..........................15 2.1. Frequency Bands and Functions ..................... 15 2.2.
  • Page 7 LTE-A Module Series 4.4.2. W_DISABLE2# ......................43 4.4.3. WWAN_LED#........................ 44 4.4.4. WAKE_ON_WAN# ......................44 4.4.5. DPR ..........................45 4.4.6. WLAN_PA_EN ......................45 4.5. Antenna Tuner Control Interface* .................... 46 4.5.1.1. Antenna Tuner Control Interface through GPIOs ..........46 4.5.1.2. Antenna Tuner Control Interface through RFFE ..........46 4.6.
  • Page 8 LTE-A Module Series Table Index Table 1: Special Marks ..........................13 Table 2: Frequency Bands and GNSS Functions of EM061K-GL ............. 15 Table 3: Key Features ..........................16 Table 4: Definition of I/O Parameters ......................20 Table 5: Pin Description ..........................20 Table 6: Overview of Operating Modes .....................
  • Page 9 LTE-A Module Series Table 47: 3.3 V Digital I/O Requirements ....................63 Table 45: Electrostatic Discharge Characteristics (Temperature: 25–30 º C, Humidity: 40 ± 5 %) .... 63 Table 46: Operating and Storage Temperatures ..................64 Table 47: Maximum Operating Temperature for Main Chips (Unit: ° C) ............ 65 Table 48: Related Documents ........................
  • Page 10 Figure 22: Reference Circuit of WAKE_ON_WAN# .................. 45 Figure 23: Recommended Circuit of Configuration Pins ................47 Figure 24: Antenna Connectors on EM061K-GL ..................55 Figure 25: Dimensions of the Receptacle (Unit: mm) ................55 Figure 26: Dimensions of Mated Plugs (Ø0.81/Ø1.13 mm Coaxial Cables) (Unit: mm) ......56 Figure 27: Space Factor of Mated Connectors (Ø0.81 mm Coaxial Cables) (Unit: mm) ......

  • Page 11: Introduction

    This document can help you quickly understand the interface specifications, electrical and mechanical details as well as other related information of EM061K-GL. Besides, reference designs will be offered to exemplify diverse applications of the modules. With this hardware design coupled with application notes and user guides, you can use the modules to design and set up mobile applications easily.
  • Page 12 LTE-A Module Series Requirements of 2.1091. 2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body and must not transmit simultaneously with any other antenna or transmitter. 3. A label with the following statements must be attached to the host end product: This device contains FCC ID: XMR2023EM061KGL 4.
  • Page 13 LTE-A Module Series to the OEM the labeling requirements, options and OEM user manual instructions that are required (see next paragraph). For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible when installed in the host, or (2) if the host is marketed so that end users do not have straightforward commonly used methods for access to remove the module so that the FCC ID of the module is visible;...

  • Page 14: Reference Standards

    LTE-A Module Series de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre antenne ou un autre é metteur. The host product shall be properly labeled to identify the modules within the host product. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product;...
  • Page 15 LTE-A Module Series after a model indicates that the sample of the model is currently unavailable. Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same type. […] For example, SDIO_DATA [0:3] refers to all four SDIO pins: SDIO_DATA0, SDIO_DATA1, SDIO_DATA2, and SDIO_DATA3.

  • Page 16: Product Overview

    Product Overview 2.1. Frequency Bands and Functions EM061K-GL are LTE-A/UMTS/HSPA+ wireless communication modules with diversity receiver. They provide data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA networks. They are standard WWAN M.2 Key-B modules. For more details, see PCI Express M.2 Specification Revision 4.0, Version 1.1.

  • Page 17: Key Features

    LTE-A Module Series 2.2. Key Features Table 3: Key Features Feature Details Function Interface PCI Express M.2 Interface ⚫ Supply voltage: 3.135–4.4 V Power Supply ⚫ Typical supply voltage: 3.7 V ⚫ Compliant with ISO/IEC 7816-3 and ETSI and IMT-2000 ⚫...
  • Page 18 GNSS Features ⚫ Data update rate: 1 Hz by default ⚫ Compliant with 3GPP TS 27.007 and 3GPP TS 27.005 AT Commands ⚫ Quectel enhanced AT commands ⚫ Internet Protocol QMI/MBIM/NITZ/HTTP/HTTPS/FTP/LwM2M*/PING* ⚫ Features Supports PAP and CHAP for PPP connections Firmware Upgrade Via USB 2.0 or DFOTA...

  • Page 19: Functional Diagram

    LTE-A Module Series 2.3. Functional Diagram The following figure shows a functional diagram of EM061K-GL. ⚫ Power management ⚫ Baseband ⚫ LPDDR2 SDRAM+NAND flash ⚫ Radio frequency ⚫ M.2 Key-B interface Figure 1: Functional Diagram EM061K-GL_Hardware_Design 18 / 75...

  • Page 20: Pin Assignment

    LTE-A Module Series 2.4. Pin Assignment The following figure shows the pin assignment of the module. It is recommended to keep RESERVED pins unconnected. Please contact Quectel for more details if required. Pin Name Pin Name CONFIG_2 CONFIG_1 RESET# USIM1_DET...

  • Page 21: Pin Description

    LTE-A Module Series 2.5. Pin Description Table 4: Definition of I/O Parameters Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Pull Up Pull Down DC characteristics include power domain and rate current, etc. Table 5: Pin Description Pin Name Description...
  • Page 22 LTE-A Module Series Vmax = 4.4 V Ground Turn on/off the module max = 4.4 V Internally pulled FULL_CARD_ DI, PD High level: turn on min = 1.19 V down with a POWER_OFF# 100 kΩ resistor. Low level: turn off max = 0.2 V Test point must be USB_DP...
  • Page 23 LTE-A Module Series Low-Voltage: Vmin = 1.95 V Vnom = 1.8 V Vmax = 1.65 V min = 1.8 V PCM_DOUT* PCM data output max = 0.4 V Dynamic power reduction min = 1.8 V High level by DI, PU Active low max = 0.4 V default.
  • Page 24 6 This pin is pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-swap is enabled by AT+QSIMDET. For more details, see document [3]. If RFFE_CLK and RFFE_DATA are required, please contact Quectel for more details. EM061K-GL_Hardware_Design...
  • Page 25 LTE-A Module Series min = 1.8 V max = 0.4 V min = 1.8 V ANTCTL0* Antenna GPIO control max = 0.4 V Self-protection of QLN min = 1.8 V DI, PD WLAN_PA_EN* control max = 0.4 V min = 1.8 V ANTCTL1* Antenna GPIO control max = 0.4 V...

  • Page 26: Evb Kit

    LTE-A Module Series 2.6. EVB Kit To help you develop applications conveniently with EM061K-GL, Quectel supplies an evaluation board (5G-M2 EVB). For more details, see document [2]. EM061K-GL_Hardware_Design 25 / 75...

  • Page 27: Operating Characteristics

    LTE-A Module Series Operating Characteristics 3.1. Operating Modes The table below summarizes different operating modes of the module. Table 6: Overview of Operating Modes Mode Details Software is active. The module has registered on the Idle network, and it is ready to send and receive data. Full Functionality Mode Network is connected.

  • Page 28: Sleep Mode

    LTE-A Module Series 3.2. Sleep Mode In sleep mode, DRX (Discontinuous Reception) of the module is able to reduce the power consumption to a minimum level, and DRX cycle index values are broadcasted by the wireless network. The figure below shows the relationship between the DRX run time and the power consumption in sleep mode.

  • Page 29: Airplane Mode

    LTE-A Module Series 3.3. Airplane Mode Execution of AT+CFUN=4 or driving W_DISABLE1# pin low will set the module to airplane mode . For more details, see Chapter 4.4.1. 3.4. Communication Interface with Host The module supports communication with the host through USB interface. USB 2.0 should be reserved for firmware upgrade.

  • Page 30: Voltage Stability Requirements

    LTE-A Module Series The typical output of the power supply is about 3.7 V. PWR_OUT PWR_IN μ 205K 100 nF BOOT 383K 470 μF 220 μF 100 nF 33 pF VSNS PWRGD 100 nF 33 pF 10 pF PWRGD COMP 80.6K RT/CLK 100K...

  • Page 31: Power Supply Voltage Monitoring

    LTE-A Module Series In addition, to guarantee the stability of the power supply, please use a TVS component with a reverse TVS voltage of 5.1 V and a dissipation power higher than 0.5 W. The following figure shows a reference circuit of the VCC.
  • Page 32 LTE-A Module Series Host Module 1.8 V or 3.3 V FULL_CARD_POWER_OFF# GPIO 100K NOTE: The voltage of pin 6 should be not less than 1.19 V when it is at high level. Figure 8: Turn on the Module Using Host GPIO The turn-on timing is illustrated in the following figure.

  • Page 33: Turn Off

    LTE-A Module Series 3.7. Turn Off If the module is turned off using a host GPIO, when VCC is supplied with power, pulling down FULL_CARD_POWER_OFF# pin (≤ 0.2 V) will turn off the module normally. The turn-off timing is illustrated in the following figure. FULL_CARD_ POWER_OFF# Active...
  • Page 34 LTE-A Module Series Host Module PMIC 1.8 V RESET# Reset pulse GPIO – 600 ms 100K Figure 11: Reference Circuit for RESET# with Open Collector Driving Circuit The reset timing is illustrated in the following figure. RESET# Active Restarting Resetting Figure 12: Reset Timing of the Module Table 12: Reset Timing of the Module Symbol...

  • Page 35: Application Interfaces

    LTE-A Module Series Application Interfaces The physical connections and signal levels of the module comply with the PCI Express M.2 specification. This chapter mainly describes the definition and application of the following interfaces/pins of the module: ⚫ (U)SIM interfaces ⚫ USB interface ⚫...

  • Page 36: U)Sim Hot-Swap

    LTE-A Module Series USIM2_CLK DO, PD (U)SIM2 card clock USIM2_RST DO, PD (U)SIM2 card reset USIM2_VDD (U)SIM2 card power supply 4.1.2. (U)SIM Hot-Swap The module supports (U)SIM card hot-swap via (U)SIM card hot-swap detect pins USIM1_DET and USIM2_DET. (U)SIM card insertion can be detected by high/low level. (U)SIM card hot-swap function is disabled by default.

  • Page 37: Normally Closed (U)Sim Card Connector

    LTE-A Module Series NOTE Hot-swap function is invalid if the configured value of <insert_level> is inconsistent with hardware design. The underlined value represents the default configuration. USIM1_DET and USIM2_DET are pulled low by default, and will be internally pulled up to 1.8 V by software configuration only when (U)SIM hot-swap is enabled by AT+QSIMDET.

  • Page 38: U)Sim Card Connector Without Hot-Swap

    LTE-A Module Series USIM_DET from high to low level, and the removal of it will drive USIM_DET from low to high level. ⚫ When the (U)SIM is absent, CD1 is open from CD2 and USIM_DET is at high level. ⚫ When the (U)SIM is inserted, CD1 is shorted to ground and USIM_DET is at low level.

  • Page 39: U)Sim2 Card Compatible Design

    LTE-A Module Series 4.1.6. (U)SIM2 Card Compatible Design It should be noted that if the (U)SIM2 interface is used for an external (U)SIM card, the circuits are the same as those of (U)SIM1 interface. if the (U)SIM2 interface is used for an internal eSIM card, pins 40, 42, 44, 46 and 48 of the module must be kept open.

  • Page 40: Usb Interface

    LTE-A Module Series 4.2. USB Interface The module provides one integrated Universal Serial Bus (USB) interface which complies with USB 2.0 specifications and supports high-speed (480 Mbps) and full-speed (12 Mbps) modes on USB 2.0. The USB interface is used for AT command communication, data transmission, firmware upgrade (USB 2.0 only), software debugging, GNSS NMEA sentence output, and voice over USB*.

  • Page 41: Pcm Interface

    LTE-A Module Series ⚫ For USB 2.0, the trace length should be less than 120 mm, and the differential data pair matching should be less than 2 mm. ⚫ Do not route signal traces under crystals, oscillators, magnetic devices, PCIE, other high-speed and RF signal traces.
  • Page 42 LTE-A Module Series 125 μs PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 18: Primary Mode Timing 125 μs PCM_CLK PCM_SYNC PCM_DOUT PCM_DIN Figure 19: Auxiliary Mode Timing The following table shows the pin definition of PCM interface which can be applied to audio codec design. Table 15: Pin Definition of PCM Interface Pin No.

  • Page 43: Control And Indication Interfaces

    LTE-A Module Series The clock and mode can be configured by AT command. The default configuration is master mode using short frame synchronization format with 2048 kHz PCM_CLK and 8 kHz PCM_SYNC. For more details, see document [3]. 4.4. Control and Indication Interfaces Table 16: Pin Definition of Control and Indication Interfaces Pin No.

  • Page 44: W_Disable2

    LTE-A Module Series AT+CFUN=0 Low Level AT+CFUN=1 Disabled Airplane mode AT+CFUN=4 4.4.2. W_DISABLE2# The module provides a W_DISABLE2# pin to disable or enable the GNSS function. The W_DISABLE2# pin is pulled up by default. Driving it low will disable the GNSS function. The GNSS function can also be controlled through software AT commands.

  • Page 45: Wwan_Led

    LTE-A Module Series 4.4.3. WWAN_LED# The WWAN_LED# signal is used to indicate RF status of the module, and its sink current is up to 10 mA. To reduce power consumption of the LED, a current-limited resistor must be placed in series with the LED, as illustrated in the figure below.

  • Page 46: Dpr

    LTE-A Module Series Host Module VCC_IO_HOST WAKE_ON_WAN# GPIO Wake up the host NOTE: The voltage level on VCC_IO_HOST depends on the host side due to the open drain in pin 23. Figure 22: Reference Circuit of WAKE_ON_WAN# 4.4.5. DPR The module provides a DPR (Dynamic Power Reduction) pin for body SAR (Specific Absorption Rate) detection.

  • Page 47: Antenna Tuner Control Interface

    Pin No. Pin Name Description Comment RFFE_CLK DO, PD Used for external MIPI IC control RFFE_DATA DIO, PD Used for external MIPI IC control NOTE If RFFE_CLK and RFFE_DATA are required, please contact Quectel for more details. EM061K-GL_Hardware_Design 46 / 75...

  • Page 48: Configuration Pins

    Config_3 Module Type and Port (Pin 21) (Pin 69) (Pin 75) (Pin 1) Main Host Interface Configuration Quectel defined Table 27: Pin Definition of Configuration Pins Pin No. Pin Name Description CONFIG_0 Not connected internally CONFIG_1 Connected to GND internally...

  • Page 49: Antenna Interfaces

    LTE-A Module Series Antenna Interfaces Appropriate antenna type and design should be used with matched antenna parameters according to specific application. It is required to perform a comprehensive functional test for the RF design before mass production of terminal products. The entire content of this chapter is provided for illustration only. Analysis, evaluation and determination are still necessary when designing target products.
  • Page 50 LTE-A Module Series WCDMA B6 830–840 875–885 WCDMA B8 880–915 925–960 WCDAM B19 830–845 875–890 LTE-FDD B1 1920–1980 2110–2170 – – LTE-FDD B2 1850 1910 1930 1990 LTE-FDD B3 1710–1785 1805–1880 – – LTE-FDD B4 1710 1755 2110 2155 LTE-FDD B5 824–849 869–894 LTE-FDD B7...

  • Page 51: Tx Power

    LTE-TDD B39 1880–1920 1880–1920 LTE-TDD B40 2300–2400 2300–2400 LTE-TDD B41 2496–2690 2496–2690 5.1.2. Tx Power Table 30: EM061K-GL Conducted RF Output Power Frequency Bands Modulation Max. Min. Comment WCDMA B1 BPSK 23 dBm ± 2 dB < -50 dBm WCDMA B2 BPSK 23 dBm ±...

  • Page 52: Rx Sensitivity

    < -40 dBm 10 MHz, 1RB LTE-TDD B41 QPSK 23 dBm ± 1 dB < -40 dBm 10 MHz, 1RB 5.1.3. Rx Sensitivity Table 31: EM061K-GL Rx Sensitivity Frequency Bands Primary Diversity SIMO 3GPP (SIMO) (dBm) Comment WCDMA B1 -106.7 WCDMA B2 -104.7...
  • Page 53 LTE-A Module Series WCDMA B8 -103.7 WCDMA B19 -106.7 LTE-FDD B1 -96.3 10 MHz LTE-FDD B2 -94.3 10 MHz LTE-FDD B3 -93.3 10 MHz LTE-FDD B4 -96.3 10 MHz LTE-FDD B5 -94.3 10 MHz LTE-FDD B7 -94.3 10 MHz LTE-FDD B8 -93.3 10 MHz LTE-FDD B12...

  • Page 54: Gnss

    LTE-A Module Series LTE-TDD B40 -96.3 10 MHz LTE-TDD B41 -94.3 20 MHz 5.2. GNSS 5.2.1. Antenna Interface & Frequency Bands The module includes a fully integrated global navigation satellite system solution. The module supports standard NMEA 0183 protocol, and outputs NMEA sentences at 1 Hz data update rate via USB interface by default.

  • Page 55: Antenna Design Requirements

    LTE-A Module Series Autonomous Warm start @ open sky XTRA enabled Autonomous Hot start @ open sky XTRA enabled Autonomous Accuracy CEP-50 @ open sky NOTE Tracking sensitivity: the minimum GNSS signal power at which the module can maintain lock (keep positioning for at least 3 minutes continuously).

  • Page 56: Antenna Connectors

    5.4. Antenna Connectors 5.4.1. Antenna Connector Location The antenna connector locations are shown below. Figure 24: Antenna Connectors on EM061K-GL 5.4.2. Antenna Connector Specifications The module is mounted with standard 2 mm × 2 mm receptacle antenna connectors for convenient antenna connection.

  • Page 57: Antenna Connector Installation

    LTE-A Module Series Table 35: Major Specifications of the RF Connectors Item Specification Nominal Frequency Range DC to 6 GHz 50 Ω Nominal Impedance Temperature Rating -40 to +85 ° C Meet the requirements of: Voltage Standing Wave Ratio (VSWR) Max.
  • Page 58 Ø 0.81 mm coaxial cable. Figure 27: Space Factor of Mated Connectors (Ø0.81 mm Coaxial Cables) (Unit: mm) The following figure illustrates the connection between the receptacle RF connector on EM061K-GL and the mated plugs using a Ø 1.13 mm coaxial cable.

  • Page 59: Electrical Characteristics And Reliability

    LTE-A Module Series Electrical Characteristics and Reliability 6.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the modules are listed in the following table. Table 36: Absolute Maximum Ratings Parameter Min. Typ.

  • Page 60: Power Consumption

    LTE-A Module Series 6.3. Power consumption Table 38: Averaged Power Consumption Description Condition Typ. Unit μA OFF state Power down AT+CFUN=0 @ USB2.0 Suspend AT+CFUN=4 @ USB2.0 Suspend Sleep State WCDMA PF = 64 @ USB2.0 Suspend LTE-FDD PF = 64 @ USB2.0 Suspend LTE-TDD PF = 64 @ USB2.0 Suspend WCDMA PF = 64 (B1 CH10700 USB Disconnect) WCDMA PF = 64 (B1 CH10700 USB2.0 Connect)
  • Page 61 LTE-A Module Series WCDMA B5 HSUPA CH4407 @ TBD dBm WCDMA B6 HSDPA CH4400 @ TBD dBm WCDMA B6 HSUPA CH4400 @ TBD dBm WCDMA B8 HSDPA CH3012 @ TBD dBm WCDMA B8 HSUPA CH3012 @ TBD dBm WCDMA B19 HSDPA CH738 @ TBD dBm WCDMA B19 HSUPA CH738 @ TBD dBm LTE-FDD B1 CH300 @ TBD dBm LTE-FDD B2 CH900 @ TBD dBm...
  • Page 62 Power consumption test is carried out under 3.7 V, 25 ° C with 5G-M2 EVB, and with thermal dissipation measures. For more details about current consumption, please contact Quectel Technical Support to obtain the power consumption test report of the modules.

  • Page 63: Digital I/O Characteristics

    LTE-A Module Series 6.4. Digital I/O Characteristics Table 39: (U)SIM Low-voltage I/O Requirements Parameter Description Min. Max. Unit High-level input voltage 0.7 × USIM_VDD USIM_VDD + 0.3 Low-level input voltage -0.3 0.2 × USIM_VDD High-level output voltage 0.8 × USIM_VDD USIM_VDD Low-level output voltage Table 40: (U)SIM High-voltage I/O Requirements...

  • Page 64: Esd Protection

    LTE-A Module Series Table 42: 3.3 V Digital I/O Requirements Parameter Description Min. Max. Unit 3.3 V Power domain 3.135 3.464 High-level input voltage Low-level input voltage -0.5 6.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative.

  • Page 65: Operating And Storage Temperatures

    LTE-A Module Series 6.6. Operating and Storage Temperatures Table 44: Operating and Storage Temperatures Parameter Min. Typ. Max. Unit Operating Temperature Range º C Extended Temperature Range º C Storage temperature Range º C 6.7. Thermal Dissipation Figure 29: Distribution of Heat Source Chips Inside the Module The module offers the best performance when all internal IC chips are working within their operating temperatures.

  • Page 66: Notification

    LTE-A Module Series always work within the recommended operating temperature range. The following principles for thermal consideration are provided for reference: ⚫ Keep the module away from heat sources on your PCB, especially high-power components such as processor, power amplifier, and power supply. ⚫...

  • Page 67: Coating

    LTE-A Module Series Please follow the principles below in the module application. 6.8.1. Coating If a conformal coating is necessary for the module, do NOT use any coating material that may chemically react with the PCB or shielding cover, and prevent the coating material from flowing into the module. 6.8.2.

  • Page 68: Mechanical Information And Packaging

    LTE-A Module Series Mechanical Information and Packaging This chapter mainly describes mechanical dimensions and packaging specifications of EM061K-GL. All dimensions are measured in mm, and the dimensional tolerances are ± 0.15 mm unless otherwise specified. 7.1. Mechanical Dimensions Figure 31: Module Top and Side Dimensions...

  • Page 69: Top And Bottom Views

    Images above are for illustration purpose only and may differ from the actual modules. For authentic appearance and label, please refer to the module received from Quectel. 7.3. M.2 Connector EM061K-GL adopts a standard PCI Express M.2 connector which compiles with the directives and standards listed in PCI Express M.2 Specification. 7.4. Packaging This chapter describes only the key parameters and process of packaging.

  • Page 70: Packaging Process

    LTE-A Module Series Figure 33: Blister Tray Dimension Drawing 7.4.2. Packaging Process EM061K-GL_Hardware_Design 69 / 75...
  • Page 71 LTE-A Module Series Each blister tray packs 10 modules. Stack 10 blister Packing 11 blister trays together and then put trays with modules together, and put 1 empty blister blister trays into a conductive bag, seal and pack tray on the top. the conductive bag.

  • Page 72: Appendix References

    LTE-A Module Series Appendix References Table 46: Related Documents Document Name [1] Quectel_EM061K-GL_CA_Feature [2] Quectel_5G-M2_EVB_User_Guide [3] Quectel_EG06xK&Ex120K&EM060K_Series_AT_Commands_Manual [4] Quectel_LTE-A(Q)_Series_GNSS_Application_Note Table 47: Terms and Abbreviations Abbreviation Description Average Power Tracking ATtention Baseband BeiDou Navigation Satellite System BIOS Basic Input/Output System Bit(s) per second BPSK Binary Phase Shift Keying CBRS...
  • Page 73 LTE-A Module Series Downlink Dynamic Power Reduction Discontinuous Reception Diversity Receive External Bus Interface EIRP Equipment Isotropic Radiated Power Electrostatic Discharge Equivalent Series Resistance Frequency Division Duplex GLONASS Global Navigation Satellite System (Russia) GNSS Global Navigation Satellite System Global Positioning System Global System for Mobile Communications HSDPA High Speed Downlink Packet Access...
  • Page 74 LTE-A Module Series Mbps Megabits per second Multiple Chip Package Mobile Equipment MFBI Multi-Frequency Band Indicator MIPI Mobile Industry Processor Interface MIMO Multiple-Input Multiple-Output MLCC Multi-layer Ceramic Capacitor MMPA Multimode Multiband Power Amplifier Mobile Originated Most Significant Bit Mobile Terminated NAND NON-AND Not Connected...
  • Page 75 LTE-A Module Series Point-to-Point Protocol Primary Receive Qualcomm Low-noise Amplifer Qualcomm MSM (Mobile Station Modems) Interface QPSK Quadrature Phase Shift Keying Resource Block Radio Frequency RFFE RF Front-End Relative Humility Receive Specific Absorption Rate SDRAM Synchronous Dynamic Random-Access Memory Short Message Service SPMI System Power Management Interface Transmission Control Protocol...
  • Page 76 LTE-A Module Series High-level Input Voltage Low-level Input Voltage High-level Output Voltage Low-level Output Voltage WCDMA Wideband Code Division Multiple Access Wafer-scale RF transceiver Crystal Oscillator EM061K-GL_Hardware_Design 75 / 75...