KROHNE OPTIFLEX 3200 C Instructions Manual page 20

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INSTALLATION
2
SINGLE CERAMIC PROCESS SEAL SYSTEM
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
Temperature
Maximum surface
class
T6
T5
T4
T3
T2
Maximum limits for EPL Gc and EPL Dc
Temperature
Maximum surface
class
T6
T5
T4
T3
T2
1 Values in parentheses are for Ex ic nA-approved devices with EPL Gc
20
Max.
temperature
process
temperature
or process
connection
temperature
T85
T100
T135
T200
T250
Max.
temperature
process
temperature
or process
connection
temperature
T85
T100
T135
T200
T250
Maximum ambient temperature
Aluminium housing
4-20mA /
HART with
or without
Modbus RTU
optional
output
[°C]
+60
+54
+85
+52
+75
+69
+100
+67
+110
+135
+150
+180
+200
+250
Maximum ambient temperature
Aluminium housing
4-20mA /
HART with
or without
Modbus RTU
optional
output
[°C]
+60
+68 (+46)
1
+85
+66 (+43)
1
+75
+80 (+61)
1
+100
+80 (+58)
1
+110
+135
+150
+180
+200
+250
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09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Stainless steel housing
Fieldbus
4-20mA /
(PA/FF)
HART with
or without
optional
output
+50
+54
+48
+52
+65
+69
+63
+67
+80
+77
+75
+71
+68
+60
Stainless steel housing
Fieldbus
4-20mA /
(PA/FF)
HART with
or without
optional
output
+68
+68 (+46)
+66
+66 (+43)
+80
+80 (+61)
+80
+80 (+58)
+80
+77
+75
+71
+68
+60
OPTIFLEX X200
Fieldbus
(PA/FF)
Modbus RTU
+50
+47
+65
+62
+80
+76
+74
+69
+65
+57
Fieldbus
(PA/FF)
Modbus RTU
+68
1
+66
1
+80
1
+80
1
+80
+76
+74
+69
+65
+57

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