Huawei SE2900 Hardware Description page 75

HUAWEI SE2900 Session Border Controller
Hardware Description
Figure 1-53 Hardware structure
Table 1-47
Table 1-47 Components
No.
1
2
3
4
5
Issue 01 (2016-01-15)
describes the components of the VPUA0.
Compone
Quantity
nt
Solid-state 1
drive (SSD)
Baseboard 1
managemen
t controller
(BMC)
CPU 1
Heat sink 1
Cover 1
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description
The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
The BMC, a processing module independent of the
CPU, implements board management and provides
interfaces and buses, such as system interfaces,
General Purpose Input/Output (GPIO), serial ports,
and Inter-Integrated Circuit (I2C) bus.
The board uses one Intel
Ivy Bridge-EN CPU.
The heat sink is used to cool the CPU.
The metal cover is used to protect the components
1 Service Processing Device
® ®
Xeon full-power, 6-core
71