Quectel SC200E Series Manual
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Quectel SC200E Series Manual

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SC200E Series
Hardware Design
Smart Module Series
Version: 1.0
Date: 2022-04-22
Status: Released

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Summary of Contents for Quectel SC200E Series

  • Page 1 SC200E Series Hardware Design Smart Module Series Version: 1.0 Date: 2022-04-22 Status: Released...
  • Page 2 Smart Module Series At Quectel, our aim is to provide timely and comprehensive services to our customers. If you require any assistance, please contact our headquarters: Quectel Wireless Solutions Co., Ltd. Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,...
  • Page 3 Privacy Policy To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers, including carriers, chipset suppliers or customer-designated servers. Quectel, strictly abiding by the relevant laws and regulations, shall retain, use, disclose or otherwise process relevant data for the purpose of performing the service only or as permitted by applicable laws.

  • Page 4: Safety Information

    Manufacturers of the cellular terminal should send the following safety information to users and operating personnel, and incorporate these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for customers’ failure to comply with these precautions.

  • Page 5: About The Document

    Smart Module Series About the Document Revision History Version Date Author Description Dorian MENG/ 2021-11-25 Creation of the document Waller GUO Dorian MENG/ 2022-04-22 First official release Waller GUO SC200E_Series_Hardware_Design 4 / 115...

  • Page 6: Table Of Contents

    Smart Module Series Contents Safety Information ............................3 About the Document ........................... 4 Contents ............................... 5 Table Index ..............................8 Figure Index ............................... 10 Introduction ............................12 1.1. Special Mark ..........................14 Product Overview ..........................16 2.1. Frequency Bands and Functions ..................... 16 2.2.
  • Page 7 Smart Module Series 3.22. Audio Interfaces ........................63 3.22.1. Reference Circuit Design for Microphone Interfaces ............. 64 3.22.2. Reference Circuit Design for Earpiece Interface ............65 3.22.3. Reference Circuit Design for Headset Interface ............65 3.22.4. Reference Circuit Design for Lineout Interface .............. 66 3.22.5.
  • Page 8 Smart Module Series 9.1. Storage Conditions ........................ 104 9.2. Manufacturing and Soldering ....................105 9.3. Packaging Specification ......................107 9.3.1. Plastic Reel ........................107 9.3.2. Packaging Process ...................... 108 10 Appendix References ........................109 SC200E_Series_Hardware_Design 7 / 115...
  • Page 9 Smart Module Series Table Index Table 1: Special Mark ..........................14 Table 2: SC200E-CE Frequency Bands and GNSS Functions ..............16 Table 3: SC200E-EM Frequency Bands and GNSS Functions ..............17 Table 4: SC200E-NA Frequency Bands and GNSS Functions ..............17 Table 5: Key Features ..........................
  • Page 10 Smart Module Series Table 42: Absolute Maximum Ratings ......................85 Table 43: Power Supply Ratings ........................ 85 Table 44: 1.8 V Digital I/O Requirements ....................86 Table 45: (U)SIM 1.8 V I/O Requirements ....................86 Table 46: (U)SIM 2.95 V I/O Requirements ....................86 Table 47: SD Card 1.8 V I/O Requirements ....................
  • Page 11 Smart Module Series Figure Index Figure 1: Functional Diagram ........................22 Figure 2: Pin Assignment (Top View) ......................24 Figure 3: Voltage Drop Sample ........................36 Figure 4: Reference Circuit for the Power Supply ..................37 Figure 5: Reference Circuit of Power Supply ..................... 37 Figure 6: Turn On the Module with Open Collector Driver .................
  • Page 12 Smart Module Series Figure 42: Recommended Footprint (Top View) ..................102 Figure 43: Top and Bottom Views of the Module ..................103 Figure 44: Recommended Reflow Soldering Thermal Profile ..............105 Figure 45: Carrier Tape Dimension Drawing .................... 107 Figure 46: Plastic Reel Dimension Drawing .................... 107 Figure 47: Packaging Process .........................

  • Page 13: Introduction

    Smart Module Series Introduction This document, describing SC200E series and its air and hardware interfaces connected to your applications, informs you of the interface specifications, electrical and mechanical details, as well as other related information of the module. With the application notes and user guides provided separately, you can easily use the module to design and set up mobile applications.
  • Page 14 Smart Module Series LTE BAND 41 8.00 11.16 LTE BAND 66 5.00 10.04 LTE BAND 71 7.62 9.12 WIFI 5. This module must not transmit simultaneously with any other antenna or transmitter 6. The host end product must include a user manual that clearly defines operating requirements and conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

  • Page 15: Special Mark

    Smart Module Series that the after the module is installed and operational the host continues to be compliant with the Part 15B unintentional radiator requirements. Manual Information To the End User The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module.
  • Page 16 Smart Module Series Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin name, AT command, or argument, it indicates that the function, feature, interface, pin, AT command, or argument is under development and currently not supported; and the asterisk (*) after a model indicates that the sample of the model is currently unavailable.

  • Page 17: Product Overview

    Smart Module Series Product Overview 2.1. Frequency Bands and Functions SC200E series is a series of Smart LTE modules based on Android operating system, and provides industrial grade performance. Its general features are listed below: ⚫ Supports worldwide LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA, WCDMA, EV-DO/CDMA, EDGE and GPRS coverage.
  • Page 18 Smart Module Series Bluetooth 5.0 2402–2480 MHz GPS: 1575.42 ±1.023 MHz (L1) GLONASS: 1597.5–1605.8 MHz (L1) BDS: 1561.098 ±2 .046 MHz (B1I) GNSS Galileo: 1575.42 ±2.046 MHz (E1) QZSS: 1575.42 ±1.023 MHz (L1) SBAS: 1575.42 ±1.023 MHz (L1) Table 3: SC200E-EM Frequency Bands and GNSS Functions Mode Frequency Bands LTE-FDD...

  • Page 19: Key Features

    Smart Module Series ⚫ 1575.42 ±1.023 MHz (L1) ⚫ 1176.45 ±10.23 MHz (L5) GLONASS: 1597.5–1605.8 MHz (L1) BDS: 1561.098 ±2 .046 MHz (B1I) Galileo: ⚫ 1575.42 ±2.046 MHz (E1) ⚫ 1176.45 ±10.23 MHz (E5a) QZSS: ⚫ 1575.42 ±1.023 MHz (L1) ⚫...
  • Page 20 Smart Module Series ⚫ 512 KB L2 cache Adreno 702 GPU with 64-bit addressing, up to 845 MHz ⚫ 32 GB eMMC + 2 GB LPDDR4X Memory (Optional) ⚫ 32 GB eMMC + 3 GB LPDDR4X Operating System Android ⚫ Supply voltage: 3.5–4.4 V Power Supply ⚫...
  • Page 21 Smart Module Series ⚫ Coding scheme: CS-1, CS-2, CS-3 and CS-4 ⚫ Max. 107 kbps (DL), 85.6 kbps (UL) EDGE ⚫ Supports EDGE multi-slot class 33 (33 by default) ⚫ Supports GMSK and 8-PSK for different MCS (Modulation and Coding Scheme) ⚫...
  • Page 22 Smart Module Series up to 5 Gbps on USB 3.1 and 480 Mbps on USB 2.0 ⚫ Supports USB OTG ⚫ Used for AT command communication, data transmission, software debugging, and firmware upgrade Three UART interfaces: UART0, UART1, and UART4 (debug UART) ⚫...

  • Page 23: Functional Diagram

    Peripheral interfaces Figure 1: Functional Diagram 2.4. EVB Kit To help you develop applications with the module conveniently, Quectel supplies an evaluation board with accessories to control or to test the module. For details, see document [1]. SC200E_Series_Hardware_Design 22 / 115...

  • Page 24: Application Interfaces

    Smart Module Series Application Interfaces 3.1. General Description SC200E is a series of SMD type modules with 146 LCC pins and 128 LGA pins. The following interfaces and functions are described in detail in these subsequent chapters: ⚫ Power supply ⚫...

  • Page 25: Pin Assignment

    Smart Module Series 3.2. Pin Assignment The following figure shows the pin assignment of the module. GPIO_36 VBAT CBL_ VPH_ GPIO_ NFC_ FLASH RESER RESER GPIO_ GPIO_34 VBAT BAT_ID BAT_M PWR_N _LED GPIO_33 GPIO_35 MIC1_P GPIO_56 MIC1_M MIC_ BIAS1 GPIO_99 MIC2_P GPIO_102 GPIO_103...

  • Page 26: Pin Description

    Smart Module Series 3.3. Pin Description Table 6: I/O Parameter Definition Type Description Analog Input Analog Output Analog Input/Output Digital Input Digital Output Digital Input/Output Open Drain Power Input Power Output Power Input/Output Table 7: Pin Description Power Supply Pin Name Pin No.
  • Page 27 Smart Module Series The power is reserved Vnom = 1.8 V for LCM and camera's LDO_IOVDD 1.8 V output max = 300 mA IOVDD. This voltage is not adjustable. Vomax = 3.2 V VRTC Power supply for RTC min = 2.5 V If unused, keep it open.
  • Page 28 Smart Module Series USB Interface Pin Name Pin No. Description DC Characteristics Comment Charging power input. Power supply output for Vmax = 6.0 V The maximum output USB_VBUS 141, 142 PIO OTG device. Vmin = 4.0 V current is 500 mA. USB/adaptor insertion Vnom = 5.0 V detection...
  • Page 29 Smart Module Series max = 0.2 × USIM1_VDD min = 0.7 × USIM1_VDD USIM1_DATA (U)SIM1 card data max = 0.4 V Cannot be multiplexed min = 0.8 × USIM1_VDD into a generic GPIO. USIM1_CLK (U)SIM1 card clock max = 0.4 V min = 0.8 ×...
  • Page 30 Smart Module Series 1.8/2.95 V output power 1.8/2.95 V SD_LDO4 for SD card pull-up 22 mA circuits Touch Panel Interface Pin Name Pin No. Description DC Characteristics Comment max = 0.45 V 1.8 V power domain. TP_RST TP reset min = 1.35 V Active low.
  • Page 31 Smart Module Series CSI1_LN0_N MIPI CSI1 lane 0 data (-) MIPI CSI1 lane 0 data CSI1_LN0_P CSI1_LN1_N MIPI CSI1 lane 1 data (-) MIPI CSI1 lane 1 data CSI1_LN1_P CSI1_LN2_N MIPI CSI1 lane 2 data (-) MIPI CSI1 lane 2 data CSI1_LN2_P CSI1_LN3_N MIPI CSI1 lane 3 data (-)
  • Page 32 Smart Module Series Master clock of camera CAM2_MCLK CAM0_RST Reset of camera 0 CAM1_RST Reset of camera 1 CAM2_RST Reset of camera 2 Need to be pulled up to CAM1_I2C_SCL I2C clock of camera 1 1.8 V externally. Can only be used for CAM1_I2C_SDA I2C data of camera 1 camera I2C devices.
  • Page 33 Smart Module Series DCE request to send max = 0.45 V UART0_RTS signal to DTE min = 1.35 V DCE clear to send signal max = 0.63 V UART0_CTS from DTE min = 1.17 V max = 0.45 V UART1_TXD UART1 transmit min = 1.35 V max = 0.63 V...
  • Page 34 Smart Module Series BAT_M Battery voltage detect (-) Internally pulled down min = 0 V with a 100 kΩ resistor. If BAT_ID Battery type detect max = 1.875 V unused, keep it open. Internally pull up by default. Supports 47 kΩ NTC Battery temperature BAT_THERM thermistor by default.
  • Page 35 Smart Module Series input/output General-purpose GPIO_33 input/output General-purpose GPIO_34 input/output General-purpose GPIO_35 input/output General-purpose GPIO_36 input/output General-purpose GPIO_55 input/output General-purpose GPIO_56 input/output Cannot be pulled up General-purpose GPIO_57 when the module is input/output turning on. General-purpose GPIO_58 input/output General-purpose GPIO_60 input/output General-purpose GPIO_86...
  • Page 36 Smart Module Series input/output General-purpose GPIO_107 input/output General-purpose GPIO_14 input/output General-purpose GPIO_15 input/output General-purpose GPIO_16 input/output General-purpose GPIO_17 input/output General-purpose PMU_GPIO03 input/output General-purpose PMU_GPIO04 input/output General-purpose PMU_GPIO08 input/output General-purpose PMU_GPIO07 input/output Pin Name Pin No. 3, 7, 12, 15, 27, 51, 62, 69, 76, 78, 85, 86, 88, 89, 120, 122, 130, 132, 135, 140, 143, 144, 162, 171, 172, 176, 187–191, 202–204, 206–224, 226–231, 233–238, 240, 241, 243–245, 247, 248, 250, 251, 255, 256, 258, 259, 261, 266, 268, 269, 271–274 RESERVED...

  • Page 37: Power Supply

    Smart Module Series 3.4. Power Supply 3.4.1. Power Supply Pins The module provides four VBAT pins for connection with external power supply. 3.4.2. Voltage Stability Requirements The power supply range of the module is 3.5–4.4 V, and the recommended value is 3.8 V. The power supply performance, such as load capacity, voltage ripple, etc.

  • Page 38: Reference Design For Power Supply

    Smart Module Series VBAT VBAT 4.7 μF 100 μF 100 nF 33 pF 10 pF Module Figure 4: Reference Circuit for the Power Supply 3.4.3. Reference Design for Power Supply The power design for the module is very important, as the performance of the module largely depends on the power source.

  • Page 39: Turn On/Off

    Smart Module Series The module supports battery charging by default. If the above power supply design is adopted, disable the charging function by software, or connect VBAT to a Schottky diode in series to avoid the reverse current to the power supply IC. 3.5.
  • Page 40 Smart Module Series The turning-on scenario is illustrated in the following figure. Note2 VBA T(Typ. 3.8 V) PWRKEY > 1.6 s 132 ms LDO15A_1V8 Software controlled Software controlled LDO17A_3V0 47 s Others Acti ve Figure 8: Turn-on Timing NOTE 1. When the module is turned on for the first time, the turn-on timing may be different from that shown above.

  • Page 41: Turn Off

    Smart Module Series 3.5.2. Turn Off Drive the PWRKEY pin low for at least 1 s, and then choose to turn off the module when the prompt window comes up. You can also force the module to turn off by driving PWRKEY low for at least 8 s. The force-turn-off timing is illustrated by the following figure.

  • Page 42: Power Output

    Smart Module Series 3.7. Power Output The module supports output of regulated voltages for peripheral circuits. In applications, it is recommended to use a 33 pF and a 10 pF capacitor in parallel in the circuit to suppress high-frequency noise. Table 8: Power Description Pin Name Pin No.
  • Page 43 Smart Module Series Table 9: Pin Definition of Charging Interface Pin Name Pin No. Description Comment BAT_P Battery voltage detect (+) Cannot be kept open. BAT_M Battery voltage detect (-) Internal pull up by default. Supports 47 kΩ NTC thermistor by BAT_THERM Battery temperature detect default.

  • Page 44: Usb Interface (Type-C)

    Smart Module Series If the thermistor is not available in the battery, or an adapter is utilized to power the module, you must connect BAT_THERM to GND via a 47 kΩ resistor. Otherwise, the system may mistakenly judge that the battery temperature is abnormal, and therefore cause battery charging failure.
  • Page 45 Smart Module Series USB_SS2_RX_P USB 3.1 channel 2 superspeed receive (+) USB_SS2_RX_M USB 3.1 channel 2 superspeed receive (-) USB_SS2_TX_P USB 3.1 channel 2 superspeed transmit (+) USB_SS2_TX_M USB 3.1 channel 2 superspeed transmit (-) USB_CC1 USB Type-C detect 1 USB_CC2 USB Type-C detect 2 USB Type-C...

  • Page 46: Uart Interfaces

    Smart Module Series ⚫ For USB 3.1, it is suggested to do simulation after the design is completed. If the cable is too long or there are too many vias, a redriver needs to be added to ensure the quality of signal transmission if necessary.
  • Page 47 Smart Module Series UART0_RTS DCE request to send signal to DTE UART0_CTS DCE clear to send signal from DTE DBG_TXD Debug UART transmit DBG_RXD Debug UART receive UART1_TXD UART1 transmit UART1_RXD UART1 receive UART0 is a four-wire UART interface with 1.8 V power domain. You should use a level translator if your application is equipped with a 3.3 V UART interface.

  • Page 48: U)Sim Interfaces

    Smart Module Series NOTE UART4 (debug UART) and UART1 are similar to UART0. Please refer to the reference design of UART0 for the designs of the two UARTs. 3.11. (U)SIM Interfaces The module provides two (U)SIM interfaces that meet ETSI and IMT-2000 requirements. Dual SIM Dual Standby is supported by default.
  • Page 49 The module supports (U)SIM card hot-plug via the USIM_DET pins. This function is disabled by default via software. To enable it, contact Quectel Technical Support to change the software configuration. A reference circuit for (U)SIM interface with an 8-pin (U)SIM card connector is shown below.

  • Page 50: Sd Card Interface

    Smart Module Series To enhance the reliability and availability of the (U)SIM card in applications, please follow the criteria below in (U)SIM circuit design: ⚫ Place the (U)SIM card connector as close to the module as possible. Keep the trace length as short as possible, at most 200 mm.
  • Page 51 Smart Module Series A reference circuit for the SD card interface is shown below. SD_LDO21 SD_LDO4 LDO15A_1V8 120K NM_51K NM_51K NM_10K NM_51K NM_51K SD_DATA2 P1-DAT2 SD_DATA3 P2-CD/DAT3 SD_CMD P3-CMD P4-VDD SD_CLK P5-CLK P6-VSS SD_DATA0 P7-DAT0 SD_DATA1 P8-DAT1 SD_DET DETECTIVE Module 4.7 μF 33 pF SD Card Connector...

  • Page 52: Gpio Interfaces

    Smart Module Series SD_DATA3 35.10 3.13. GPIO Interfaces The module has abundant GPIO interfaces with a power domain of 1.8 V. The pin definition is listed below. Table 16: Pin Definition of GPIO Interfaces Pin Name Pin No. Description Comment GPIO_28 General-purpose input/output GPIO_31...

  • Page 53: I2C Interfaces

    Smart Module Series GPIO_102 General-purpose input/output GPIO_103 General-purpose input/output GPIO_104 General-purpose input/output GPIO_105 General-purpose input/output GPIO_106 General-purpose input/output GPIO_107 General-purpose input/output GPIO_14 General-purpose input/output GPIO_15 General-purpose input/output GPIO_16 General-purpose input/output GPIO_17 General-purpose input/output PMU_GPIO03 General-purpose input/output PMU_GPIO04 General-purpose input/output PMU_GPIO08 General-purpose input/output PMU_GPIO07 General-purpose input/output...

  • Page 54: Adc Interface

    Smart Module Series 1.8 V externally. Can be TP_I2C_SDA TP I2C data used for other I2C devices. CAM0_I2C_SCL I2C clock of camera 0 CAM0_I2C_SDA I2C data of camera 0 Can only be used for camera I2C devices. CAM1_I2C_SCL I2C clock of camera 1 CAM1_I2C_SDA I2C data of camera 1 SENSOR_I2C_SCL...

  • Page 55: Lcm Interface

    Smart Module Series The motor is driven by an exclusive circuit, and a reference circuit is shown below. VIB_DRV_P VIB+ 33 pF VIB- Module Motor Figure 18: Reference Circuit for Motor Connection When the motor stops working and the VIB_DRV_P is disconnected, the redundant electricity on the motor can be discharged from the circuit loop formed by diodes, thus avoiding damage to components.
  • Page 56 Smart Module Series DSI_LN2_P LCD MIPI lane 2 data (+) DSI_LN3_N LCD MIPI lane 3 data (-) DSI_LN3_P LCD MIPI lane 3 data (+) PWM output 1.8 V power domain. A reference circuit for the LCM interface is shown below. LDO_IOVDD LDO15A_1V8 LEDA...

  • Page 57: Flash Interface

    Smart Module Series It is recommended to read the LCM ID register through MIPI when compatible design with other displays is required. If several LCMs share the same IC, it is recommended that the LCM factory should burn an OTP register to distinguish different screens. You can also connect the LCD_ID pin of LCM to the ADC pin of the module, but you need to make sure that the output voltage of LCD_ID should not exceed the voltage range of the ADC pin.

  • Page 58: Touch Panel Interface

    Smart Module Series 3.19. Touch Panel Interface The module provides one I2C interface for the connection to a Touch Panel (TP), and also provides the corresponding power supply and interrupt pins. The definition of TP interface pin is illustrated below. Table 22: Pin Definition of Touch Panel Interface Pin Name Pin No.

  • Page 59: Camera Interfaces

    Smart Module Series 3.20. Camera Interfaces Based on MIPI CSI standard, the module supports two cameras (4-lane + 4-lane) or three cameras (4- lane + 2-lane + 1-lane), and the maximum pixel of the camera can be up to 25 MP. The video and photo quality are determined by various factors such as the camera sensor and camera lens specifications.
  • Page 60 Smart Module Series CSI0_LN3_P MIPI CSI0 lane 3 data (+) Need to be pulled up to 1.8 V CAM0_I2C_SCL I2C clock of camera 0 externally. Can only be used for camera CAM0_I2C_SDA I2C data of camera 0 I2C devices. CAM0_PWDN Power down of camera 0 CAM1_PWDN Power down of camera 1...
  • Page 61 Smart Module Series The following is a reference circuit design for 3-camera applications. 1 μF AF_VDD VPH_PWR GPIO 1 μF VDD_2V8 VPH_PWR GPIO 1 μF AVDD VPH_PWR DVDD GPIO DOVDD LDO15A_1V8 CAM0_ RST CAM0_PWDN CAM0_MCLK CAM0_I2C_SDA CAM0_I2C_SCL CSI0_LN3_P CSI0_LN3_N CSI0_LN2_P CSI0_LN2_N CSI0_LN1_P CSI0_LN1_N...

  • Page 62: Mipi Design Considerations

    Smart Module Series 3.20.1. MIPI Design Considerations ⚫ Special attention should be paid to the pin definition of LCM and camera connectors. Make sure the module and the connectors are correctly connected. ⚫ MIPI lines are high-speed signal lines for DSI-supported maximum data rate of up to 1.5 Gbps and CSI-supported maximum data rate of up to 2.5 Gbps.

  • Page 63: Sensor Interface

    Smart Module Series CSI1_LN0_P 19.18 CSI1_LN1_N 19.02 -0.26 CSI1_LN1_P 19.28 CSI1_LN2_N 19.53 CSI1_LN2_P 19.23 CSI1_LN3_N 18.93 0.11 CSI1_LN3_P 18.82 CSI0_CLK_N 20.94 0.21 CSI0_CLK_P 20.73 CSI0_LN0_N 18.74 0.34 CSI0_LN0_P 18.40 CSI0_LN1_N 17.18 -0.19 CSI0_LN1_P 17.37 CSI0_LN2_N 8.28 0.13 CSI0_LN2_P 8.15 CSI0_LN3_N 4.97 0.27 CSI0_LN3_P...

  • Page 64: Audio Interfaces

    Smart Module Series 3.22. Audio Interfaces The module provides three analog input channels and three analog output channels. The following table shows the pin definition. Table 26: Pin Definition of Audio Interfaces Pin Name Pin No. Description Comment Bias voltage 1 output for MIC_BIAS1 The rated output current is 3 mA.

  • Page 65: Reference Circuit Design For Microphone Interfaces

    Smart Module Series ⚫ The lineout interface uses differential output, lineout is used as audio PA input. ⚫ The headphone interface features stereo left and right channel output, and supports headphone insertion detection. 3.22.1. Reference Circuit Design for Microphone Interfaces MIC_BIAS1 MIC_BIAS1 2.2K...

  • Page 66: Reference Circuit Design For Earpiece Interface

    Smart Module Series 3.22.2. Reference Circuit Design for Earpiece Interface 33 pF EAR_P 33 pF EAR_M 33 pF Module Figure 25: Reference Circuit Design for Earpiece Interface 3.22.3. Reference Circuit Design for Headset Interface MIC2_P HPH_L HS_DET HPH_R HPH_GND D1 D2 D3 D4 Module 33 pF 33 pF 33 pF...

  • Page 67: Reference Circuit Design For Lineout Interface

    Smart Module Series 3.22.4. Reference Circuit Design for Lineout Interface VPH_PWR Audio PA PA_EN 100 pF 100K 10 μF LINEOUT_P 10 μ F 100K LINEOUT_M 22 μ F 1 μ F 33 pF 33 pF Figure 27: Reference Circuit Design for Lineout Interface 3.22.5.

  • Page 68: Usb_Boot

    Smart Module Series 3.23. USB_BOOT USB_BOOT is an emergency download interface. You can force the module to enter emergency download mode by pulling it up to LDO15A_1V8 when the module is turning on. This is an emergency option when failures such as abnormal start-up or running occur. For firmware upgrade and debugging in the future, reserve the following reference design.

  • Page 69: Wi-Fi/Bluetooth

    Smart Module Series Wi-Fi/Bluetooth The module provides a shared antenna interface ANT_WIFI/BT for Wi-Fi and Bluetooth functions. The interface impedance should be controlled to 50 Ω. You can connect external antennas such as PCB antenna, sucker antenna, and ceramic antenna to the module via the interface to achieve Wi-Fi and Bluetooth functions.
  • Page 70 Smart Module Series 802.11g 54 Mbps 14.5 dBm ±3 dB 802.11n HT20 MCS0 15 dBm ±3 dB 802.11n HT20 MCS7 14.5 dBm ±3 dB 802.11n HT40 MCS0 15 dBm ±3 dB 802.11n HT40 MCS7 13.5 dBm ±3 dB 802.11a 6 Mbps 15.5 dBm ±3 dB 802.11a 54 Mbps...

  • Page 71: Bluetooth

    Smart Module Series 802.11n HT20 MCS7 -71 dBm 802.11n HT40 MCS0 -87 dBm 802.11n HT40 MCS7 -70 dBm 802.11a 6 Mbps -90 dBm 802.11a 54 Mbps -74 dBm 802.11n HT20 MCS0 -90 dBm 802.11n HT20 MCS7 -70 dBm 802.11n HT40 MCS0 -87 dBm 802.11n HT40...

  • Page 72: Bluetooth Performance

    Smart Module Series The BR/EDR channel bandwidth is 1 MHz, and can accommodate 79 channels. The BLE channel bandwidth is 2 MHz, and can accommodate 40 channels. Table 30: Bluetooth Data Rate and Version Version Data Rate Maximum Application Throughput 1 Mbit/s >...

  • Page 73: Gnss

    Smart Module Series GNSS The module integrates a IZat™ GNSS engine (GEN 8C) which supports multiple positioning and navigation systems including GPS, GLONASS, Galileo, BDS, QZSS, SBAS and NavIC . With an embedded LNA, the positioning accuracy of the module has been significantly improved. 5.1.

  • Page 74: Gnss Rf Design Guidelines

    Smart Module Series 5.2. GNSS RF Design Guidelines Bad design of antenna and layout may cause reduced GNSS receiving sensitivity, longer GNSS positioning time, or reduced positioning accuracy. In order to avoid this, follow the reference design rules as below: ⚫...

  • Page 75: Antenna Interfaces

    Smart Module Series Antenna Interfaces SC200E-CE/EM/NA provides four antenna interfaces for the main, Rx-diversity, Wi-Fi/Bluetooth, and GNSS antennas respectively, while SC200E-WF provides one antenna interface for Wi-Fi/Bluetooth antenna only. The impedance of the antenna ports should be controlled to 50 Ω. 6.1.
  • Page 76 Smart Module Series LTE-FDD B3 1805–1880 1710–1785 LTE-FDD B5 869–894 824–849 LTE-FDD B8 925–960 880–915 LTE-TDD B34 2010–2025 2010–2025 LTE-TDD B38 2570–2620 2570–2620 LTE-TDD B39 1880–1920 1880–1920 LTE-TDD B40 2300–2400 2300–2400 LTE-TDD B41 2535–2675 2535–2675 Table 35: SC200E-EM Operating Frequency 3GPP Bands Receive Transmit...
  • Page 77 Smart Module Series LTE-FDD B7 2620–2690 2500–2570 LTE-FDD B8 925–960 880–915 LTE-FDD B20 791–821 832–862 LTE-FDD B28 758–803 703–748 LTE-TDD B38 2570–2620 2570–2620 LTE-TDD B40 2300–2400 2300–2400 LTE-TDD B41 2496–2690 2496–2690 Table 36: SC200E-NA Operating Frequency 3GPP Bands Receive Transmit Unit LTE-FDD B2 1930–1990...

  • Page 78: Reference Design

    Smart Module Series 6.1.2. Reference Design A reference circuit design for the main and Rx-diversity antenna interfaces is shown below. Reserve a π- type matching circuit for each antenna to achieve better RF performance, and place the π-type matching components (R1/C1/C2 and R2/C3/C4) as close to the antennas as possible. The capacitors are not mounted by default and the resistors are 0 Ω.

  • Page 79: Gnss Antenna Interface

    Smart Module Series Table 38: Wi-Fi/Bluetooth Frequency Type Frequency Unit Wi-Fi (2.4 GHz) 2402–2482 Wi-Fi (5 GHz) 5180–5825 Bluetooth 5.0 2402–2480 A reference circuit design for Wi-Fi/Bluetooth antenna interface is shown as below. C1 and C2 are not mounted by default and the resistor is 0 Ω. Wi-Fi/ Bluetooth antenna...

  • Page 80: Reference Circuit Design For Passive Gnss Antenna

    Smart Module Series Table 40: GNSS Frequency Type Frequency Unit GPS L1 1575.42 ±1.023 GPS L5 1176.45 ±10.23 GLONASS L1 1597.5–1605.8 BDS B1I 1561.098 ±2.046 Galileo E1 1575.42 ±2.046 Galileo E5a 1176.45 ±10.23 QZSS L1 1575.42 ±1.023 QZSS L5 1176.45 ±10.23 SBAS L1 1575.42 ±1.023 SBAS L5...

  • Page 81: Reference Circuit Design For Active Gnss Antenna

    Smart Module Series 6.3.2. Reference Circuit Design for Active GNSS Antenna The active antenna is powered by a 56 nH inductor through the antenna's signal path. The common power supply voltage ranges from 3.3 V to 5.0 V. Despite its low power consumption, the active antenna still requires stable and clean power supplies.
  • Page 82 Smart Module Series Figure 33: Microstrip Design on a 2-layer PCB Figure 34: Coplanar Waveguide Design on a 2-layer PCB Figure 35: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground) Figure 36: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground) SC200E_Series_Hardware_Design 81 / 115...

  • Page 83: Antenna Installation

    Smart Module Series In order to ensure RF performance and reliability, follow the principles below in RF layout design: ⚫ Use an impedance simulation tool to accurately control the characteristic impedance of RF traces to 50 Ω. ⚫ The GND pins adjacent to RF pins should not be designed as thermal relief pads, and should be fully connected to ground.

  • Page 84: Rf Connector Recommendation

    Smart Module Series Polarization Type: Vertical Cable Insertion Loss: < 1 dB Frequency range (L1): 1559–1609 MHz Frequency range (L5): 1166–1187 MHz (SC200E-NA only) Polarization: RHCP or linear VSWR: < 2 (Typ.) Passive antenna gain: > 0 dBi GNSS Active antenna noise figure: < 1.5 dB (Typ.) Active antenna gain: >...
  • Page 85 Smart Module Series U.FL-LP serial plugs listed in the following figure can be used to match U.FL-R-SMT. Figure 38: Mechanicals of U.FL-LP Plugs The following figure describes the space factor of mated connectors. Figure 39: Space Factor of Mated Connectors (Unit: mm) For more details, visit http://www.hirose.com.

  • Page 86: Reliability, Radio And Electrical Characteristics

    Smart Module Series Reliability, Radio and Electrical Characteristics 7.1. Absolute Maximum Ratings Absolute maximum ratings for power supply and voltage on digital and analog pins of the module are listed in the following table. Table 42: Absolute Maximum Ratings Parameter Min.

  • Page 87: Digital I/O Characteristics

    Smart Module Series USB_VBUS Charging power input 7.3. Digital I/O Characteristics Table 44: 1.8 V Digital I/O Requirements Parameter Description Min. Max. Unit Input high voltage 1.17 Input low voltage -0.3 0.63 Output high voltage 1.35 Output low voltage 0.45 Table 45: (U)SIM 1.8 V I/O Requirements Parameter Description...

  • Page 88: Operating And Storage Temperatures

    Smart Module Series Output high voltage 2.36 2.95 Output low voltage Table 47: SD Card 1.8 V I/O Requirements Parameter Description Min. Max. Unit Input high voltage 1.27 Input low voltage -0.3 0.58 Output high voltage Output low voltage 0.45 Table 48: SD Card 2.95 V I/O Requirements Parameter Description...

  • Page 89: Power Consumption

    Smart Module Series 7.5. Power Consumption The values of current consumption are shown below. Table 50: SC200E-CE Power Consumption Description Conditions Typ. Unit μ OFF state Power off Sleep state (USB disconnected) @ DRX = 2 4.93 GSM/GPRS supply current Sleep state (USB disconnected) @ DRX = 5 4.26 Sleep state (USB disconnected) @ DRX = 9...
  • Page 90 Smart Module Series EGSM900 @ PCL 19 DCS1800 @ PCL 0 DCS1800 @ PCL 7 DCS1800 @ PCL 15 B1 @ max. power WCDMA voice call B8 @ max. power EGSM900 (1UL/4DL) @ PCL 5 EGSM900 (2UL/3DL) @ PCL 5 EGSM900 (3UL/2DL) @ PCL 5 EGSM900 (4UL/1DL) @ PCL 5 GPRS data transmission...
  • Page 91 Smart Module Series B8 (HSUPA) @ max power EV-DO/CDMA data BC0 @ max power transmission LTE-FDD B1 @ max power LTE-FDD B3 @ max power LTE-FDD B5 @ max power LTE-FDD B8 @ max power LTE data transmission LTE-TDD B34 @ max power LTE-TDD B38 @ max power LTE-TDD B39 @ max power LTE-TDD B40 @ max power...
  • Page 92 Smart Module Series Sleep state (USB disconnected) @ DRX = 5 6.36 Sleep state (USB disconnected) @ DRX = 6 5.03 LTE-TDD supply current Sleep state (USB disconnected) @ DRX = 7 4.38 Sleep state (USB disconnected) @ DRX = 8 4.02 GSM850 @ PCL 5 GSM850 @ PCL 12...
  • Page 93 Smart Module Series EGSM900 (3UL/2DL) @ PCL 5 EGSM900 (4UL/1DL) @ PCL 5 DCS1800 (1UL/4DL) @ PCL 0 DCS1800 (2UL/3DL) @ PCL 0 DCS1800 (3UL/2DL) @ PCL 0 DCS1800 (4UL/1DL) @ PCL 0 PCS1900 (1UL/4DL) @ PCL 0 PCS1900 (2UL/3DL) @ PCL 0 PCS1900 (3UL/2DL) @ PCL 0 PCS1900 (4UL/1DL) @ PCL 0 GSM850 (1UL/4DL) @ PCL 8...
  • Page 94 Smart Module Series B2 (HSDPA) @ max power B4 (HSDPA) @ max power B5 (HSDPA) @ max power B8 (HSDPA) @ max power B1 (HSUPA) @ max power B2 (HSUPA) @ max power B4 (HSUPA) @ max power B5 (HSUPA) @ max power B8 (HSUPA) @ max power LTE-FDD B1 @ max power LTE-FDD B2 @ max power...

  • Page 95: Tx Power

    Smart Module Series Sleep state (USB disconnected) @ DRX = 8 Sleep state (USB disconnected) @ DRX = 9 Sleep state (USB disconnected) @ DRX = 6 LTE-TDD supply current Sleep state (USB disconnected) @ DRX = 8 Sleep state (USB disconnected) @ DRX = 9 LTE-FDD B2 @ max power LTE-FDD B4 @ max power LTE-FDD B5 @ max power...
  • Page 96 Smart Module Series WCDMA B1 24 dBm +1/-3 dB < -49 dBm WCDMA B8 24 dBm +1/-3 dB < -49 dBm EV-DO/CDMA BC0 24 dBm +3/-1 dB < -49 dBm LTE-FDD B1 23 dBm ±2 dB < -39 dBm LTE-FDD B3 23 dBm ±2 dB <...
  • Page 97 Smart Module Series LTE-FDD B5 23 dBm ±2 dB < -39 dBm LTE-FDD B7 23 dBm ±2 dB < -39 dBm LTE-FDD B8 23 dBm ±2 dB < -39 dBm LTE-FDD B20 23 dBm ±2 dB < -39 dBm LTE-FDD B28 23 dBm ±2 dB <...

  • Page 98: Rx Sensitivity

    Smart Module Series 7.7. Rx Sensitivity The following table shows the RF receiving sensitivity of the module. Table 56: SC200E-CE RF Rx Sensitivity Receiving Sensitivity (dBm) (Typ.) Frequency Bands 3GPP (SIMO) Primary Diversity SIMO EGSM900 -109.5 -102.4 -109 DCS1800 -102.4 WCDMA B1 -110.5 -112...
  • Page 99 Smart Module Series PCS1900 -108.6 -102.4 WCDMA B1 -109.3 -111.2 -106.7 WCDMA B2 -109.2 -110.3 -104.7 WCDMA B4 -108.4 -111.2 -106.7 WCDMA B5 -111 -111 -104.7 WCDMA B8 -110.9 -112 -103.7 LTE-FDD B1 (10 MHz) -97.5 -101.5 -96.3 LTE-FDD B2 (10 MHz) -100.5 -94.3 LTE-FDD B3 (10 MHz)

  • Page 100: Esd Protection

    Smart Module Series LTE-FDD B14 (10 MHz) -93.3 LTE-FDD B17 (10 MHz) -93.3 LTE-FDD B25 (10 MHz) -92.8 LTE-FDD B26 (10 MHz) -93.8 LTE-FDD B66 (10 MHz) -95.8 LTE-FDD B71 (10 MHz) -93.5 LTE-TDD B41 (10 MHz) -94.3 7.8. ESD Protection Static electricity occurs naturally and it may damage the module.

  • Page 101: Mechanical Information

    Smart Module Series Mechanical Information This chapter describes the mechanical dimensions of the module. All dimensions are measured in millimeter (mm), and the dimensional tolerances are ±0.2 mm unless otherwise specified. 8.1. Mechanical Dimensions Figure 40: Module Top and Side Dimensions SC200E_Series_Hardware_Design 100 / 115...
  • Page 102 Smart Module Series Figure 41: Module Bottom Dimensions (Bottom View) NOTE The package warpage level of the module conforms to JEITA ED-7306 standard. SC200E_Series_Hardware_Design 101 / 115...

  • Page 103: Recommended Footprint

    Smart Module Series 8.2. Recommended Footprint Figure 42: Recommended Footprint (Top View) NOTE Keep at least 3 mm between the module and other components on the motherboard to improve soldering quality and maintenance convenience. SC200E_Series_Hardware_Design 102 / 115...

  • Page 104: Top And Bottom Views

    Figure 43: Top and Bottom Views of the Module NOTE Images above are for illustration purpose only and may differ from the actual module. For authentic appearance and label, please refer to the module received from Quectel. SC200E_Series_Hardware_Design 103 / 115...

  • Page 105: Storage, Manufacturing & Packaging

    Smart Module Series Storage, Manufacturing & Packaging 9.1. Storage Conditions The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage requirements are shown below. 1. Recommended Storage Condition: the temperature should be 23 ±5 °C and the relative humidity should be 35–60 %.

  • Page 106: Manufacturing And Soldering

    Smart Module Series NOTE 1. To avoid blistering, layer separation and other soldering issues, extended exposure of the module to the air is forbidden. 2. Take out the module from the package and put it on high-temperature-resistant fixtures before baking. All modules must be soldered to PCB within 24 hours after the baking, otherwise put them in the drying oven.
  • Page 107 2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the module. 3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic soldering) that is not mentioned in document [4].

  • Page 108: Packaging Specification

    Smart Module Series 9.3. Packaging Specification Dimension details are as follow: Figure 45: Carrier Tape Dimension Drawing Table 61: Recommended Thermal Profile Parameters 41.2 41.2 34.2 1.75 9.3.1. Plastic Reel Figure 46: Plastic Reel Dimension Drawing SC200E_Series_Hardware_Design 107 / 115...

  • Page 109: Packaging Process

    Smart Module Series Table 62: Plastic Reel Dimension Table (Unit: mm) ø D1 ø D2 72.5 9.3.2. Packaging Process Place the module into the carrier tape and use the cover tape to cover them; then wind the heat-sealed carrier tape to the plastic reel and use the protective tape for protection.

  • Page 110: Appendix References

    Smart Module Series Appendix References Table 63: Related Documents Document Name [1] Quectel_Smart_EVB_G2_User_Guide [2] Quectel_SC200E_Series_GPIO_Configuration [3] Quectel_RF_Layout_Application_Note [4] Quectel_Module_Secondary_SMT_Application_Note Table 64: Terms and Abbreviations Abbreviation Description 3GPP 3rd Generation Partnership Project Analog-to-Digital Converter ADSP Audio Digital Signal Processor Ambient Light Sensor AMR-NB Adaptive Multi Rate-Narrow Band Speech Codec AMR-WB...
  • Page 111 Smart Module Series CDMA Code Division Multiple Access Circular Error Probable Customer-Premise Equipment Coding Scheme Circuit Switched Data Camera Serial Interface Clear to Send Dual Carrier DC-HSPA+ Dual Carrier High Speed Packet Access Plus Data Communications Equipment/Data Circuit terminating Equipment Digital Cellular System Downlink DPSK...
  • Page 112 Smart Module Series Electrostatic Discharge Equivalent Series Resistance ETSI European Telecommunications Standards Institute Evaluation Board EV-DO Evolution-Data Optimized EVRC Enhanced Variable Rate Codec Frequency Division Duplex Frame per Second Full Rate Galileo Galileo Satellite Navigation System (EU) GFSK Gaussian Frequency Shift Keying GLONASS Global Navigation Satellite System (Russia) GMSK...
  • Page 113 Smart Module Series HSPA+ High-Speed Packet Access+ HSUPA High Speed Uplink Packet Access High Throughput Inter-Integrated Circuit Integrated Circuit IEEE Institute of Electrical and Electronics Engineers IMT-2000 International Mobile Telecommunications for the year 2000 Input/Output Maximum Input Load Current Maximum Output Load Current Image Signal Processor/Internet Service Provider Leadless Chip Carrier Liquid Crystal Display...
  • Page 114 Smart Module Series Microphone MIMO Multi-Input Multi-Output / Multiple Input Multiple Output MIPI Mobile Industry Processor Interface Megapixel Mobile Originating/Originated Minimum Order Quantity Moisture Sensitivity Levels Mobile Terminating/Terminated NavIC Indian Regional Navigation Satellite System N.W. Net Weight Near Field Communication Negative Temperature Coefficient Over-the-Air Upgrade On-The-Go...
  • Page 115 Smart Module Series Pulse Width Modulation Phase Shift Keying Quadrature Amplitude Modulation QPSK Quadrature Phase Shift Keying QZSS Quasi-Zenith Satellite System Radio Frequency RHCP Right Hand Circular Polarization RoHS Restriction of Hazardous Substances Real Time Clock Request to Send SBAS Satellite-Based Augmentation System Synchronous Connection Oriented Secure Digital...
  • Page 116 Smart Module Series Universal Serial Bus (U)SIM (Universal) Subscriber Identity Module VBAT Voltage at Battery (Pin) Very High Throughput Vmax Maximum Voltage Vmin Minimum Voltage Vnom Nominal Voltage Absolute Maximum Input Voltage Absolute Minimum Input Voltage Minimum High-level Input Voltage Maximum Low-level Input Voltage Maximum Output Voltage Minimum High-level Output Voltage...

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