KROHNE OPTIFLEX 3200 C Instructions Manual page 34

INSTALLATION
2
Minimum limits for all EPLs
Min. process temperature or
process connection temperature
INFORMATION!
If the device has a Kalrez
device has an FKM/FPM gasket, minimum process connection temperature is -40
device has a Metaglas
SINGLE AND DOUBLE CERAMIC PROCESS SEAL SYSTEMS
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
Temperature Maximum surface
class
T6
T5
T4
T3
T2
T1
1 If the device has a double ceramic process seal system, use the value in square brackets
34
-40
-50
® gasket, minimum process connection temperature is -20
adaptor, minimum process connection temperature is -30
®
Max. process
temperature temperature or
process connection
temperature
T85
T100
T135
T200
T250
T315
Maximum ambient temperature
Aluminium housing
[°C]
Maximum ambient temperature
Aluminium housing
[°C]
+60
+85
+75
+100
+110
+135
+150
+180
+200
+250
+280
+300
+315
www.krohne.com 09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
OPTIFLEX X200
Stainless steel housing
-40
-37
C. If the
°
C.
°
Stainless steel
housing
+50
+47
+65
+62
+80
+77
+75
+70
+67
+64
+55 [+59]
1
+52 [+56]
1
+50 [+54]
1
-40
-36
° C. If the
+50
+47
+65
+62
+80
+76
+73
+68
+64
+55 [+58]
1
+50 [+53]
1
+46 [+50]
1
+44 [+47]
1