Packaging Specifications - Quectel LPWA Series Hardware Design

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Table 48: Recommended Thermal Profile Parameters
Factor
Soak Zone
Max slope
Soak time (between A and B: 150 °C and 200 °C)
Reflow Zone
Max slope
Reflow time (D: over 217 °C)
Max temperature
Cooling down slope
Reflow Cycle
Max reflow cycle
NOTE
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.

9.3. Packaging Specifications

The module is packaged in tape and reel carriers. One reel is 330 mm long and contains 500 modules.
The figures below show the package details, measured in mm.
BG950A-GL&BG951A-GL_Hardware_Design
LPWA Module Series
Recommendation
1–3 °C/s
70–120 s
2–3 °C/s
40–70 s
235 °C to 246 °C
-1.5 to -3 °C/s
1
78 /89

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