Huawei SE2900 Hardware Description page 15

HUAWEI SE2900 Session Border Controller
Hardware Description
Hardware and Software Compatibility
Table 1-3
Table 1-3 Types of boards in the F8002 subrack
MXU Type
MXU
Technical Specifications
Table 1-4
Table 1-4 F8002 subrack technical specifications
Item
Mechanical
specificatio
ns
Power
supply
Environme
ntal
specificatio
ns
Issue 01 (2016-01-15)
lists the boards that can be used in F8002 subracks.
Compatible Service
Board Type


lists the technical specifications of the F8002 subrack.
Dimensions (H x W x D)
Weight of an empty
subrack
Weight of a fully loaded
subrack
Rated input voltage
Operating voltage
Total power inputs
Rated input current
Power rating
Temperature
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Copyright © Huawei Technologies Co., Ltd.
SPU
VPU
Specifications
130.5 mm x 442.0 mm x 675.0 mm (5.14 in. x
17.40 in. x 26.57 in.)
20.8 kg (45.86 lb)
NOTE
An empty subrack is equipped with two fan trays
and two PEMs.
47.8 kg (105.38 lb)
NOTE
A fully loaded subrack is equipped with two fan
trays, two PEMs, two MXUA0s, and four SPUA0s.
-48 V DC to -60 V DC
-40 V DC to -72 V DC
Two
60 A/power input
2400 W (The rated power of each PEM is
2400 W)
NOTE
The subrack is configured with two PEMs in 1+1
redundancy mode.
 Long-term operating temperature: 0°C to
45°C (32°F to 113°F)

Short-term operating temperature: -5°C to
+55°C (23°F to 131°F)

Storage temperature: -40°C to +70°C
(-40°F to +158°F)
1 Service Processing Device
Compatibility Rule
-
11