Related Manuals for Infineon PG-LQFP
Summary of Contents for Infineon PG-LQFP
- Page 1 Recommendations for Board Assembly of Infineon Quad Flat Packages Additional Information Please read the Important Notice and Warnings at the end of this document Revision 6.0 www.infineon.com page 1 of 20 2020-11-12...
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Page 2: Table Of Contents
Recommendations for Board Assembly of Infineon Quad Flat Packages Table of Contents Table of Contents Table of Contents ........................... 2 Acronyms and Abbreviations ......................3 Package Description ....................... 4 QFP Package Type ........................... 4 Package Features and General Handling Guidelines ................4 Printed Circuit Board ...................... -
Page 3: Acronyms And Abbreviations
Recommendations for Board Assembly of Infineon Quad Flat Packages Acronyms and Abbreviations Acronyms and Abbreviations ………………………………………… Automated Optical Inspection ………………………………………… Automated X-ray Inspection ………………………………………… Electrostatic Discharge ………………………………………… Integrated Circuit ………………………………………… Input/Output ………………………………………… Lead Frame LQFP ………………………………………… Low-profile Quad Flat Package MQFP …………………………………………... -
Page 4: Package Description
For further information about component handling, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer. - Page 5 Termination Plating Infineon QFP are available with matte tin (Sn) surface finish or with a Pre-Plated lead Frame (PPF). While the Sn-plating is applied to the base metal by a post-mold process, the PPF provides a solderable surface that is already deposited on the lead frame prior to the die attach process.
- Page 6 Package Description Figure 3 Soldered gullwing leads with post-mold plated Sn (left) and with pre-plated Ni/Pd/Au (right). For further information about the specific component configuration, please contact your local Infineon sales, application, or quality engineer. Additional Information 6 of 20 Revision 6.0...
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Page 7: Printed Circuit Board
Recommendations for Board Assembly of Infineon Quad Flat Packages Printed Circuit Board Printed Circuit Board Routing Printed circuit board design and construction are key factors for achieving solder joints with high reliability. Packages with exposed pads should not be placed opposite to each other on either side of a PCB when doing double-sided mounting. - Page 8 For further information about PCB pad design, please refer to the General Recommendations for Borad Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer.
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Page 9: Via-In-Pad Design
Further details and specific footprint recommendations can be found in Infineon package data that is available on the Infineon web page [1]. Please choose a specific package when searching the data base, which will then show you an example of the stencil aperture layout for each package. - Page 10 For further information about vias in pad, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer.
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Page 11: Pcb Assembly
For further information about solder stencil design, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer. -
Page 12: Component Placement
For further information about component placement, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer. - Page 13 For further information about reflow soldering, please refer to the General Recommendations for Board Assembly of Infineon Packages document that is available on the Infineon web page [1]. Please also feel free to contact your local sales, application, or quality engineer.
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Page 14: Cleaning
Recommendations for Board Assembly of Infineon Quad Flat Packages Cleaning Cleaning After the soldering process, some flux residues may remain on the board, especially near the solder joints. Generally, cleaning beneath a SMT component is difficult due to the small gap between the component body and the PCB. -
Page 15: Inspection
Recommendations for Board Assembly of Infineon Quad Flat Packages Inspection Inspection Optical Solder Joint Inspection The visual inspection of the solder joints at the gullwing-shaped QFP leads with conventional Automated Optical Inspection (AOI) systems is a standard procedure. Figure 8 shows optical images of two properly soldered QFP with either having Sn plating or a PPF. - Page 16 Recommendations for Board Assembly of Infineon Quad Flat Packages Inspection board pad size, the via and stencil layout, the solder paste, and the reflow profile. For thermal evaluations, the entire thermal path must be considered as well as all boundary conditions such as the application environment or the electrical use of the component.
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Page 17: Rework
Infineon. The component shall be returned in a proper condition according to the original package outlines. In some special cases such as solder joint inspection Infineon may request that the PCB or part of the PCB with the component still attached should be sent to Infineon. -
Page 18: References
Recommendations for Board Assembly of Infineon Quad Flat Packages References References Infineon: Packages. www.infineon.com\packages. International Electrotechnical Commission: IEC 60068-2-58. Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD). -
Page 19: Revision History
Recommendations for Board Assembly of Infineon Quad Flat Packages Revision History Revision History Page or reference Major changes since the last revision Section 6 “Rework” Update of sample conditions in case of return. Entire document Editorial review. Additional Information 19 of 20 Revision 6.0... - Page 20 Do you have a question about this Except as otherwise explicitly approved by Infineon information given in this application note. Technologies in a written document signed by...