6
6.1.
General Description ................................................................................................................. 38
6.2.
Power Supply Requirements ................................................................................................... 38
6.3.
I/O Requirements ..................................................................................................................... 39
6.4.
RF Characteristics ................................................................................................................... 39
6.5.
ESD Characteristics ................................................................................................................ 42
6.6.
Current Consumption .............................................................................................................. 42
6.7.
Thermal Consideration ............................................................................................................ 47
7
Dimensions and Packaging .............................................................................................................. 49
7.1.
General Description ................................................................................................................. 49
7.2.
7.3.
7.4.
Packaging Specifications ......................................................................................................... 51
8
Appendix A References ..................................................................................................................... 52
EG25-G_Mini_PCIe_Hardware_Design
LTE Standard Module Series
EG25-G Mini PCIe Hardware Design
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