Instructions For Lgd System Integration; Integration Options; With Electronics Housing - Leister axetris LGD Compact Series Operating Instructions Manual

Laser gas detection oem module
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3 INSTRUCTIONS FOR LGD SYSTEM INTEGRATION

Please also check for relevant information in Chapter 2 regarding system setup for evaluation.

3.1 Integration options

To facilitate the integration of the LGD Compact-A sensor module the electronics housing as well as the
interface board can be removed and the module can be operated with the main board only. In this case, an
appropriate shielding and EMC conformity has to be fulfilled by the integrating Original Equipment Manufacturer
it.
Important: EMC conformity will only be granted for product executions with shielded cable versions together
with electronic box.
When integrating the LGD Compact-A without electronics housing and without the interface board, the
integrating Original Equipment Manufacturer has to ensure an appropriate shielding, in order to avoid signal
interferences resulting in decrease of measuring performance. The electrical connections regarding shielding
described in the following sections have to be implemented.

With electronics housing

The shielding of the electronics and the LGD Compact-A sensor module is realized as shown in
Figure 15 Shielding concept with electronics housing
Axetris AG
LGD Compact Operating & Integration Instructions; Rev. D
Figure 16 shielding via mounting screws of electronic housing
The shielding connection of the electronics boards and the sensor module is
done over the electronics housing.
Note that the metallic cover that incorporates the D-Sub connector J2 is partly
anodized. For proper shielding, it is therefore important that its mounting
screws are tightened in order to ensure a good electrical interconnection
between the sensor module and the electronics housing.
23/46

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