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PACKAGING INFORMATION
Orderable Device
Status
(1)
CC2650F128RGZR
ACTIVE
CC2650F128RGZT
ACTIVE
CC2650F128RHBR
ACTIVE
CC2650F128RHBT
ACTIVE
CC2650F128RSMR
ACTIVE
CC2650F128RSMT
ACTIVE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Package Type Package
Pins Package
Drawing
Qty
VQFN
RGZ
48
2500
VQFN
RGZ
48
250
VQFN
RHB
32
3000
VQFN
RHB
32
250
VQFN
RSM
32
3000
VQFN
RSM
32
250
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
Green (RoHS
CU NIPDAU | Call TI
Level-3-260C-168 HR
& no Sb/Br)
Green (RoHS
CU NIPDAU | Call TI
Level-3-260C-168 HR
& no Sb/Br)
Green (RoHS
CU NIPDAU | Call TI
Level-3-260C-168 HR
& no Sb/Br)
Green (RoHS
CU NIPDAU | Call TI
Level-3-260C-168 HR
& no Sb/Br)
Green (RoHS
CU NIPDAU | Call TI
Level-3-260C-168 HR
& no Sb/Br)
Green (RoHS
CU NIPDAU | Call TI
Level-3-260C-168 HR
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
Op Temp (°C)
(3)
-40 to 85
CC2650
F128
-40 to 85
CC2650
F128
-40 to 85
CC2650
F128
-40 to 85
CC2650
F128
-40 to 85
CC2650
F128
-40 to 85
CC2650
F128
http://www.ti.com/productcontent
for the latest availability
30-Nov-2015
Device Marking
Samples
(4/5)
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