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3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com
7.0 Wafering Sectioning
7.1 Introduction
Wafer cutting is used for sectioning very delicate sample or for sectioning a sample in a
very precise location. The PICO-200 allows long samples to be cut in a precise
location.
7.2 Wafering Blade Characteristics
In order to minimize cutting damage, precision wafer cutting most frequently uses
diamond wafering blades, however for some materials the use of cubic boron nitride
(CBN) is more efficient. In addition, optimal wafer cutting is accomplished by
maximizing the abrasive concentration and abrasive size, as well as choosing the most
appropriate cutting speed and load. Table III provides some general guidelines and
parameters for precision sectioning a variety of materials.
The particle size of fine diamond grit blades is 10-20 microns or approximately 600 grit.
For medium grit diamond wafering blades, the particle size is 60-70 micron or 220 grit.
For these types of wafering blades, the abrasive is mixed with a metal binder and then
pressed under high pressure. As will be discussed in the next section, periodic dressing
/ conditioning of the metal pressed blades is required for optimum cutting performance
of the blade.
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
PICO-200 Table Saw
Wafering Blade
Description
Fine grit
Medium grit
Coarse grit
High concentration
Low concentration
I
M
NSTRUCTION
ANUAL
Web: http://www.metallographic.com
Characteristic
10-20 micron (600 grit)
60-70 micron (220 grit)
120 micron (120 grit)
100%
50%
15
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