Infineon Easy 1B Assembly Instructions Manual
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Infineon Easy 1B Assembly Instructions Manual

Infineon Easy 1B Assembly Instructions Manual

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AN2023-07
Assembly Instructions for the Easy Modules

About this document

Scope and purpose
This application note provides a guideline on how to use and implement Easy modules. The values and
recommendations provided in this document should not be considered as datasheet values.
Intended audience
This document is intended for all experts using Infineon Easy modules.
Application Note
Please read the Important Notice and Warnings at the end of this document
Revision 1.0
www.infineon.com
2023-07-12

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Summary of Contents for Infineon Easy 1B

  • Page 1: About This Document

    Intended audience This document is intended for all experts using Infineon Easy modules. Application Note Please read the Important Notice and Warnings at the end of this document Revision 1.0...

  • Page 2: Table Of Contents

    Assembly Instructions for the Easy Modules Table of contents Table of contents About this document ........................1 Table of contents ..........................2 General information ....................... 4 General information on power module handling .................. 5 Requirements for printed circuit boards ................7 PCB requirements for the PressFIT technology ..................
  • Page 3 Assembly Instructions for the Easy Modules Table of contents Revision History ..........................42 Application Note Revision 1.0 2023-07-12...

  • Page 4: General Information

    RoHs conformity and simple handing. Infineon uses two types of PressFIT pins in the Easy product series. Depending on power density and performance, a distinction is made between standard and high-current PressFIT pins. The differences are in the material properties as well as in the PressFIT zones.

  • Page 5: General Information On Power Module Handling

    Assembly Instructions for the Easy Modules General information Easy PressFIT contacts have a contact zone of approximately 1.7 mm length that adapts itself to the hole in the PCB during the press-in process. It results in a plastic deformation of the pressfit zone. This deformation is intended to accommodate the tolerance, and provides the basis for the cold welding.
  • Page 6 Assembly Instructions for the Easy Modules General information Forces on the housing during module handling should be avoided to prevent a push-out of the Figure 5 Some modules will have quite low DCB push-out forces (Fp), the minimum value of which is not a confirmed property of the power module.

  • Page 7: Requirements For Printed Circuit Boards

    PCB requirements for the PressFIT technology The PressFIT technology used in the Easy modules has been inspected and qualified by Infineon Technologies AG for standard FR4 PCBs according to the IEC 60352-5 and IEC 60747-15 with “chemical tin” and a hot-air- leveling (HAL) surface.
  • Page 8 Assembly Instructions for the Easy Modules Requirements for printed circuit boards Drill hole 1.15 -0.03 1.15 -0.03 Copper in drill hole Annular ring min. 0.2 mm min. 25 µm Cu ; max. 50 µm Cu Final hole diameter max. 15 µm tin chemical tin typ.

  • Page 9: Pcb Requirements For Soldering The Pressfit Modules

    Assembly Instructions for the Easy Modules Requirements for printed circuit boards PCB requirements for soldering the PressFIT modules The Easy PressFIT pin is qualified for solderability according to the IEC standard 60068-2-20, allowing the assemblies of the EasyPIM™ and EasyPACK products to be soldered to the PCB. Soldering can be used as an alternative mounting option to the PressFIT technology.

  • Page 10: The Press-In Process

    60352-5. A PressFIT speed of under 25 mm/min can lead to increased press-in forces and a deformation of the pins, or to a connection that is not gas-tight. Infineon recommends a press-in speed of about 100 mm/min. The typical press-in speed for automated assembly lines is up to 450 mm/min.

  • Page 11: Press-In Process Of A Module With Thermal Interface Material (Tim)

    Assembly Instructions for the Easy Modules The press-in process The press is aligned so The printed circuit board The module is placed on The module contacts are that all parts of the tool is placed on the tool and the tool and positioned pressed into the PCB by are directly above the held in place by the...
  • Page 12 Assembly Instructions for the Easy Modules The press-in process Figure 10 shows the imprint of an Easy2B module with TIM before and after the press-in process. Easy2B with TIM before (shown left) and after (shown right) the press-in process Figure 10 The structure of the presented TIM surface is shown as an example only, and is different for the products within the Easy family.

  • Page 13: 3.2.3 General Press-In Process For Several Modules On Pcbs

    Assembly Instructions for the Easy Modules The press-in process 3.2.3 General press-in process for several modules on PCBs Pressing several power modules onto a large PCB requires a special procedure due to the manufacturing- related tolerances of the modules and the PCB. This procedure is necessary to address the deviations in height between the modules from the DCB and the PCB surface, which could have a significant impact on the thermal performance and the lifetime of the modules.
  • Page 14 Assembly Instructions for the Easy Modules The press-in process The module is then placed on the guiding elements and the module pins are inserted into the PCB. The module is now placed flush with the press tool after the pins have been inserted into the PCB.

  • Page 15: Press-In Only Easy3B And Easy4B Modules Into A Pcb

    Assembly Instructions for the Easy Modules The press-in process 3.2.3.1 Press-in only Easy3B and Easy4B modules into a PCB If only Easy3B and Easy4B modules are used in the system, in principle a shorter distance keeper can be applied. The general principle should be kept as described in the previous section 3.2.3. Typical distance keeper for Easy3B/4B modules Figure 13 Application Note...

  • Page 16: Press-In Process Parameter

    Assembly Instructions for the Easy Modules The press-in process Press-in process parameter This section deals with the press-in process parameter, which is useful for obtaining a highly reliable and mechanically stable PressFIT connection between the modules and the printed circuit boards. 3.3.1 Press-in behavior The monitoring of the press-in process is of great importance.

  • Page 17: Press-In Curve Example Of Standard Pressfit Pin Module

    Assembly Instructions for the Easy Modules The press-in process 3.3.1.1 Press-in curve example of standard PressFIT pin module Figure 14 displays a typical press-in curve of an Easy2B module, which is equipped with 33 standard PressFIT pins. A typical press-in curve of Easy2B with 33 standard PressFIT pins Figure 14 The first phase (1a) is the beginning of the PressFIT process.

  • Page 18: Press-In Curve Example Of High-Current Pressfit Pin Module

    Assembly Instructions for the Easy Modules The press-in process 3.3.1.2 Press-in curve example of high-current PressFIT pin module An Easy 4B module with 75 high-current PressFIT pins is chosen as an example to show press-in progress. Its typical press-in progression is displayed in Figure 15. The progression of this curve may differ from the Easy4B press-in curve with standard PressFIT pins.

  • Page 19: Press-In Force And Speed

    The maximum applied force should not exceed 8 kN for Easy3B, and 12 kN for Easy4B. The press-fitting speed should not be lower than 25 mm/min according to IEC 60352-5. Infineon recommends a press-in speed of about 100 mm/min. The typical press-in speed for automated assembly lines is up to 450 mm/min.

  • Page 20: Press-In Tools

    3.4.1 Press-in tools for Easy modules without pre-applied TIM Figure 16 shows these pressing tools for the two housing types, Easy 1B and Easy 2B. The pressing tools for Easy3B housing are shown in Figure 17. Each of the tools has two parts. The first part presses against the underside of the module, and the second part holds the PCB in place to be pressed against.

  • Page 21: Press-In Tools For Easy Modules With Thermal Interface Material (Tim)

    Drawings and 3D step models of the tool can be requested via the Infineon sales channels. The suitability for specific assembly processes and applications has to be tested and qualified by the customer.

  • Page 22: The Press-Out Process

    Assembly Instructions for the Easy Modules The press-out process The press-out process This chapter deals with the necessary press-out forces and tools for the Easy modules. PressFIT modules are removed with the appropriate tools as shown in Figure 20 and Figure 21. The PCB is placed with the PressFIT module on the device tray.

  • Page 23: Press-Out Forces

    Assembly Instructions for the Easy Modules The press-out process Press-out tools for Easy1B (left) and Easy2B (right) modules Figure 21 The drawing can be adjusted according to requirements, and the tools produced by a manufacturer of choice. Press-out forces To press a module out of a PCB, a force of approximately >40 N has to be applied for each pin in the module. The extruding forces depend mainly on the diameter of the hole in the PCB.

  • Page 24: Quality Of Pressfit Contacts

    2) Acceptance conditions for PCBs The PressFIT contact has been qualified in accordance with the usual standards for power semiconductor modules at Infineon. Figure 22 shows a small extract of the various tests. The extract shows that the conditions in the individual tests are to be regarded as considerably stricter than stated in the standards.
  • Page 25 Single-pin qualification according to IEC 60532-5 Module qualification according to IEC 60749 and 60068 Extract from qualification test Figure 22 Further details on the individual tests can be found in various publications, such as "Reliability of PressFIT connections" at www.infineon.com. Application Note Revision 1.0 2023-07-12...

  • Page 26: Soldering Process For Pressfit Pin And Solder Pin

    Assembly Instructions for the Easy Modules Soldering process for pressfit pin and solder pin Soldering process for pressfit pin and solder pin Both pressfit pin and solder pin are compatible with standard soft soldering process. The requirement for PBC is described in chapter 2.2 and chapter 2.3. Manual soldering, automatic soldering, wave soldering are common used soldering processes.

  • Page 27: Mounting A Pcb To The Module

    Assembly Instructions for the Easy Modules Mounting a PCB to the module Mounting a PCB to the module For mounting a PCB onto the module, additional screws can be used if desired. These screws will be tightened into the stand-offs of the module, to mechanically relieve the PressFIT contact between the module and the PCB.
  • Page 28 Assembly Instructions for the Easy Modules Mounting a PCB to the module Recommendation of the PCB through-hole diameter for self-tapping screws Figure 24 Note! If several modules are to be connected with spacers to the same PCB, it is not recommended to fasten the modules onto the PCB.

  • Page 29: Condition Of The Heat Sink For Module Assembly

    Assembly Instructions for the Easy Modules Condition of the heat sink for module assembly Condition of the heat sink for module assembly The power losses occurring in the module must be transferred into a heat sink to ensure that the module operates properly within the specified maximum temperature T of the semiconductors, and to achieve the vjop...

  • Page 30: Applying The Thermal Grease

    Assembly Instructions for the Easy Modules Applying the thermal grease Applying the thermal grease Due to the individual surface shape (e.g. roughness and flatness) of the heat sink and the module, the lower surface of the module and the surface of heat sink do not touch across the entire area. Therefore, a certain localized separation between the two components cannot be avoided.

  • Page 31: Assembling The Module On Heat Sink

    Assembly Instructions for the Easy Modules Assembling the module on heat sink Assembling the module on heat sink 10.1 Assembling Easy1B/2B module on heat sink The module is mounted onto the heat sink using M4 screws. It is also possible to use an additional flat washer. The heat sink has to be provided with threaded holes as shown in Figure 26.
  • Page 32 Assembly Instructions for the Easy Modules Assembling the module on heat sink a) Fastening the module by simultaneous a) Fastening the module while holding down screwing in and tightening of the screws. the module during screwing. Module fastening options Figure 27 Alternatively, one screw can be applied initially.

  • Page 33: Assembling Easy3B And Easy4B Module On Heat Sink

    10.2 Assembling Easy3B and Easy4B module on heat sink For the assembly of the Easy3B and Easy4B module to the heat sink, Infineon recommends the use of DIN M5 screws, in combination with a M5 washer. Position the module correctly to the heat sink, so that the mounting area of the module is congruent with the threaded holes in the heat sink.
  • Page 34 Assembly Instructions for the Easy Modules Assembling the module on heat sink Step 1 Step 2 Step 3 Module fastening steps Figure 30 The following values are recommended for the mounting process: Recommended parameters for heat sink mounting Table 5 Description Values Mounting screw...

  • Page 35: System Considerations Regarding Mechanical Robustness

    Assembly Instructions for the Easy Modules System considerations regarding mechanical robustness System considerations regarding mechanical robustness If the module is correctly mounted to the heat sink and to the PCB, the screw clamps will apply the necessary pressure. This pressure, together with the correct amount of thermal grease, will ensure a low thermal resistance and an optimal thermal flow between the module and the heat sink.

  • Page 36: Multi-Modules On A Pcb

    Assembly Instructions for the Easy Modules System considerations regarding mechanical robustness 11.3 Multi-modules on a PCB For assembling several modules on a PCB, the modules have to be pressed into the PCB at a certain distance, as explained in Chapter 3.2.3. The module height tolerance is then quasi compensated in this press-in process. In this case, the distance keepers from the PCB to heat sink can be close to the power modules.

  • Page 37: Module Assembly Sequence

    Assembly Instructions for the Easy Modules System considerations regarding mechanical robustness Please note: It is possible to press the module tighter to the PCB than the maximum 12.45 mm. This will increase the overlapping zone in the active press zone (contact area: pin to PCB). Please remember to lower the fixing elements of the cooling system (Figure 32b) accordingly if the modules are pressed tighter to the PCB! The value (H) of Figure 32b must not be higher than the module-to-PCB height of Figure 32a! A force of the PCB on the module in the direction of the cooling system is not critical, and is desired, as it improves the thermal...
  • Page 38 Assembly Instructions for the Easy Modules System considerations regarding mechanical robustness Mounting of the module onto the heat sink before soldering Figure 34 Application Note Revision 1.0 2023-07-12...

  • Page 39: Clearance And Creepage Distances

    Easy modules to enable a design based on the new requirements. These values can be used for first checking of fulfillment of application condition. When the module clearance or creepage distance is not sufficient for the corresponding application, please contact Infineon sales office for further technical support.

  • Page 40: Creepage Distance For High-Current Pressfit

    Assembly Instructions for the Easy Modules Clearance and creepage distances 12.1.2 Creepage distance for High-Current PressFIT In some modules in Easy3B/4B package, high current pressfit pin is applied. Due to geometry difference to standard pins, the creepage distance is slightly different. Figure 36 shows the creepage distance for Easy3B/4B with high current pin.
  • Page 41 Assembly Instructions for the Easy Modules Clearance and creepage distances Air path between clip and PCB for Easy1B and Easy2B packages Figure 37 The clearance distance between the screw and the PCB depends on the screw itself. For Easy1B/2B packages, when the PCB touch the module stand-off, the distance from heatsink to PCB is 6.6 mm with a hexagon socket head M4 screw according to DIN 912, a washer according to DIN 125, and the clamp illustrated in Figure 37.
  • Page 42 Assembly Instructions for the Easy -PressFIT Modules Revision History Revision History Document Date Description of changes revision Initial revision 18.08.2023 Application Note Revision 1.0 2023-07-12...
  • Page 43 Infineon Technologies hereby disclaims dangerous substances. For information on the types any and all warranties and liabilities of any kind in question please contact your nearest Infineon (including without limitation warranties of non- © 2023 Infineon Technologies AG. Technologies office.

This manual is also suitable for:

Easy 2bEasy 3bEasy 4b

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