KROHNE OPTIFLEX 3200 C Instructions Manual page 22

INSTALLATION
2
Maximum limits for EPL Gc and EPL Dc
Temperature Maximum surface
class
T6
T5
T4
T3
1 Values in parentheses are for Ex ic nA-approved devices with EPL Gc
INFORMATION!
If the device has an EPDM gasket, the maximum process connection temperature is +150
Minimum limits for all EPLs
Min. process temperature or
process connection temperature
INFORMATION!
If the device has a Kalrez
device has an FKM/FPM gasket, minimum process connection temperature is -40
device has a Metaglas
22
Max.
temperature process
temperature
or process
connection
temperature
T85
T100
T135
T200
-40
-50
gasket, minimum process connection temperature is -20
®
® adaptor, minimum process connection temperature is -30
Maximum ambient temperature
Aluminium housing
4-20mA /
HART with
or without Modbus RTU
optional
output
[°C]
+60 +68 (+45)
1
+85 +65 (+42)
1
+75 +80 (+60)
1
+100 +80 (+57)
1
+110
+135
+150
+180
+200
Maximum ambient temperature
Aluminium housing
[°C]
www.krohne.com 09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Stainless steel housing
Fieldbus 4-20mA /
(PA/FF) HART with
or without
optional
output
+68 +68 (+45)
+65 +66 (+43)
+80 +80 (+60)
+80 +80 (+58)
+79
+73
+70
+63
+59
Stainless steel housing
-40
-37
OPTIFLEX X200
Fieldbus
(PA/FF)
Modbus RTU
+68
1
+66
1
+80
1
+80
1
+78
+71
+67
+58
+53
° C.
-40
-37
C. If the
°
C. If the
°
° C.