Huawei SE2900 Hardware Description page 60

HUAWEI SE2900 Session Border Controller
Hardware Description
No.
2
3
4
5
6
7
Figure 1-42
Figure 1-42 Panel
1. SFP+ ports
5. HLY indicator
Issue 01 (2016-01-15)
Compone
Quantity
nt
Encryption
1
and
decryption
daughter
board
CPU 2
Heat sink 1
Cover 1
RDIMM 6
Solid-state 1
drive (SSD)
shows the board panel.
2. Optical port indicators
6. Ejector levers
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Description
provides system interfaces, General Purpose
Input/Output (GPIO), serial ports, and
Inter-Integrated Circuit (I2C) bus.
This board performs data encryption and
decryption.
® ®
Intel Xeon full-power, 8-core Sandy Bridge-EP
CPU
The heat sink is used to cool CPUs. Two CPUs
share one heat sink.
The metal cover is used to protect the components
on the board and guide air flows.
Six 16 GB RDIMMs are used to provide 96 GB
memory.
NOTE
The RDIMMs are installed close to the CPUs. The six
RDIMMs are installed in sockets J45, J46, J47, J48, J7
and J8, as shown in Figure
The SSD stores the operating system (OS) and field
programmable gate array (FPGA) files.
3. SFP ports
7. OFL indicator/button
1 Service Processing Device
1-41.
4. UID indicator
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56