7.2. Recommended Footprint
NOTE
1. Keep at least 3 mm between the module and other components on the motherboard to improve
soldering quality and maintenance convenience.
2. The size of the four GND pads in the center of the module is larger than 2 × 2 mm, and therefore
each GND pad needs separate apertures in the stencil design. For each separate aperture, the
minimum size is 0.5 mm, the maximum size is 1.5 mm, and the minimum spacing is 0.2 mm.
SC200K_Series_Hardware_Design
Figure 45: Recommended Footprint (Top View)
Smart Module Series
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