Table Of Contents - Kontron COMe-mSP1 User Manual

» Table of Contents «

1 User Information..................................................................................6
1.1 About This Document.................................................................................................................... 6
1.2 Copyright Notice.......................................................................................................................... 6
1.3 Trademarks................................................................................................................................. 6
1.4 Standards................................................................................................................................... 6
1.5 Warranty.................................................................................................................................... 7
1.6 Technical Support......................................................................................................................... 7
2 Introduction........................................................................................8
2.1 Product Description...................................................................................................................... 8
2.2 Naming clarification..................................................................................................................... 8
2.3 Understanding COM Express®
2.4 COM Express® Documentation....................................................................................................... 10
2.5 COM Express® Benefits................................................................................................................ 10
3 Product Specification...........................................................................11
3.1 Modules & Accessories................................................................................................................. 11
3.2 Functional Specification............................................................................................................... 13
3.3 Block Diagram............................................................................................................................ 17
3.4 Electrical Specification................................................................................................................ 18
3.4.1 Supply Voltage........................................................................................................................... 18
3.4.2 Power Supply Rise
3.4.3 Supply Voltage Ripple.................................................................................................................. 18
3.4.4 Power Consumption..................................................................................................................... 18
3.4.5 ATX Mode.................................................................................................................................. 19
3.4.6 Single Supply Mode..................................................................................................................... 19
3.5 Power Control............................................................................................................................ 20
3.6 Environmental Specification......................................................................................................... 21
3.6.1 Temperature Specification............................................................................................................ 21
3.6.2 Humidity................................................................................................................................... 21
3.7 Standards and Certifications......................................................................................................... 22
3.8 MTBF........................................................................................................................................ 24
3.9 Mechanical Specification.............................................................................................................. 25
3.9.1 Module Dimension...................................................................................................................... 25
3.9.2 Height on Top............................................................................................................................ 25
3.9.3 Height on Bottom....................................................................................................................... 25
3.9.4 Mechanical Drawing.................................................................................................................... 25
3.10 Thermal Management.................................................................................................................. 26
3.11 Heatspreader............................................................................................................................. 26
4 Features and
4.1 Onboard SSD.............................................................................................................................. 27
4.2 LPC.......................................................................................................................................... 28
Functionality....................................................................................... 9
Time................................................................................................................ 18
Interfaces.......................................................................27
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