Renesas Emulation Pod M306H2T-RPD-E User Manual page 7

Chapter 5. Specifications ...................................................................................................... 51
5.1 Specifications ...................................................................................................... 52
5.2 Operation Timing in the Memory Expansion and Microprocessor Modes (5 V) ... 53
(1) Separate Bus, No-wait .............................................................................. 53
(2) Separate Bus, With Wait, Accessing External Memory Area .................55
(3) Multiplex Bus, With Wait, Accessing External Memory Area ............... 57
(4) Timing Requirements ............................................................................... 59
5.3 Electrical Characteristics ..................................................................................... 61
5.4 Connection Diagram ........................................................................................... 62
5.5 External Dimensions ........................................................................................... 63
(1) External Dimensions of the Emulation Pod ............................................. 63
(2) External Dimensions of the Pitch Converter Board (FLX160-PRB) ....... 64
(3) External Dimensions of the Pitch Converter Board (M306H2T-PTC) .... 64
Chapter 6. Troubleshooting .................................................................................................. 65
6.1 Flowchart to Remedy the Troubles ..................................................................... 66
6.2 When the Emulator Debugger Does Not Start Up Properly ............................... 67
(1) When the LED Display of the PC4701 is Abnormal ............................... 67
(2) Errors Occur When the Emulator Debugger Starts Up
(3) Errors Occur When the Emulator Debugger Starts Up
6.3 Operation Differs from That of Actual MCUs .................................................... 70
(1) Cannot Reset from the Target System ...................................................... 70
(2) Data Values of RAM Area at Power-on are Different .............................70
(3) HOLD* Control ....................................................................................... 70
(4) A-D Conversion Values are Different from Expected Values ....................70
(5) Outputs of ALE, Address and Others are Different from Those of Actual MCUs .. 70
Chapter 7. Maintenance and Guarantee ................................................................................ 71
7.1 Maintenance ........................................................................................................ 72
7.2 Guarantee ............................................................................................................ 72
7.3 Repair Provisions ................................................................................................ 72
7.4 How to Request for Repair .................................................................................. 73
(When the target system is connected) .................................... 68
(When the target system is not connected) .............................69
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