Table of Contents
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HUAWEI X6800 Server
Technical White Paper
Contents
Contents
About This Document.....................................................................................................................ii
1 Overview......................................................................................................................................... 1
1.1 Product Positioning.........................................................................................................................................................1
1.2 Features...........................................................................................................................................................................2
2 System Design................................................................................................................................4
2.1 Architecture Design........................................................................................................................................................ 4
2.2 Heat Dissipation............................................................................................................................................................. 5
2.3 Management and Monitoring......................................................................................................................................... 6
2.4 Advantages..................................................................................................................................................................... 7
3 Hardware Description.................................................................................................................. 8
3.1 Appearance..................................................................................................................................................................... 8
3.2 Components.................................................................................................................................................................. 12
3.3 Server Node.................................................................................................................................................................. 13
3.4 PCIe.............................................................................................................................................................................. 14
3.5 Fan Module...................................................................................................................................................................15
3.6 PSU............................................................................................................................................................................... 16
3.7 Backplane..................................................................................................................................................................... 19
3.8 System Management Board and Fan Switch Board..................................................................................................... 20
4 Security Management................................................................................................................. 23
4.1 Compute Node.............................................................................................................................................................. 23
4.2 MM............................................................................................................................................................................... 23
5 Management................................................................................................................................. 25
5.1 iBMC Features..............................................................................................................................................................25
5.2 HMM Features..............................................................................................................................................................27
5.3 Management Principles................................................................................................................................................ 27
5.4 Management Modes..................................................................................................................................................... 28
6 Technical Specifications.............................................................................................................31
6.1 Chassis Specifications.................................................................................................................................................. 31
6.2 Node Specifications...................................................................................................................................................... 33
6.3 Power Supply and Power..............................................................................................................................................33
6.4 Environmental Specifications.......................................................................................................................................34
Issue 02 (2019-03-13)
Copyright © Huawei Technologies Co., Ltd.
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