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30
C
2: I/O
HAPTER
AND
Panel and LEDs
Matching Cable
3C17512 2-port
10GBASE-X (XFP)
Module
Specifications
A
M
PPLICATION
ODULES
Table 26 3C17511 module specifications
Item
Boot ROM
SDRAM
Physical dimensions (W x D)
Max power consumption
Number of ports
Connector
Rate
Figure 12 3C17511 module panel
The 3C17511 module has two port LEDs for the 10GE port on its panel.
Table 27 Port LEDs on the 3C17511 module
LED
Status
LINK
OFF
Green ON
ACT
OFF
Orange blinking
See Table 66 on page 46 for the XENPAK optical modules available to the 10GE
XENPAK/SC optical/electrical port on the 3C17511 module and their matching
cable types, which you can select as required.
This section provides specifications for the 2-port 10GBASE-X (XFP) module
(3C17512).
The 3C17512 modules provide two 10G
Table 28 3C17512 module specifications
Item
CPU
Boot ROM
SDRAM
Physical dimensions (W x D)
Max power consumption
Number of ports
Connector
Specification
512 KB
128 MB/256 MB
366.7 x 340 mm(14.4 x 13.4 in.)
45 W
One
XENPAK/SC
10 Gbps
Meaning
No link is present.
A link is present.
No packets are transmitted/received on the port.
Packets are being transmitted/received on the port.
BASE-X
Specification
MPC8245
512 KB
128 MB/256MB
366.7 x 340 mm (14.4 x 13.4 in.)
87 W
Two
XFP
XFP/LC ports.
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