Operating Temperature of Main Parts ......................7 How to measure the temperature of the device surface ................7 <Reference> Surface temperature of each device in the CIS chassis (29mm×29mm×77mm) ......7 GenLock ................................8 LTC (Longitudinal Time Code) ..........................8 Defective Pixel Correction ...........................
Assembly without appropriate heat dissipation may cause damages or malfunction. Product Outline DCC-HD3N is provided as an assembly unit that is a part of CIS full HD color camera module with Gen Lock function, VCC-HD3N. Video output 1080 60p/59.94p/50p (3G-SDI), 1080 60i/59.94i/50i/30p/29.97p/25p/24p/23.97p (HD-SDI), 720 60p/59.94p/50p (HD-SDI) are corresponded.
Tape a thermocouple on the device surface, make a slit in the heat conducting sheet, and then make the heat-sink be appressed onto it to measure temperature. (E.g.: Temperature measurement of the FPGA surface) 7.3 <Reference> Surface temperature of each device in the CIS chassis (29mm×29mm×77mm) Ambient 25℃...
CIS Corporation, at its option, repairs or replaces it at no charge to you. Products out of warranty period will be subject to charge. CIS repairs the products as long as it is repairable. CIS shall be exempted from taking responsibility and held harmless for damages or losses incurred by the following cases.
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