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bq76920 EVM Quick Start Guide
2
bq76920 EVM Quick Start Guide
2.1
Before You Begin
The following warnings and cautions are noted for the safety of anyone using or working close to the
bq76920 EVM. Observe all safety precautions.
!
The circuit module has signal traces, components, and component leads on the
bottom of the board. This may result in exposed voltages, hot surfaces or sharp
edges. Do not reach under the board during operation.
The circuit module may be damaged by over temperature. To avoid damage,
monitor the temperature during evaluation and provide cooling, as needed, for
your system environment.
Some power supplies can be damaged by application of external voltages. If
using more than 1 power supply, check your equipment requirements and use
blocking diodes or other isolation techniques, as needed, to prevent damage to
your equipment.
The communication interface is not isolated on the EVM. Be sure no ground
potential exists between the computer and the EVM. Also be aware that the
computer is referenced to the Battery- potential of the EVM.
2.2
Quick Start
Determine if you wish to evaluate the AFE alone or with the gauge. For the AFE, proceed to
For the gauge, skip to
2.2.1
AFE Quick Start
These steps describe quick connection of the bq76920 EVM to demonstrate operation of the AFE portion
of the EVM. For more detailed descriptions, refer to other sections of the user guide.
Refer to
Figure 1
for the following steps.
1. Download the bq76940/bq76930/bq76920 Evaluation Software from the tool folder link
www.ti.com/tool/bq76920EVM
4
bq76920 Evaluation Module User's Guide
Warning
The bq76920EVM circuit module may become hot during
operation due to dissipation of heat. Avoid contact with the
board. Follow all applicable safety procedures applicable to
your laboratory.
Caution
Do not leave the EVM powered when unattended.
Section
2.2.2.
or search from www.ti.com.
Copyright © 2014–2018, Texas Instruments Incorporated
CAUTION
CAUTION
CAUTION
CAUTION
SLVU924D – March 2014 – Revised November 2018
www.ti.com
Section
2.2.1.
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