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2.2 Technical Specifications
Processors
®
NXP i.MX6 Family, based on ARM
-
i.MX6S Solo - Single core up to 1GHz
-
i.MX6D Dual - Dual core up to 1.2GHz per core
-
i.MX6DL Dual Lite - Dual core up to 1GHz per core
-
i.MX6Q Quad - Quad core up to 1.2GHz per core
Memory
Up to 4GB DDR3 onboard (up to 2GB with i.MX6S)
Graphics
Dedicated 2D Hardware accelerator
Dedicated 3D Hardware accelerator, supports OpenGL
Dedicated Vector Graphics accelerator supports OpenVG
i.MX6Q)
Supports up to 3 independent displays with i.MX6D and i.MX6Q
Supports 2 independent displays with i.MX6DL and i.MX6S
Video Interface
1 x LVDS Dual Channel or 2 x LVDS Single Channel 18/24 bit interface
HDMI Interface
Video Input Port / Camera Connector
Video Resolution
LVDS, up to 1920x1200
HDMI, up to 1080p
Mass Storage
Onboard eMMC Disk, up to 32 GB *
SD/MMC/SDIO interface
1 x μSD Card Slot onboard
1 x External S-ATA Channel (only available with i.MX6D and i.MX6Q)
* Please consider that for HDD and Flash Disk manufacturers, 1GB = 10^9 Byte.
Some OS (like, for example, Windows) intends 1GB = 1024^3 byte, so global
capacity shown for Disk Properties will be less than expected. Please also consider
that a portion of disk capacity will be used by internal Flash Controller for Disk
management, so final capacity will be lower.
CORTEX-A9 processors
®
ES2.0 3D
™
(only i.MX6D and
USB
1 x USB OTG interface
4 x USB2.0 Host interfaces
Networking
Gigabit Ethernet interface
Audio
'
AC
97 Audio interface
PCI Express
1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported)
Serial Ports
2 x Serial ports (TTL interface)
CAN port interface
Other Interfaces
I2C bus
LPC Bus
SM Bus
Power Management Signals
Power supply voltage: +5V
± 5%
DC
Operating temperature:
0°C ÷ +60°C (commercial version) **
-40°C ÷ +85°C (industrial version) **
"
Dimensions: 70 x70 mm (2.76
x 2.76
Supported Operating Systems:
Linux
Android
Windows Embedded Compact 7
** Temperatures indicated are the maximum temperature that the
heatspreader / heatsink can reach in any of its parts. This means that it is
'
customer
s responsibility to use any passive cooling solution along with an
application-dependent cooling system, capable to ensure that the
heatspreader / heatsink temperature remains in the range above indicated.
Please also check paragraph 4.1
"
)
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