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Quectel FCS950R Hardware Design

Quectel FCS950R Hardware Design

Wi-fi & bluetooth module series
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FCS950R
Hardware Design
Wi-Fi&Bluetooth Module Series
Version: 1.0.0
Date: 2023-06-13
Status: Preliminary

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Summary of Contents for Quectel FCS950R

  • Page 1 FCS950R Hardware Design Wi-Fi&Bluetooth Module Series Version: 1.0.0 Date: 2023-06-13 Status: Preliminary...

  • Page 2: Legal Notices

    Wi-Fi&Bluetooth Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai...

  • Page 3: Third-Party Rights

    Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel or any third party in advertising, publicity, or other aspects.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal shall notify users and operating personnel of the following safety information by incorporating these guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Wi-Fi&Bluetooth Module Series About the Document Revision History Version Date Author Description 2023-06-13 Jason YI Creation of the document 1.0.0 2023-06-13 Jason YI Preliminary FCS950R_Hardware_Design 4 / 49...

  • Page 6: Table Of Contents

    Wi-Fi&Bluetooth Module Series Contents Safety Information ..............................About the Document .............................. Contents ..................................Table Index ................................Figure Index ................................Introduction ..............................1.1. Special Mark ............................Product Overview ............................2.1. Key Features ............................2.2. Functional Diagram ..........................RF Performances ............................3.1. Wi-Fi Performances ..........................
  • Page 7 Wi-Fi&Bluetooth Module Series 6.3. Top and Bottom Views ........................Storage, Manufacturing & Packaging ....................... 7.1. Storage Conditions ..........................7.2. Manufacturing and Soldering ......................7.3. Packaging Specifications ........................7.3.1. Carrier Tape ..........................7.3.2. Plastic Reel ..........................7.3.3. Mounting Direction ........................7.3.4. Packaging Process .........................
  • Page 8 Wi-Fi&Bluetooth Module Series Table Index Table 1: Special Mark ............................... Table 2: Basic Information ............................Table 3: Key Features............................. Table 4: Wi-Fi Performances ..........................Table 5: Bluetooth Performances .......................... Table 6: I/O Parameter Definition .......................... Table 7: Pin Description ............................Table 8: SDIO Interface Trace Length Inside the Module (Unit: mm) ..............
  • Page 9 Wi-Fi&Bluetooth Module Series Figure Index Figure 1: Functional Diagram ..........................Figure 2: Pin Assignment (Top View) ........................Figure 3: Reference Design for Power Supply ....................Figure 4: Power-up Timing ............................. Figure 5: Wi-Fi Application Interface Connection ....................Figure 6: SDIO Interface Connection (1-bit Mode) ..................... Figure 7: SDIO Interface Connection (4-bit Mode) .....................

  • Page 10: Introduction

    Wi-Fi&Bluetooth Module Series Introduction This document defines the FCS950R and describes its air interfaces and hardware interfaces, which are connected with your application. The document provides a quickly insight into interface specifications, RF performance, electrical and mechanical details, as well as other related information of the module.

  • Page 11: Product Overview

    Wi-Fi&Bluetooth Module Series Product Overview FCS950R is a low-energy and high-performance IEEE 802.11a/b/g/n/ac Wi-Fi 5 and Bluetooth 4.2 module supporting 2.4 GHz&5 GHz dual-band and 1T1R mode with maximum data transmission rate up to 433.3 Mbps. It provides Wi-Fi functions with an SDIO 3.0 interface, and Bluetooth functions with a UART and a PCM interface.

  • Page 12: Key Features

    Typ.: 1.8/3.3 V ⚫ Operating temperature : 0 ° C to +70 ° C Temperature Ranges ⚫ Storage temperature: -55 ° C to +125 ° C EVB Kit FCS950R-M.2 RF Antenna Interface Wi-Fi/Bluetooth Antenna ⚫ ANT_WIFI/BT Interface ⚫ 50 Ω characteristic impedance...

  • Page 13: Functional Diagram

    Wi-Fi&Bluetooth Module Series 2.2. Functional Diagram The main components of the block diagram are explained below. Main chip Radio frequency 3.Peripheral interfaces FCS950R_Hardware_Design 12 / 49...

  • Page 14: Rf Performances

    Wi-Fi&Bluetooth Module Series RF Performances 3.1. Wi-Fi Performances Table 4: Wi-Fi Performances Operating Frequency ⚫ 2.4 GHz: 2.400–2.4835 GHz 5 GHz: 5.150–5.850 GHz ⚫ Modulation DBPSK, DQPSK, CCK, BPSK, QPSK, 16QAM, 64QAM, 256QAM Operating Mode ⚫ ⚫ Transmission Data Rate ⚫...
  • Page 15 Wi-Fi&Bluetooth Module Series 21.5 802.11n, HT40 @ MCS 0 ≤ -5 dB 802.11n, HT40 @ MCS 7 ≤ -28 dB 16.5 802.11a @ 6 Mbps ≤ -5 dB 802.11a @ 54 Mbps ≤ -25 dB 802.11n, HT20 @ MCS 0 ≤...

  • Page 16: Bluetooth Performances

    Wi-Fi&Bluetooth Module Series 3.2. Bluetooth Performances Table 5: Bluetooth Performances Operating Frequency 2.400–2.4835 GHz Modulation GFSK, π/4-DQPSK, 8-DPSK Operating Mode ⚫ Classic Bluetooth (BR + EDR) Bluetooth Low Energy (BLE) ⚫ Typ.; Unit: dBm; Tolerance: ± 2 dB Condition (VBAT = 3.3 V; Temp.: 25 ° C) Transmitting Power Receiving Sensitivity EDR (π/4-DQPSK)

  • Page 17: Application Interfaces

    Wi-Fi&Bluetooth Module Series Application Interfaces 4.1. Pin Assignment Figure 2: Pin Assignment (Top View) NOTE Keep all RESERVED and unused pins unconnected. All GND pins should be connected to ground. FCS950R_Hardware_Design 16 / 49...

  • Page 18: Pin Description

    Wi-Fi&Bluetooth Module Series 4.2. Pin Description Table 6: I/O Parameter Definition Type Description Analog Input/Output Digital Input Digital Output Digital Input/Output Power Input DC characteristics include power domain and rate current. Table 7: Pin Description Power Supply Pin Name Pin No. Description Comment Characteristics...
  • Page 19 Wi-Fi&Bluetooth Module Series WLAN_WAKE Wi-Fi wakes up host Active high. NC (1-bit mode) SDIO_DATA2 SDIO data bit 2 (4-bit mode) NC (1-bit mode) SDIO_DATA3 SDIO data bit 3 (4-bit mode) Supports 1-bit or SDIO_CMD SDIO command 4-bit mode. SDIO_CLK SDIO clock SDIO_DATA0 SDIO data bit 0 IRQ (1-bit mode)
  • Page 20 Wi-Fi&Bluetooth Module Series Bluetooth UART BT_RXD receive Clear to send signal BT_CTS to the module RF Antenna Interface Pin Name Pin No. Description Comment Characteristics Wi-Fi/Bluetooth 50 Ω characteristic ANT_WIFI/BT antenna interface impedance. Other Interface Pin Name Pin No. Description Comment Characteristics External...

  • Page 21: Power Supply

    Wi-Fi&Bluetooth Module Series 4.3. Power Supply The module is powered by VBAT, and it should use a power supply chip that can provide sufficient current of at least 0.6 A. To ensure better power supply performance, it is recommended to parallel a 22 μF decoupling capacitor and three filter capacitors (100 nF, 33 pF and 10 pF) near the module’s VBAT pin.

  • Page 22: Wi-Fi Application Interfaces

    Wi-Fi&Bluetooth Module Series 4.4. Wi-Fi Application Interfaces Wi-Fi application interface connection between the module and the host is illustrated in the figure below. Figure 5: Wi-Fi Application Interface Connection 4.4.1. SDIO Interface The module supports 1-bit or 4-bit SDIO 3.0 interface. It can detect the SDIO mode of the host automatically when it is connected.
  • Page 23 Wi-Fi&Bluetooth Module Series Figure 7: SDIO Interface Connection (4-bit Mode) To ensure compliance of interface design with the SDIO 3.0 specification, it is recommended to adopt the following principles: ⚫ Add 0 Ω resistors in series and 5.6 pF capacitors (not mounted by default) between the module and the host.

  • Page 24: Bluetooth Application Interfaces

    Wi-Fi&Bluetooth Module Series Table 8: SDIO Interface Trace Length Inside the Module (Unit: mm) Pin No. Pin Name Length SDIO_CMD 10.90 SDIO_CLK 10.87 SDIO_DATA3 10.92 SDIO_DATA2 10.77 SDIO_DATA0 10.85 SDIO_DATA1 10.89 4.5. Bluetooth Application Interfaces Bluetooth application interface connection between the module and the host is illustrated in the figure below.
  • Page 25 Wi-Fi&Bluetooth Module Series ⚫ Fill audio gain to 13-bit sampling PCM master clock output: 64 kHz, 128 kHz, 256 kHz or 512 kHz ⚫ ⚫ SCO/eSCO link PCM interface timing is shown below: Figure 9: PCM interface Timing (Long Frame Sync) Figure 10: PCM interface Timing (Short Frame Sync) FCS950R_Hardware_Design 24 / 49...

  • Page 26: Uart

    Wi-Fi&Bluetooth Module Series Table 9: PCM Interface Clock Specifications Parameter Description Min. Typ. Max. Unit Frequency of PCM_CLK (master) PCM_CLK Frequency of PCM_SYNC (master) PCM_SYNC Frequency of PCM_CLK (slave) PCM_CLK Frequency of PCM_SYNC (slave) PCM_SYNC Data size bits Number of slots per frame slots Table 10: PCM Interface Timing Parameter...
  • Page 27 Wi-Fi&Bluetooth Module Series Figure 11: UART Connection with Host Supporting Software Flow Control The UART connection between the module and the host supporting hardware flow control is as below: Figure 12: UART Connection with Host Supporting Hardware Flow Control The UART connection between the module and the host not supporting flow control is as below: Figure 13: UART Connection with Host Not Supporting Flow Control FCS950R_Hardware_Design 26 / 49...

  • Page 28: Rf Antenna Interface

    Wi-Fi&Bluetooth Module Series NOTE 1. When paired with Quectel's LTE modules, you need to pay attention to the input and output of BT_CTS and BT_RTS. 2. Reserve 0 Ω resistors between the module and host for Bluetooth signaling test. 4.6. RF Antenna Interface Appropriate antenna type and design should be used with matched antenna parameters according to specific application.

  • Page 29: Antenna Design Requirements

    Wi-Fi&Bluetooth Module Series 4.6.2. Antenna Design Requirements Table 11: Antenna Design Requirements Parameter Requirement ⚫ 2.400–2.4835 Frequency Ranges (GHz) ⚫ 5.150–5.850 Cable Insertion Loss (dB) < 1 VSWR ≤ 2 (Typ.) MAX Gain (dBi) 1.14 Max Input Power (W) Input Impedance (Ω) Polarization Type Vertical 4.6.3.
  • Page 30 Wi-Fi&Bluetooth Module Series Figure 16: Coplanar Waveguide Design on a 2-layer PCB Figure 17: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 18: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) To ensure RF performance and reliability, follow the principles below in RF layout design: ⚫...

  • Page 31: Rf Connector Recommendation

    Wi-Fi&Bluetooth Module Series right-angle traces should be changed to curved ones. The recommended trace angle is 135° . ⚫ There should be clearance under the signal pin of the antenna connector or solder joint. ⚫ The reference ground of RF traces should be complete. Meanwhile, adding some ground vias around RF traces and the reference ground could help to improve RF performance.
  • Page 32 Wi-Fi&Bluetooth Module Series U.FL-LP series mated plugs listed in the following figure can be used to match the U.FL-R-SMT connector. Figure 20: Specifications of Mated Plugs The following figure describes the space factor of mated connectors. Figure 21: Space Factor of Mated Connectors (Unit: mm) For more details, please visit https://www.hirose.com.

  • Page 33: Electrical Characteristics & Reliability

    Wi-Fi&Bluetooth Module Series Electrical Characteristics & Reliability 5.1. Absolute Maximum Ratings Table 12: Absolute Maximum Ratings (Unit: V) Parameter Min. Max. VBAT VDD_IO Voltage at Digital Pins 5.2. Power Supply Ratings Table 13: Module Power Supply Ratings (Unit: V) Parameter Description Condition Min.

  • Page 34: Power Consumption

    Wi-Fi&Bluetooth Module Series 5.3. Power Consumption Wi-Fi Power Consumption 5.3.1. Table 14: Power Consumption in Low Power Modes Mode Typ. Unit Light Sleep Deep Sleep DTIM1 DTIM3 Table 15: Power Consumption in Non-signalling Mode (Unit: mA) Condition VBAT VDD_IO Tx @ 1 Mbps 0.06 802.11b Tx @ 11 Mbps...

  • Page 35: Bluetooth Power Consumption

    Wi-Fi&Bluetooth Module Series Tx HT40 @ MCS 7 0.34 Tx VHT20 @ MCS 0 0.085 Tx VHT20 @ MCS 8 0.272 Tx VHT40 @ MCS 0 0.117 802.11ac Tx VHT40 @ MCS 9 0.365 Tx VHT80 @ MCS 0 0.17 Tx VHT80 @ MCS 9 0.407 5.3.2.

  • Page 36: Esd Protection

    Wi-Fi&Bluetooth Module Series Table 18: VDD_IO Low Level I/O Requirements (Unit: V) Parameter Description Min. Max. High-level input voltage Low-level input voltage High-level output voltage 1.62 Low-level output voltage 0.18 5.5. ESD Protection Static electricity occurs naturally and it may damage the module. Therefore, applying proper ESD countermeasures and handling methods is imperative.
  • Page 37 Wi-Fi&Bluetooth Module Series Fasten the heatsink with four screws to ensure that it is in close contact with the module to prevent the heatsink from falling off during the drop, vibration test, or transportation. Figure 22: Placement and Fixing of the Heatsink FCS950R_Hardware_Design 36 / 49...

  • Page 38: Mechanical Information

    Wi-Fi&Bluetooth Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ± 0.2 mm unless otherwise specified. 6.1. Mechanical Dimensions Figure 23: Top and Side Dimensions FCS950R_Hardware_Design 37 / 49...
  • Page 39 Wi-Fi&Bluetooth Module Series Figure 24: Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to the JEITA ED-7306 standard. FCS950R_Hardware_Design 38 / 49...

  • Page 40: Recommended Footprint

    Wi-Fi&Bluetooth Module Series 6.2. Recommended Footprint Figure 25: Recommended Footprint NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. FCS950R_Hardware_Design 39 / 49...

  • Page 41: Top And Bottom Views

    6.3. Top and Bottom Views Figure 26: Top and Bottom Views NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. FCS950R_Hardware_Design 40 / 49...

  • Page 42: Storage, Manufacturing & Packaging

    Wi-Fi&Bluetooth Module Series Storage, Manufacturing & Packaging 7.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ± 5 ° C and the relative humidity should be 35–60 %.

  • Page 43: Manufacturing And Soldering

    Wi-Fi&Bluetooth Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. If shorter baking time is desired, see IPC/JEDEC J-STD-033 for the baking procedure.
  • Page 44 5. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 6. Due to the complexity of the SMT process, please contact Quectel Technical Support in advance for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic soldering) that is not mentioned in document [2].

  • Page 45: Packaging Specifications

    Wi-Fi&Bluetooth Module Series 7.3. Packaging Specifications This chapter describes only the key parameters and process of packaging. All figures below are for reference only. The appearance and structure of the packaging materials are subject to the actual delivery. The module adopts carrier tape packaging and details are as follow: 7.3.1.

  • Page 46: Plastic Reel

    Wi-Fi&Bluetooth Module Series 7.3.2. Plastic Reel Figure 29: Plastic Reel Dimension Drawing Table 21: Plastic Reel Dimension Table (Unit: mm) øD1 øD2 24.5 7.3.3. Mounting Direction Figure 30: Mounting Direction FCS950R_Hardware_Design 45 / 49...

  • Page 47: Packaging Process

    Wi-Fi&Bluetooth Module Series 7.3.4. Packaging Process Place the module into the carrier tape and use the cover tape to cover it; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection. 1 plastic reel can load 500 modules.

  • Page 48: Appendix References

    Wi-Fi&Bluetooth Module Series Appendix References Table 22: Related Documents Document Name [1] Quectel_RF_Layout_Application_Note [2] Quectel_Module_SMT_Application_Note Table 23: Terms and Abbreviations Abbreviation Description 1T1R One Transmit One Receive Access Point Bluetooth Low Energy BPSK Binary Phase Shift Keying Basic Rate Complementary Code Keying Clear To Send DBPSK Differential Binary Phase Shift Keying...
  • Page 49 Wi-Fi&Bluetooth Module Series Error Vector Magnitude GFSK Gaussian Frequency Shift Keying Ground GPIO General-Purpose Input/Output Host Controller Interface High Throughput IEEE Institute of Electrical and Electronics Engineers Input/Output Interrupt Request Leadless Chip Carrier (package) Least Significant Bit Long-Term Evolution Mbps Million Bits Per Second Modulation and Coding Scheme Most Significant Bit...
  • Page 50 Voltage Standing Wave Ratio 9 Worning 9.1. Important Notice to OEM integrators Product Marketing Name：Quectel FCS950R This module is limited to OEM installation ONLY. This module is limited to installation in fixed applications, according to Part 2.1091(b). This module has been tested and found to comply with the limits for Part 15.247 & 15.407 of the FCC Rules.

  • Page 51: Antenna Installation

    Important Note Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as described by the instructions, require that the host product manufacturer must notify to Quectel Wireless Solutions Co., Ltd.. that they wish to change the antenna trace design. In this case, a Class II permissive change application is required to be filed by the USI, or the host manufacturer can take responsibility through the change in FCC ID (new application) procedure followed by a Class II permissive change application.
  • Page 52 above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed. Radiation Exposure Statement This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator &...