Deutschmann Automation GmbH & Co. KG
3.7
Handling (mounting the UNIGATE
Depending on the application and the expected shock- and vibration-conditions you can choose
from the following possibilities for the UNIGATE
•
Mounting on a socket in the carrier board. If necessary solder the UNIGATE
in the socket. Normally the IC can easily be pulled out after the soldering points have been
re-moved.
•
Make arrangements for two holes next to the socket in the layout. After the UNIGATE
plugged in the socket pull an isolated wire over the IC and solder it on the carrier board at the
specified holes.
•
Fasten the UNIGATE
•
Manual soldering directly on the carrier board.
•
Automatic soldering directly on the carrier board, whereas „selective" soldering is essential (no
wave soldering)
The advantage of the socketed variant is the easy download of Script- and Firmware-updates, if
the carrier board is not designed for it. Besides, that way the Fieldbus can be changed easily by
changing the UNIGATE
board. Another advantage is, that - normally - only a reflow soldering of the carrier board is
ne-cessary.
The advantage of the soldered variant is, that the installation height is lower and a higher shock-
and vibration-safety is provided.
30.9.20
®
IC With a wire or a tie wrap on the socket.
®
IC if the corresponding plug connectors are provided on the carrier
UNIGATE fieldbus gateway UNIGATE
®
IC on the carrier board)
®
IC's installation on the carrier board:
®
IC - EtherCAT
Hardware design
®
IC to 2 or 4 pins
®
IC was
®
V. 2.6
22
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