Heat Dissipation - Huawei X6800 Technical Manual

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HUAWEI X6800 Server

Technical White Paper

Figure 2-1 X6800 system architecture

2.2 Heat Dissipation

Issue 02 (2019-03-13)

The system draws in air from the front of the chassis, delivers the cool air to the server

nodes, hard disks, processors, dual in-line memory modules (DIMMs), backplane, and

fan modules, and then discharges warm air through the rear of the chassis.

Two PSUs are installed in each side of the server chassis. Separated ventilation channels

are reserved to deliver the return air from the PSU fans for cooling.

The system fans implement cooling of the management boards and I/O boards on the fan

modules.

The high-pressure counter-rotating fans offer 10% higher air volume than common fans.

The refined air channels implement concentrated cooling of heat-sensitive devices. The

optimal distribution of temperature sensors covers all areas of high heat concentration

(server hotspots), facilitating accurate fan speed adjustment. The cellular design on the

panel offers a porosity of 66%, which is 10% higher than that of square holes. The fans

2 System Design

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