Storage, Manufacturing & Packaging; Storage Conditions - Quectel FC908A Hardware Design

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Storage, Manufacturing & Packaging

6.1. Storage Conditions

The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: The temperature shall be 23 ± 5 ° C and the relative humidity shall
be 35–60 %.
2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
3. The floor life of the module is 168 hours
humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 24 hours. Otherwise, the
module shall be stored in an environment where the relative humidity is less than 10 % (e.g. a drying
cabinet).
4. The module shall be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under the
following circumstances:
⚫
The module is not stored in Recommended Storage Condition;
⚫
Violation of the third requirement above occurs;
⚫
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
⚫
Before module repairing.
5. If needed, the pre-baking shall follow the requirements below:
⚫
The module shall be baked for 8 hours at 120 ± 5 ° C;
⚫
All modules must be soldered to PCB within 24 hours after the baking, otherwise they shall be put
in a dry environment such as in a drying oven.
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This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start the
solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to, or
are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are not
ready for soldering.
FC908A_Hardware_Design
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in a plant where the temperature is 23 ± 5 ° C and relative
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