KROHNE OPTIFLEX 3200 C Instructions Manual page 26

INSTALLATION
2
Temperature Maximum surface
class
T3
1 Values in parentheses are for Ex ic nA-approved devices with EPL Gc
INFORMATION!
Minimum limits for all EPLs Minimum limits for all EPLs Minimum limits for all EPLs Minimum limits for all EPLs
The minimum ambient temperature is always -40
SINGLE CERAMIC PROCESS SEAL SYSTEM
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
Temperature Maximum surface
class
T6
T5
T4
T3
T2
Maximum limits for EPL Gc and EPL Dc
Temperature Maximum surface
class
T6
T5
T4
26
Max. process
temperature temperature or
process connection
temperature
T150
Max. process
temperature temperature or
process connection
temperature
T85
T100
T135
T200
T250
Max. process
temperature temperature or
process connection
temperature
T85
T100
+135
Maximum ambient temperature
4-20mA / HART with
or without optional
[°C]
+150
C.
°
Maximum ambient temperature
4-20mA / HART with
or without optional
[°C]
+60
+85
+75
+100
+110
+135
+150
+180
+200
+250
Maximum ambient temperature
4-20mA / HART with
or without optional
[°C]
+60
+85
+75
+100
+110
+135
www.krohne.com 09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
OPTIFLEX X200
Fieldbus (PA/FF)
Modbus RTU
output
Fieldbus (PA/FF)
Modbus RTU
output
+55
+55
+70
+70
Fieldbus (PA/FF)
Modbus RTU
output
+67 (+47)
1
+67 (+47)
1
+80 (+62)
1
+80 (+62)
1
+80
+51
+51
+66
+66
+80
+80
+80
+80
+80
+80
+67
+67
+80
+80
+80
+80