KROHNE OPTIFLEX 3200 C Instructions Manual page 31

OPTIFLEX X200
SINGLE AND DOUBLE CERAMIC PROCESS SEAL SYSTEMS
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
Temperature Maximum surface
class
T6
T5
T4
T3
T2
T1
1 If the device has a double ceramic process seal system, use the value in square brackets
Maximum limits for EPL Gc and EPL Dc
Temperature Maximum surface
class
T6
T5
T4
T3
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Max.
temperature process
temperature
or process
connection
temperature
T85
T100
T135
T200
T300
T315
Max.
temperature process
temperature
or process
connection
temperature
T85
T100
T135
T200
Maximum ambient temperature
Aluminium housing
4-20mA /
HART with
or without Modbus RTU
optional
output
[°C]
+60 +54
+85 +52
+75 +69
+100 +67
+110
+135
+150
+180
+200
+250
+280
+300 +58 [+60]
+315 +56 [+58]
Maximum ambient temperature
Aluminium housing
4-20mA /
HART with
or without Modbus RTU
optional
output
[°C]
+60 +68 (+46)
1
+85 +66 (+44)
1
+75 +80 (+61)
1
+100 +80 (+59)
1
+110
+135
+150
+180
+200
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INSTALLATION
Stainless steel housing
Fieldbus 4-20mA /
(PA/FF) HART with
or without
optional
output
+51 +54
+48 +52
+66 +69
+63 +67
+80
+78
+77
+73
+70
+64
+61
1
1
Stainless steel housing
Fieldbus 4-20mA /
(PA/FF) HART with
or without
optional
output
+68 +68 (+46)
+66 +66 (+43)
+80 +80 (+61)
+80 +80 (+58)
+80
+78
+77
+73
+70
2
Fieldbus
(PA/FF)
Modbus RTU
+51
+48
+66
+63
+80
+77
+74
+70
+67
+59 [+62]
1
+54 [+58]
1
+51 [+55]
1
+49 [+53]
1
Fieldbus
(PA/FF)
Modbus RTU
+68
1
+66
1
+80
1
+80
1
+80
+77
+74
+70
+67
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