KROHNE OPTIFLEX 3200 C Instructions Manual page 24

INSTALLATION
2
INFORMATION!
If the device has a Kalrez
device has an FKM/FPM gasket, minimum process connection temperature is -40
device has a Metaglas
SINGLE CERAMIC PROCESS SEAL SYSTEM
Maximum limits for EPL Ga/Gb, EPL Gb, EPL Da/Db and EPL Db
Temperature Maximum surface
class
T6
T5
T4
T3
T2
Maximum limits for EPL Gc and EPL Dc
Temperature Maximum surface
class
T6
T5
T4
T3
T2
1 Values in parentheses are for Ex ic nA-approved devices with EPL Gc
24
gasket, minimum process connection temperature is -20
®
® adaptor, minimum process connection temperature is -30
Max. process
temperature temperature or
process connection
temperature
T85
T100
T135
T200
T250
Max.
temperature process
temperature
or process
connection
temperature
T85
T100
T135
T200
T250
Aluminium housing
[°C]
+60
+85
+75
+100
+110
+135
+150
+180
+200
+250
Maximum ambient temperature
Aluminium housing
4-20mA /
HART with
or without Modbus RTU
optional
output
[°C]
+60 +67 (+47)
1
+85 +67 (+47)
1
+75 +80 (+62)
1
+100 +80 (+62)
1
+110
+135
+150
+180
+200
+250
www.krohne.com 09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Maximum ambient temperature
Stainless steel
+50
+47
+65
+62
+80
+77
+74
+69
+66
+58
Stainless steel housing
Fieldbus 4-20mA /
(PA/FF) HART with
or without
optional
output
+67 +67 (+47)
+67 +67 (+47)
+80 +80 (+62)
+80 +80 (+62)
+80
+77
+74
+69
+66
+58
OPTIFLEX X200
C. If the
°
C. If the
°
° C.
housing
+50
+47
+65
+62
+80
+75
+72
+67
+63
+54
Fieldbus
(PA/FF)
Modbus RTU
+67
1
+67
1
+80
1
+80
1
+80
+75
+72
+67
+63
+54