KROHNE OPTIFLEX 3200 C Instructions Manual page 19

OPTIFLEX X200
Temperature Maximum surface
class
T4
T3
1 If the device has a Ø2 mm single cable probe, use the value in square brackets
Maximum limits for EPL Gc and EPL Dc
Temperature Maximum surface
class
T6
T5
T4
T3
1 Values in parentheses are for Ex ic nA-approved devices with EPL Gc
2 If the device has a Ø2mm single cable probe, use the value in square brackets
Minimum limits for all EPLs
Min. process temperature or
process connection temperature
INFORMATION!
If the device has a Kalrez
device has an FKM/FPM gasket, minimum process connection temperature is -40
device has a Metaglas
09/2018 - 4006564001 - AD IECEX OPTIFLEX x200 R01 en
Max.
temperature process
temperature
or process
connection
temperature
T135
T150
Max.
temperature process
temperature
or process
connection
temperature
T85
T100
T135
T150
-40
-50
® gasket, minimum process connection temperature is -20
adaptor, minimum process connection temperature is -30
®
Maximum ambient temperature
Aluminium housing
4-20mA /
HART with
or without Modbus RTU
optional
output
[°C]
+110
+135
+150
Maximum ambient temperature
Aluminium housing
4-20mA /
HART with
or without Modbus RTU
optional
output
[°C]
+60 +68 (+45)
1
+85 +65 (+42)
1
+75 +80 (+60)
1
+100 +79 (+57)
1
+110
+135
+150
Maximum ambient temperature
Aluminium housing
[°C]
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INSTALLATION
Stainless steel housing
Fieldbus 4-20mA /
(PA/FF) HART with
or without
optional
output
+76
+68
+63
Stainless steel housing
Fieldbus 4-20mA /
(PA/FF) HART with
or without
optional
output
+68 +68 (+45)
+65 +65 (+41)
+80 +80 (+60)
+79 +76 (+56)
+76
+68
+63
Stainless steel housing
-40
-38
2
Fieldbus
(PA/FF)
Modbus RTU
+70
+60 [+55]
1
+52 [+46]
1
Fieldbus
(PA/FF)
Modbus RTU
+68
1
+65
1
+80
1
+76
1
+70
+60 [+55]
2
+52 [+46]
2
-40
-38
° C. If the
° C. If the
C.
°
19