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PICO-200 Table Saw
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I
M
NSTRUCTION
ANUAL
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com
Web: http://www.metallographic.com
The wafering blade bonding matrix can also significantly affect a blades cutting performance.
Metal pressed wafering blades require periodic dressing in order to maintain performance. A
common misconception is that the cutting rates for these blades decrease because the
diamond or abrasive is being "pulled-out" of the blade. The metal bond is primarily smearing
over the abrasive and "blinding" the cutting edge of the abrasive. With periodic dressing using
a ceramic abrasive encased in a relatively soft matrix, this smeared material is removed, and
the cutting rate restored. The below chart shows the effect of dressing a standard grit, low
concentration diamond blade for cutting a very hard material such as silicon nitride. Without
dressing the blade, the cut rate significantly decreases after each subsequent cut. After
dressing the blade, the sample once again cuts like a new blade. Note it is highly
recommended that a dressing fixture be used for conditioning or dressing the wafering blades
in order to reduce the risk of breaking or chipping the wafering blades. Blade dressing is also
accomplished at low speeds (<300 rpm) and at light loads (<100 grams).
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
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