Huawei SE2900 Hardware Description page 68

HUAWEI SE2900 Session Border Controller
Hardware Description
No.
2
3
4
5
6
Figure 1-48
Figure 1-48 Panel
1. SFP+ ports
5. HLY indicator
Interfaces
Figure 1-49
Issue 01 (2016-01-15)
Compone
Quantity
nt
CPU 1
Heat sink 1
Cover 1
RDIMM 3
Solid-state 1
drive (SSD)
shows the board panel.
2. Optical port indicators
6. Ejector levers
shows the panel ports on the board.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description
provides system interfaces, General Purpose
Input/Output (GPIO), serial ports, and
Inter-Integrated Circuit (I2C) bus.
The board uses one Intel
Sandy Bridge-EP CPU.
The heat sink is used to cool the CPU.
The metal cover is used to protect the components
on the board and guide air flows.
Three 16 GB RDIMMs are used to provide 48 GB
memory.
NOTE
The RDIMMs are installed close to CPU0. The three
RDIMMs are installed in sockets J45, J46, and J7, as
shown in Figure 1-47.
The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
3. SFP ports
7. OFL indicator/button
Table 1-42 describes the panel ports.
1 Service Processing Device
® ®
Xeon full-power, 8-core
4. UID indicator
-
64