Wheel Front Control Panel The PICO-200 is a diamond wafering saw with a flat table capable of sectioning delicate specimens. The PICO-200 is a table saw variant of the PICO line of wafering saws. The specimen is secured to the table using vertical clamps while the blade is manually fed into the part.
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The manual feed wheel gives a nice feedback to the hand while moving the blade. Multi-Purpose Machine The PICO-200 saw can be used dry or wet. This allows the operator to determine the best way to cut a specimen. With the magnetic over-ride switch enabled the operator can manually feed parts if needed.
Web: http://www.metallographic.com 2.0 Unpacking, Shipping, and Installation 2.1 Unpacking The PICO-200 is shipped in a customized box. Remove any foam, paper, and accessories. Remove machine from the box using at least two people. 2.2 Shipping When moving machine, lift by the base.
Careful attention to this instruction manual and the recommended safety guidelines is essential for the safe operation of the PICO-200. Proper operator training is required for operation of the PICO-200 Any unauthorized mechanical and electrical change, as well as improper operation, voids all warranty claims.
3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com 4.0 Start-Up and Operation 4.1 General The PICO-200 is a blade feed wafering saw specifically designed for metallographic sample preparation. Magnetic Safety Over-Ride...
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4.3 Positioning Sample The PICO-200 has a large cutting table. Identify where the cut needs to take place and position the part on the table in front of the blade. Use the vertical clamps to hold the part down to the table. Ensure that the part will not move. Use your hand and attempt to move it, if it slips at then tightening or repositioning is required.
5.0 Maintenance 5.1 Introduction The PICO-200 wafering saw requires very minimal maintenance. However, to increase the life of the saw, it is suggested that the cutting fluid be changed regularly (weekly) using a cutting fluid containing an anti-corrosion additive (e.g DIACUT 2 cutting fluid).
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7.0 Wafering Sectioning 7.1 Introduction Wafer cutting is used for sectioning very delicate sample or for sectioning a sample in a very precise location. The PICO-200 allows long samples to be cut in a precise location. 7.2 Wafering Blade Characteristics...