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4.7
PARAMETERS FOR FILLING IN THE PACKAGE FICHE
In case you should wish to install an assembly, starting from this boiler, use the assembly charts in (Fig. 68 e 70).
To complete it properly, fill the relevant spaces as shown in the assembly chart facsimile (Fig. 67" and "69) with the values shown in tables
"Parameters for filling in the assembly chart" and "Parameters for filling in the D.H.W. package assembly chart".
The remaining values must be obtained from the technical data sheets of the products used to make up the assembly (e.g. solar devices,
integration heat pumps, temperature controllers).
Use board (Fig. 68) for "assemblies" related to the central heating mode (e.g.: boiler + temperature controller).
Use board (Fig. 70) for "assemblies" related to the domestic hot water function (e.g.: boiler + solar thermal system).
Facsimile for filling in the package fiche for room central heating systems.
74
Temperature control
Class I = 1 %, Class II = 2 %,
Class III = 1.5 %, Class IV = 2 %,
From temperature
Class V = 3 %, Class VI = 4 %,
control board
Class VII = 3.5 %, Class VIII = 5 %
Supplementary boiler
From boiler board
Solar contribution
From the board of the solar device
Dimensions of the
Volume of the
manifold (in m
)
tank (in m
)
2
3
( 'III' x
+ 'IV' x
Supplementary heat pump
From the heat pump
board
Solar contribution and supplementary heat pump
Select the lowest
0.5 x
value
G
F
E
< 30 %
30 %
34 %
Boiler and supplementary heat pump installed with low temperature heat emitters
at 35 °C?
FFrom the board of the heat
pump
in the distribution system and the size of the products compared to the size and features of the building.
(%)
(
- 'I'
) x 0.1
tank
A* = 0.95, A = 0.91,
B = 0.86, C = 0.83,
manifold (in %)
D-G = 0.81
) x (0.9 x (
/ 100) x
room (%)
(
- 'I' ) x 'II'
4
5
O
0.5 x
D
C
B
A
A
36 %
75 %
82 %
90 %
98 %
7
+
( 50
x
'II'
1
%
'I'
2
+
%
3
±
%
=
4
+
%
=
5
+
%
=
6
-
%
=
7
%
+
A
++
A
+++
125 % 150 %
%
)
=
67
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