Huawei SE2900 Hardware Description page 72

HUAWEI SE2900 Session Border Controller
Hardware Description
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Hardware and Software Compatibility
Table 1-44
Table 1-44 Hardware and software compatibility
Board Model
SPUZ0
Technical Specifications
Table 1-45
Table 1-45 Technical specifications
Item
Mechanical
specifications
Electrical
specifications
Environmental
specifications
Issue 01 (2016-01-15)
The processing module forwards service data and implements data encryption and
decryption.
The EF module on the backplane side provides the Update , Base, and Fabric channels to
communicate with the switch modules.
The BMC module implements board management and interacts with the backplane
through the CAN bus.
The power module supplies power to the function modules of the board.
lists hardware and software compatibility of the SPUZ0.
lists the technical specifications of the SPUZ0.
Dimensions (H x
W x D)
Weight
Maximum
power
consumption
Typical power
consumption
Power supply
Temperature
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Copyright © Huawei Technologies Co., Ltd.
Spare Parts Model
SPUZ0
Specifications
45.2 mm x 205.0 mm x 531.0 mm (1.78 in. x 8.07
in. x 20.91 in.)
5.0 kg (11.03 lb)
190 W
175 W
Two -48 V DC power supplies (provided by the
backplane)
 Long-term operating temperature: 0°C to 45°C
(32°F to 113°F)
 Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)
 Storage temperature: -40°C to +70°C (-40°F to
+158°F)
 Temperature change rate: 15°C/h (27°F/h)
1 Service Processing Device
Compatibility Rule
Only a board of the same
model can be used to
replace the SPUZ0 board.
You do not need to
manually upgrade software.
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