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It is suggested that the peak reflow temperature is from 235 to 245º C (for SnAg3.0Cu0.5 alloy). The
absolute maximum reflow temperature is 260º C. To avoid damage to the module caused by repeated
heating, it is suggested that the module should be mounted after reflow soldering for the other side of
PCB has been completed. Recommended reflow soldering thermal profile is shown below:
º C
250
217
200
150
100
50
0
SC20-A_Manual_R1.0
Figure 8: Recommended Stencil Design for LGA Pads
Preheat
Liquids Temperature
160
º C
Between 1~3
/s
º C
50
100
150
Figure 9: Reflow Soldering Thermal Profile
Confidential / Released
Heating
200
º C
40s~60s
70s~120s
200
250
Time
Cooling
s
300
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