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Cree LQ6 Series Soldering & Handling

High‑brightness led

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Cree
High‑Brightness LED
®
Soldering & Handling
Features
The purpose of this document is to provide customers and users with a clear understanding about the ways to use our LEDs
appropriately.
Description
Generally, LEDs can be used the same way as other general-purpose semiconductors. When using Cree LEDs, the following precautions
must be taken to protect the LED.
P2 AND P4 LEDS
1. Cleaning
Don't use unspecified chemical liquids to clean the LED; the chemical could harm the LED. When washing is necessary, please
wipe the LED with alcohol at normal room temperature and dry at normal room temperature for 15 minutes before use.
The influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the way the LEDs are mounted.
Ultrasonic cleaning should be pre‑qualified to ensure this will not cause damage to the LEDs.
2. Forming
When forming leads, the leads should be bent at a point at least 3 mm from the base of the package.
Don't form the leads during or after soldering. If forming is required, this must be done before soldering.
Avoid any bending stress to the LED package during leads forming.
When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LEDs.
3. Storage
The shelf life of the LEDs is one year at 20~30 °C and <60% RH. If the LEDs are unpacked, the LEDs need to be stored in a sealed
container with desiccant (silica gel).
The lead may be affected by environments which contain corrosive substances. Please avoid conditions which may cause
the LEDs to corrode, tarnish or discolor. The corrosion or discoloration may cause difficulty during soldering operations. It is
recommended that the LEDs be used as soon as possible.
4. Soldering
A minimal cathode pad area of 0.18 × 0.18 inches squared is recommended for P2 LEDs and 0.18 × 0.18 inches squared × 2 for
P4 LEDs.
Soldering LEDs at not less than 3 mm from the base of the package and below the tie‑bar is recommended.
Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
trademark and the Cree logo is a trademark of Cree, Inc.
SOLDERING & HANDLING
is a registered
®
USA Tel: +1.919.313.5300
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703

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Summary of Contents for Cree LQ6 Series

  • Page 1 A minimal cathode pad area of 0.18 × 0.18 inches squared is recommended for P2 LEDs and 0.18 × 0.18 inches squared × 2 for P4 LEDs. • Soldering LEDs at not less than 3 mm from the base of the package and below the tie‑bar is recommended. Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered Cree, Inc. ® trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 2 Cut the LED lead at normal room temperature. Lead cutting at high temperature may cause failure of the LEDs. Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 3: Heat Management

    Do not open the sealed bag before the products are ready to use. • The shelf life of LEDs stored in the original sealed bag at ≤40 ºC and ≤90% RH is 12 months. Baking is required if the shelf life has expired. Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc. ®...
  • Page 4                   Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 5 10 seconds max. Duration above 217 ºC 45 seconds max. Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc. ®...
  • Page 6 & LM2 series recommended solder pad design for heat dissipation: LM4 & LM2 series recommended solder pad design for heat dissipation: Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree 1.5 1.5 1.5 1.5...
  • Page 7 Metal area at 1, 2, 3 should not Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 8 6/13 6/13 6/13 6/13 Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc. ® 6/13...
  • Page 9 LT6 series recommended solder pad design for heat dissipation: 0.85 0.85 Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc. ®...
  • Page 10 LMU series recommended solder pad design for heat dissipation: Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 11 LX6 series recommended solder pad design for heat dissipation: 8/13 Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 12 LY6 series recommended solder pad design for heat dissipation: Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 13 1010 series recommended solder pad design for heat dissipation: Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 14: Assembly Notes

    LEDs to corrode tarnish or discolor. • The PCB should not be wrapped after soldering to allow natural cooling down to 40°. Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc. ®...
  • Page 15                          Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 16 Recommendation for product opening and storage: use scissors to cut the bag along the sealing mark in order to re-pack conveniently for product not to be used within the MSL level floor time. Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.
  • Page 17 Baking method  Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc. ®...
  • Page 18 7. Heat Management Heat management of SMD LEDs must be taken into consideration during the design stage of SMD LED applications. The current should be de‑rated appropriately by referring to the de‑rating curve included in each product specification. Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc. ®...
  • Page 19 The information in this document is subject to change without notice. Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree is a registered trademark and the Cree logo is a trademark of Cree, Inc.