Quectel EG25-G Hardware Design page 41

LTE-FDD B13/B18/B19/B20/B25/B26/B28
LTE-TDD B38/B39/B40/B41
NOTES
1. In GPRS 4 slots TX mode, the maximum output power is reduced by 3.0 dB. The design conforms to
the GSM specification as described in Chapter 13.16 of 3GPP TS 51.010-1.
2. EG25-G Mini PCIe supports LTE B25, and Qorvo Phase 6 PAMiD QM77031 in the module does not
actually support LTE B25. Qorvo has confirmed that the SAW integrated in the PA can support LTE
B2, but B25 can work at the same frequency as B2. B25 is 5 MHz wider than B2. Therefore, the
sensitivity of the Rx channels 8630–8689 is poor, and there is a big gap with the 3GPP standard. At a
high temperature of 75 ° C, the maximum power of channels 26640–26689 will be reduced by about
2.5 dB.
Table 22: EG25-G Mini PCIe Conducted RF Receiving Sensitivity
Frequency Bands
GSM850
EGSM900
DCS1800
PCS1900
WCDMA B1
WCDMA B2
WCDMA B4
WCDMA B5
WCDMA B6
WCDMA B8
WCDMA B19
LTE-FDD B1 (10 MHz)
LTE-FDD B2 (10 MHz)
LTE-FDD B3 (10 MHz)
EG25-G_Mini_PCIe_Hardware_Design
23 dBm ± 2 dB
23 dBm ± 2 dB
Primary Diversity
-108 dBm NA
-108 dBm NA
-107.5 dBm NA
-107.5 dBm NA
-108.2 dBm -108.5 dBm
-109.5 dBm -109 dBm
-109.5 dBm NA
-109 dBm -109.5 dBm
-109 dBm -109.5 dBm
-109.2 dBm NA
-109 dBm -109.5 dBm
-97.3 dBm -98.3 dBm
-98 dBm -99 dBm
-97.4 dBm -98.1 dBm
LTE Standard Module Series
EG25-G Mini PCIe Hardware Design
< -39 dBm
< -39 dBm
1)
SIMO 3GPP (SIMO)
NA -102 dBm
NA -102 dBm
NA -102 dBm
NA -102 dBm
-109.2 dBm -106.7 dBm
-110 dBm -104.7 dBm
NA -103.7 dBm
-110 dBm -104.7 dBm
-110.5 dBm -106.7 dBm
NA -103.7 dBm
-110.5 dBm -106.7 dBm
-99.5 dBm -96.3 dBm
-99.9 dBm -94.3 dBm
-99.8 dBm -93.3 dBm
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