KROHNE OPTIFLEX 3200 C Instructions Manual page 35

OPTIFLEX X200
Maximum limits for EPL Gc and EPL Dc
Temperature Maximum surface
class
T6
T5
T4
T3
T2
T1
1 Values in parentheses are for Ex ic nA-approved devices with EPL Gc
2 If the device has a double ceramic process seal system, use the value in square brackets
INFORMATION!
If the device has an EPDM gasket, the maximum process connection temperature is +150
the device has an FKM/FPM gasket, the maximum process connection temperature is +200
Minimum limits for all EPLs
Min. process temperature or
process connection temperature
INFORMATION!
If the device has a Kalrez
device has an FKM/FPM gasket, minimum process connection temperature is -40
device has a Metaglas
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Max.
temperature process
temperature
or process
connection
temperature
T85
T100
T135
T200
T300
T315
-40
-50
® gasket, minimum process connection temperature is -20
adaptor, minimum process connection temperature is -30
®
Maximum ambient temperature
Aluminium housing
4-20mA /
HART with
or without Modbus RTU
optional
output
[°C]
+60 +67 (+47)
1
+85 +67 (+47)
1
+75 +80 (+62)
1
+100 +80 (+62)
1
+110
+135
+150
+180
+200
+250
+280 +55 [+59]
+300 +52 [+56]
+315 +50 [+54]
Maximum ambient temperature
[°C]
www.krohne.com
INSTALLATION
Stainless steel housing
Fieldbus 4-20mA /
(PA/FF) HART with
or without
optional
output
+67 +67 (+47)
+67 +67 (+47)
+80 +80 (+62)
+80 +80 (+62)
+80
+77
+75
+70
+67
+60
2
2
2
2
Fieldbus
(PA/FF)
Modbus RTU
+67
1
+67
1
+80
1
+80
1
+80
+76
+73
+68
+64
+55 [+58]
2
+50 [+53]
2
+46 [+50]
2
+44 [+47]
2
° C. If
° C.
-40
-38
° C. If the
° C. If the
C.
°
35